(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 (cid:7)(cid:8)(cid:9)(cid:10)(cid:11)(cid:12)(cid:13) (cid:14)(cid:8)(cid:9)(cid:15)(cid:3)(cid:16)(cid:3)(cid:13) (cid:2)(cid:1)(cid:12)(cid:1) (cid:1)(cid:17)(cid:18)(cid:19)(cid:11)(cid:3)(cid:11)(cid:12)(cid:11)(cid:20)(cid:21) (cid:3)(cid:22)(cid:3)(cid:12)(cid:23)(cid:24) (cid:25)(cid:11)(cid:12)(cid:26) (cid:1)(cid:21)(cid:1)(cid:27)(cid:20)(cid:28)(cid:9)(cid:12)(cid:20)(cid:9)(cid:2)(cid:11)(cid:28)(cid:11)(cid:12)(cid:1)(cid:27) (cid:17)(cid:20)(cid:21)(cid:29)(cid:23)(cid:30)(cid:12)(cid:23)(cid:30)(cid:13) (cid:24)(cid:19)(cid:31)(cid:13) (cid:16)(cid:28)(cid:1)(cid:13) (cid:1)(cid:21)(cid:2) (cid:30)(cid:23)!(cid:23)(cid:30)(cid:23)(cid:21)(cid:17)(cid:23) FEATURES DESCRIPTION (cid:1) PGA Gains: 1, 2, 4, 5, 8, 10, 16, 20 V/V The ADS7870 (US patents 6140872, 6060874) is a (cid:1) Programmable Input (Up to 4-Channel complete low-power data acquisition system on a single Differential/Up to 8-Channel Single-Ended or chip. It consists of a 4-channel differential/8-channel Some Combination) single-ended multiplexer, precision programmable gain (cid:1) amplifier, 12-bit successive approximation analog-to- 1.15-V, 2.048-V, or 2.5-V Internal Reference digital (A/D) converter, and a precision voltage reference. (cid:1) SPI/DSP Compatible Serial Interface (≤20MHz) The programmable-gain amplifier provides high input (cid:1) impedance, excellent gain accuracy, good common-mode Throughput Rate: 52 kSamples/sec rejection, and low noise. (cid:1) Error Overload Indicator (cid:1) For many low-level signals, no external amplification or Programmable Output 2s Complement/Binary impedance buffering is needed between the signal source (cid:1) 2.7-V to 5.5-V Single Supply Operation and the A/D input. (cid:1) 4-Bit Digital I/O Via Serial Interface The offset voltage of the PGA is auto-zeroed. Gains of 1, (cid:1) Pin-Compatible With ADS7871 2, 4, 5, 8, 10, 16, and 20 V/V allow signals as low as 125 (cid:1) SSOP-28 Package mV to produce full-scale digital outputs. The ADS7870 contains an internal reference, which is APPLICATIONS trimmed for high initial accuracy and stability vs temperature. Drift is typically 10 ppm/°C. An external (cid:1) Portable Battery-Powered Systems reference can be used in situations where multiple (cid:1) Low-Power Instrumentation ADS7870s share a common reference. (cid:1) Low-Power Control Systems The serial interface allows the use of SPI, QSPI, (cid:1) Smart Sensor Applications Microwire, and 8051-family protocols, without glue logic. BUFIN BUFOUT/REFIN VREF REF CCLK Oscillator LN0 OSC ENABLE LN1 LN2 LN3 + 12-BIT BUSY LN4 MUX P_GA A/D CONVERT LN5 RESET LN6 LN7 RISE/FALL CS Serial SCLK I/O0 I/O1 Digital Registers Interface DIN I/O2 I/O DOUT I/O3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. QSPI and SPI are trademarks of Motorola, Inc. Microwire is a trademark of National Semiconductor Corporation. All other trademarks are the property of their respective owners. (cid:16)(cid:30)(cid:20)(cid:2)(cid:19)(cid:17)(cid:12)(cid:11)(cid:20)(cid:21) (cid:2)(cid:1)(cid:12)(cid:1) "#$%&’()"%# "* +,&&-#) (* %$ .,/0"+()"%# 1()-2 (cid:16)&%1,+)* Copyright  1999−2005, Texas Instruments Incorporated +%#$%&’ )% *.-+"$"+()"%#* .-& )3- )-&’* %$ (cid:12)-4(* (cid:11)#*)&,’-#)* *)(#1(&1 5(&&(#)62 (cid:16)&%1,+)"%# .&%+-**"#7 1%-* #%) #-+-**(&"06 "#+0,1- )-*)"#7 %$ (00 .(&(’-)-&*2

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 ORDERING INFORMATION(1) SPECIFIED PACKAGE PACKAGE ORDERING TRANSPORT MEDIA, PRODUCT PACKAGE-LEAD TEMPERATURE DESIGNATOR MARKING NUMBER QUANTITY RANGE ADS7870 ADS7870IDB Rails, 48 AADDSS77887700 SSSSOOPP--2288 SSuurrffaaccee MMoouunntt DDBB −−4400°°CC ttoo ++8855°°CC ADS7870 ADS7870IDBR Tape and Reel, 1000 (1)For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Supply voltage, VDD 5.5 V Momentary 100 mA IInnppuutt ccuurrrreenntt AAnnaalloogg iinnppuuttss Continuous 10 mA Input voltage VDD + 0.5 V to GND − 0.5 V Operating free-air temperature range, TA −40°C to 85°C Storage temperature range, TSTG −65°C to 150°C Junction temperature (TJ max) 150°C Lead temperature, soldering (10 sec) 300°C (1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 ELECTRICAL CHARACTERISTICS For the Total System (1), −40°C ≤ TA ≤ 85°C, VDD = 5 V, BUFIN = 2.5 V (using external reference), 2.5-MHz CCLK and 2.5-MHz SCLK (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Analog Input Input voltage (LNx inputs) Linear operation −0.2 VDD + 0.2 V Input capacitance (2) 4 to 9.7 pF Common mode 6 IInnppuutt iimmppeeddaannccee ((22)) MMΩΩ Differential 7 Channel-to-channel crosstalk VI = 2 VPP, 60 Hz (3) 100 dB Maximum leakage current 100 pA Static Accuracy Resolution 12 Bits No missing codes G = 1 to 20 V/V 12 Bits Integral linearity G = 1 to 20 V/V −2.5 ±2 2.5 LSB Differential linearity G = 1 to 20 V/V ±0.5 LSB Offset error G = 1 to 20 V/V −6 ±1 6 LSB RRaattiioommeettrriicc ccoonnffiigguurraattiioonn oorr G = 1 to 10 V/V −0.2 0.2 %FSR external reference ((44)) G = 16 and 20 V/V −0.25 0.25 %FSR FFuullll--ssccaallee ggaaiinn eerrrroorr G = 1 to 10 V/V −0.35 0.35 %FSR IInntteerrnnaall rreeffeerreennccee G = 16 and 20 V/V −0.4 0.4 %FSR DC common-mode rejection ratio, RTI VI = −0.2 V to 5.2 V, 92 dB G = 20 V/V Power supply rejection ratio, RTI VDD = 5 V ±10%, G = 20 V/V 86 dB Dynamic Characteristics Continuous mode One channel 52 TThhrroouugghhppuutt rraattee kkssaammppllee//ss Address mode Different channels 52 External clock, CCLK (5) 0.1 20 MHz Internal oscillator frequency 2.5 MHz Serial interface clock, SCLK 20 MHz Data setup time 10 ns Data hold time 10 ns Digital Inputs Low-level input voltage, VIL 0.8 V VDD ≤ 3.6 V 2 V HHiigghh--lleevveell iinnppuutt vvoollttaaggee,, VVIIHH LLooggiicc lleevveellss VDD >3.6 V 3 V Low-level input current, IIL 1 µAA High-level input current, IIH 1 (1)The specifications for the total system are overall analog input to digital output specifications. The specifications for internal functions indicate the performance of the individual functions in the ADS7870. (2)The ADS7870 uses switched capacitor techniques for the programmable gain amplifier and A/D converter. A characteristic of such circuits is that the input capacitance at any selected LNx pin changes during the conversion cycle. (3)One channel on with its inputs grounded. All other channels off with sinewave voltage applied to their inputs. (4)Ratiometric configuration exists when the input source is configured such that changes in the reference cause corresponding changes in the input voltage. The same accuracy applies when a perfect external reference is used. (5)The CCLK is divided by the DF value specified by the contents of register 3, A/D Control register, bits D0 and D1 to produce DCLK. The maximum value of DCLK is 2.5 MHz. 3

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 ELECTRICAL CHARACTERISTICS For the Total System (1), −40°C ≤ TA ≤ 85°C, VDD = 5 V, BUFIN = 2.5 V (using external reference), 2.5-MHz CCLK and 2.5-MHz SCLK (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Digital Outputs Data coding Binary 2s complement ISINK = 5 mA 0.4 LLooww--lleevveell oouuttppuutt vvoollttaaggee,, VVOOLL VV ISINK = 16 mA 0.8 LLooggiicc lleevveellss ISOURCE = 0.5 mA VDD − 0.4 HHiigghh--lleevveell oouuttppuutt vvoollttaaggee,, VVOOHH VV ISOURCE = 5 mA 4.6 Leakage current Hi-Z state, VO = 0 V to VDD 1 µA Output capacitance 5 pF Voltage Reference BBaannddggaapp vvoollttaaggee VREF = 2.048 V, 2.5 V Pin 26 used as output, −0.25 ±0.05 0.25 %FSR UUssee iinntteerrnnaall OOSSCC oorr eexxtteerrnnaall reference VREF = 1.15 V CCLK as conversion clock 1.15 V Output drive ±0.6 µA Reference Buffer Input voltage, BUFIN 0.9 VDD − 0.2 V Input impedance, BUFIN At pin 27 1000||3 GΩ||pF Input offset −10 ±1 10 mV OOuuttppuutt vvoollttaaggee aaccccuurraaccyy vvss tteemmppeerraattuurree,, PPiinn 2288 uusseedd aass oouuttppuutt,, −0.25 ±0.05 0.25 %FSR BUFOUT/REFIN ((22)) ((33)) VREF = 2.048 V and 2.5 V 10 50 ppm/°C Output drive, BUFOUT/REFIN 20 mA Power Supply Requirements Supply voltage 2.7 5.5 V REF and BUF on, Internal os- 1-kHz Sample rate 0.45 mA cillator on REF and BUF on, External Power supply current ((22)) 50-kHz Sample rate 1.2 1.7 mA CCLK REF, BUF, Internal Power down 1 µA oscillator off REF and BUF on, Internal 1-kHz Sample rate 2.25 mW oscillator on Power dissipation ((22)) REF and BUF on, External 50-kHz Sample rate 6 8.5 mW CCLK Power down REF and BUF off 5 µW Temperature Range Operating free-air −40 85 °C Storage range −65 150 °C Thermal resistance, (cid:1)JA 65 °C/W (1)The specifications for the total system are overall analog input to digital output specifications. The specifications for internal functions indicate the performance of the individual functions in the ADS7870. (2)REF and BUF contribute 190 µA and 150 µA (950 µW and 750 µW) respectively. At initial power up the default condition for both REF and BUF functions is power off. They can be turned on under software control by writing a 1 to D3 and D2 of register 7, REF/OSCILLATOR CONTROL register. (3)For VDD < 3 V, VREF = 2.5 V is not usable. 4

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 ELECTRICAL CHARACTERISTICS For Internal Functions (1), −40°C ≤ TA ≤ 85°C, VDD = 5 V, BUFIN = 2.5 V (using external reference), 2.5-MHz CCLK and 2.5-MHz SCLK (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Multiplexer On resistance 100 Ω Off resistance 1 GΩ On channel = 5.2 V, Off channel = 0 V VLNx = 5.2 V 100 pA OOffff cchhaannnneell lleeaakkaaggee current On channel = 0 V, 100 pA Off channel = 5.2 V On channel = 5.2 V, 100 pA Off channel = 0 V OOnn cchhaannnneell lleeaakkaaggee current On channel = 0 V, 100 pA Off channel = 5.2 V PGA Amplifier Input capacitance (2) 4 to 9.7 pF Common mode 6 MΩ IInnppuutt iimmppeeddaannccee ((22)) Differential 7 MΩ Offset voltage 100 µV Small signal bandwidth 5/Gain MHz G = 1 0.3 µs SSeettttlliinngg ttiimmee G = 20 6.4 µs Analog-To-Digital Converter DC Characteristics Resolution 12 Bits Integral linearity error ±0.5 LSB Differential linearity error ±0.5 LSB No missing codes 12 Bits Offset error REFIN = 2.5 V ±0.5 LSB Full-scale (gain) error ±0.02 % Common mode rejection, RTI of A/D 80 dB Power supply rejection, RTI of ADS7870 External reference, VDD = 5 V ±10% 60 dB PGA Plus A/D Converter Sampling Dynamics fCCLK = 2.5 MHz, DF = 1 Throughput rate 48 CCLK cycles 52 kHz Conversion time 12 CCLK cycles 4.8 µs Acquisition time 28 CCLK cycles 9.6 µs Auto zero time 8 CCLK cycles 3.2 µs Aperture delay 36 CCLK cycles 12.8 µs Small signal bandwidth 5 MHz Step response 1 Complete Conversion Cycle (1)The specifications for the total system are overall analog input to digital output specifications. The specifications for internal functions indicate the performance of the individual functions in the ADS7870. (2)The ADS7870 uses switched capacitor techniques for the programmable gain amplifier and A/D converter. A characteristic of such circuits is that the input capacitance at any selected LNx pin changes during the conversion cycle. 5

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 PIN ASSIGNMENTS SSOP-28 PACKAGE (TOP VIEW) LN0 1 28 BUFOUT/REFIN LN1 2 27 BUFIN LN2 3 26 VREF LN3 4 25 GND LN4 5 24 VDD LN5 6 23 CS LN6 7 22 DOUT LN7 8 21 DIN RESET 9 20 SCLK RISE/FALL 10 19 CCLK I/O0 11 18 OSC ENABLE I/O1 12 17 BUSY I/O2 13 16 CONVERT I/O3 14 15 NC Terminal Functions TERMINAL NO. NAME I/O DESCRIPTION 1−8 LN0−LN7 AI MUX input lines 0−7 9 RESET DI Master reset, zeros all registers 10 RISE/FALL DI Sets the active edge for SCLK. 0 sets SCLK active on falling edge. 1 sets SCLK active on rising edge. 11−14 I/O0−I/O3 DIO Digital input or output signal 15 NC − No connection or internal function. It is recommended that this pin be tied to ground. 16 CONVERT DI 0 to 1 transition starts a conversion cycle. 17 BUSY DO 1 indicates converter is busy 18 OSC ENABLE DI 0 sets CCLK as an input, 1 sets CCLK as an output and turns the oscillator on. 19 CCLK DIO If OSC ENABLE = 1, then the internal oscillator is output to this pin. If OSC ENABLE = 0, then this is the input pin for an external conversion clock. 20 SCLK DI Serial data input/output transfer clock. Active edge set by the RISE/FALL pin. If RISE/FALL is low, SCLK is active on the falling edge. 21 DIN DIO Serial data input. In the 3-wire mode, this pin is used for serial data input. In the 2-wire mode, serial data output appears on this pin as well as the DOUT pin. 22 DOUT DO Serial data output. This pin is driven when CS is low and is high impedance when CS is high. This pin behaves the same in both 3-wire and 2-wire modes. 23 CS DI Chip select. When CS is low, the serial interface is enabled. When CS is high, the serial interface is disabled, the DOUT pin is high impedance, and the DIN pin is an input. The CS pin only affects the operation of the serial interface. It does not directly enable/disable the operation of the signal conversion process. 24 VDD − Power supply voltage, 2.7 V to 5.5 V 25 GND − Power supply ground 26 VREF AO 2.048-/2.5-V on-chip voltage reference 27 BUFIN AI Input to reference buffer amplifier 28 BUFOUT/REFIN AIO Output from reference buffer amplifier and reference input to ADC 6

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 TYPICAL PERFORMANCE CURVES† GAIN ERROR OUTPUT OFFSET ERROR vs vs FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE 15 10 Gain = 20 8 10 Gain = 8 B Gain = 20 LS 6 Gain = 1 B − ror − LS 5 Gain = 1 Gain = 8 et Error 4 n Er Offs 2 Gai 0 ut − utp G O 0 E − −5 O E −2 −10 −4 −60 −40 −20 0 20 40 60 80 100 120 140 −60 −40 −20 0 20 40 60 80 100 120 140 TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C Figure 1 Figure 2 VOLTAGE REFERENCE ERROR INTERNAL OSCILLATOR FREQUENCY vs vs FREE-AIR TEMPERATURE FREE-AIR TEMPERATURE 0.4 2.55 3 Sigma 3 Sigma 0.2 2.50 z H M r − % 0 VREF cy − 2.45 Avg o n Err ue nce −0.2 −3 Sigma Freq 2.40 e Refere −0.4 scillator 2.35 −3 Sigma g O Volta −0.6 rnal 2.30 e nt −0.8 I 2.25 VREF = 2.048 V or 2.5 V −1 2.20 −60 −40 −20 0 20 40 60 80 100 120 140 −60 −40 −20 0 20 40 60 80 100 120 140 TA − Free-Air Temperature − °C TA − Free-Air Temperature − °C Figure 3 Figure 4 †At TA= 25°C, VDD = 5 V, VREF = 2.5 V connected to BUFIN (using internal reference), 2.5 MHz CCLK, and 2.5 MHz SCLK (unless otherwise noted) 7

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 OUTPUT OFFSET ERROR OUTPUT OFFSET ERROR vs vs COMMON-MODE VOLTAGE POWER SUPPLY VOLTAGE 2 8 50 Ksps, CCLK = 2.5 MHz, 1.5 7 Gain = 20 VREF = 2.048 V Gain = 10 B 1 B 6 S Gain = 1 S Error − L 0.5 Gain = 10 Error − L 45 Output Offset −0−.015 Gain = 20 Output Offset 32 Gain = 1 − O 1 LSB = − 1 E −72 dB for Gain = 1, EO 4 LSB = −1.5 −98 dB for Gain = 20 86 dB for Gain = 20, 0 60 dB for Gain = 1 −2 −1 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 2 2.5 3 3.5 4 4.5 5 5.5 6 Common-Mode Voltage − V VDD − Supply Voltage − V Figure 5 Figure 6 QUIESCENT CURRENT PEAK-TO-PEAK OUTPUT NOISE vs vs SAMPLING RATE GAIN 1.4 6 VREF and Buffer ON, Oscillator OFF Serial Data Clocked During the 48 Clock 1.2 Count Conversion Cycle, CCLK = SCLK 5 B S L − mA 1 VDD = 5 V se − 4 nt Noi rre 0.8 ut nt Cu 0.6 VDD = 3 V Outp 3 Quiesce 0.4 o-Peak 2 k-t a e P 1 0.2 0 0 1 10 100 1 2 4 5 8 10 16 20 Sampling Rate − ksps Gain Figure 7 Figure 8 8

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 INPUT BIAS CURRENT vs INPUT VOLTAGE 0.6 Input Impedance Inversely 0.5 Proportional to Sampling Rate A 0.4 µ nt − 0.3 VDD = 5 V e urr 0.2 VDD = 3 V C as 0.1 Bi put 0 n − I −0.1 B II −0.2 −0.3 −0.4 0 1 2 3 4 5 6 VI − Input Voltage − V Figure 9 INTEGRAL LINEARITY ERROR 2 1.5 1 B 0.5 S L − 0 r o r −0.5 r E −1 −1.5 −2 0 1024 2048 3072 4096 Output Code Figure 10 DIFFERENTIAL LINEARITY ERROR 2 1.5 B 1 S L − 0.5 r o r Er 0 −0.5 −1 0 1024 2048 3072 4096 Output Code Figure 11 9

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 OVERVIEW The ADS7870 is a complete data acquisition device composed of an input analog multiplexer (MUX), a programmable gain amplifier (PGA) and an analog-to-digital (A/D) converter. Four lines of digital input/output (I/O) are also provided. Additional circuitry provides support functions including conversion clock, voltage reference, and serial interface for control and data retrieval. Control and configuration of the ADS7870 are accomplished by command bytes written to internal registers through the serial port. Command register device control includes MUX channel selection, PGA gain, A/D start conversion command, and I/O line control. Command register configuration control includes internal voltage reference setting and oscillator control. Operational modes and selected functions can be activated by digital inputs at corresponding pins. Pin settable configuration options include SCLK active-edge selection, master reset, and internal oscillator clock enable. The ADS7870 has eight analog signal input pins, LN0 through LN7. These pins are connected to a network of analog switches (the MUX). The inputs can be configured as 8 single-ended or 4 differential inputs, or some combination. The four general-purpose digital I/O pins (I/O3 through I/O0) can be made to function individually as either digital inputs or digital outputs. These pins give the user access to four digital I/O pins through the serial interface without having to run additional wires to the host controller. The programmable gain amplifier (PGA) provides gains of 1, 2, 4, 5, 8, 10, 16, and 20 V/V. The 12-bit A/D converter in the ADS7870 is a successive approximation type. The default output of the converter is 2s complement format and can be read in a variety of ways depending on the program configuration. The ADS7870 internal voltage reference can be software configured for output voltages of 1.15 V, 2.048 V, or 2.5V. The reference circuit is trimmed for high initial accuracy and low temperature drift. A separate buffer amplifier is provided to buffer the high impedance VREF output. The voltage reference, PGA, and A/D converter use the conversion clock (CCLK) and signals derived from it. CCLK can be either an input or output signal. The ADS7870 can divide the CCLK signal by a constant before it is applied to the A/D converter and PGA. This allows a higher frequency system clock to be used to control the A/D converter operation. Division factors (DF) of 1, 2, 4, and 8 are available. The signal that is actually applied to the PGA and A/D converter is DCLK, where DCLK = CCLK/DF. The ADS7870 is designed so that its serial interface can be conveniently used with a wide variety of microcontrollers. It has four conventional serial interface pins: SCLK (serial data clock), DOUT (serial data out), DIN (serial data in, which may be set bidirectional in some applications), and CS (chip select function). The ADS7870 has ten internal user accessible registers which are used in normal operation to configure and control the device (summarized in Figure 15). 10

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 FUNCTIONAL DESCRIPTION Multiplexer The ADS7870 has eight analog signal input pins, LN0 through LN7. These pins are connected to a network of analog switches (the MUX block in the block diagram). The switches are controlled by four bits in the Gain/Mux register. LN0 through LN7 can be configured as 8 single-ended inputs or 4 differential inputs or some other combination. Some MUX combination examples are shown in Figure 20. The differential polarity of the input pins can be changed with the M2 bit in the MUX address. This feature allows reversing the polarity of the conversion result without having to physically reverse the input connections to the ADS7870. For linear operation, the input signal at any of the LN0 through LN7 pins can range between GND – 0.2 V and V + 0.2 V. The polarity of the differential signal can be changed through commands written to the Gain/Mux DD register, but each line must remain within the linear input common mode voltage range. Inputs LN0 through LN7 have ESD protection circuitry as the first active elements on the chip. These contain protection diodes connected to VDD and GND that remain reverse biased under normal operation. If input voltages are expected beyond the absolute maximum voltage range, it is necessary to add resistance in series with the input to limit the current to 10 mA or less. Conversion Clock The conversion clock (CCLK) and signals derived from it are used by the voltage reference, the PGA, and the A/D converter. The CCLK pin can be made either an input or an output. For example, one ADS7870 can be made to be the conversion clock master (CCLK is an output), while the others are slaved to it with their CCLK pins all being inputs (by default). This can reduce A/D conversion errors caused by multiple clocks and other systems noise. When the OSC ENABLE pin is low or zero, the CCLK pin is an input and the ADS7870 relies on an applied external clock for the conversion process. When OSC ENABLE is high or if the OSCE bit D4 in register 7 is set to a one, the internal oscillator and an internal buffer is enabled, making pin 19 an output. Either way the CCLK is sensed internally at the pin so all ADS7870s see the same clock delays. Capacitive loading on the CCLK pin can draw significant current compared with the supply current to the ADS7870 (I = f × V × C ). LOAD CCLK DD LOAD The internal reference requires a continuous clock and may be supplied by the internal oscillator independently of the system clock driving the CCLK pin. Setting OSCR (bit D5 in register 7) and REFE (bit D3 in register 7) both to one accomplishes this. Figure 12 illustrates all of these relationships. The ADS7870 utilizes the power saving technique of turning on and off the biasing for the PGA and A/D as needed. This does not apply to the oscillator, reference, and buffer, these run continuously when enabled. The buffer output is high impedance when disabled, so for a low power data logging application the filter capacitor is not discharged when the buffer is turned off, and does not require as much settling time when turned on. The serial interface clock is independent of the conversion clock and can run faster or slower. If it is desirable to use a faster system clock than the 2.5-MHz nominal rate that the ADS7870 uses then this clock may be divided to a slower rate ( 1/2, 1/4, 1/8) by setting the appropriate bits in register 3. This clock divider applies equally to an external as well as internal clock to create the internal DCLK for the PGA and A/D conversion cycle. The ADS7870 has both maximum and minimum DCLK frequency constraints (DCLK = CCLK/DF). The maximum DCLK is 2.5 MHz. The minimum DCLK frequency applied to the PGA, reference, and A/D is 100 kHz. 11

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Pin 26 Pin 27 Pin 28 VREF BUFIN BUFOUT/REFIN Internal Oscillator REF BUF (2.5 MHz) Enabled by Enabled by To ADC Reg.7 D4, OSCE or Reg.7 D2, Reg.7D5, OSCR or BUFE Pin 18, OSC Enable OSC CLK Reg.7 D5 OSCR = 1 Internal Enabled by Pin 18 Reference 1/4 Pin 18 OSC Enable OSC Reg.7 D4, OSCE Enabled by ENABLE Reg.7D3, Reg.7 D5 1/N Divider REFE OSCR = 0 DCLK Pin 19 N Set by CCLK Reg.3 D[1:0], CFD[1:0] Internal Control Logic ADS7870 Figure 12. Block Diagram With Internal and External Clocks and References Voltage Reference and Buffer Amplifier The ADS7870 uses a patented switched capacitor implementation of a band-gap reference. The circuit has curvature correction for drift and can be software configured for output voltages of 1.15 V, 2.048 V, or 2.5 V (default). The internal reference output (VREF) is not designed to drive a typical load; a separate buffer amplifier must be used to supply any load current. The internal reference buffer (REFBUF) can source many tens of milliamps to quickly charge a filter capacitor tied to its output, but it can only typically sink 200 µA. If there is any significant noise on the REFIN pin, then a resistor to ground (≥250 Ω) would improve the buffers ability to recover from a positive going noise spike. This would, of course, be at the expense of power dissipation. The temperature compensation of the onboard reference is adjusted with the reference buffer in the circuit. Performance is specified in this configuration. Programmable Gain Amplifier The programmable gain amplifier (PGA) provides gains of 1, 2, 4, 5, 8, 10, 16, and 20 V/V. The PGA is a single supply, rail-to-rail input, auto-zeroed, capacitor based instrumentation amplifier. PGA gain is set by bits G2 through G0 of register 4. The ability to detect when the PGA outputs are driven to clipping, or nonlinear operation, is provided by the least significant bit of the output data (register 0) being set to one. This result is the logical OR of fault detecting comparators within the ADS7870 monitoring the outputs of the PGA. The inputs are also monitored, for problems, often due to ac common mode or low supply operation and ORed to this OVL bit. Register 2 can be read to determine what fault conditions existed during the conversion. The OVL bit also facilitates a quick test to allow for an auto-ranging application, indicating to the system controller it should try reducing the PGA gain. 12

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 A/D Converter The 12-bit A/D converter in the ADS7870 is a successive approximation type. The output of the converter is 2s complement format and can be read through the serial interface MSB first or LSB first. A plot of output codes vs input voltage is shown in Figure 13. With the input multiplexer configured for differential input, the A/D transfer function is: (cid:1)V V (cid:1)1LSB (cid:1)2048(cid:2)Code(cid:2)2047for REF (cid:2)V (cid:2) REF G IN G (1) With the input multiplexer configured for single-ended inputs, the A/D transfer function is: V (cid:1)1LSB 0(cid:2)Code(cid:2)2047for 0 (cid:2)V (cid:2) REF IN G (2) Positive Full Scale Transition 0111 1111 1111 (2047) 0111 1111 1110 (2046) Output Code is 2s Complement E 0000 0000 0010 (2) D CO –VREF 0000 0000 0001 (1) Zero Transition T 0000 0000 0000 (0) PU 1111 1111 1111 (−1) +VREF T U 1111 1111 1110 (−2) O 1000 0000 0001 (−8191) 1000 0000 0001 (−8192) Negative Full Scale Transition INPUT VOLTAGE Figure 13. Output Codes Versus Input Voltage 13

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Conversion Cycle A conversion cycle requires 48 DCLKs, where DCLK = CCLK/DF, the divided−down clock. Operation of the PGA requires 36 DCLKs: capture the input signal, auto-zero the PGA, level-shift and amplify the input signal. The period of this cycle makes certain the settling time is sufficient for gain = 20 and (source impedance of 2 kΩ or less) even if the gain is less than 20. The SAR converter takes the last 12 DCLKs. For maximum sampling rate the input command and output data must be communicated during this cycle, although this is not recommended for best performance. During the conversion cycle the internal capacitive load at the selected MUX input changes between 6 pF and 9.7 pF. When the ADS7870 is not converting, the MUX inputs have a nominal 4-pF load capacitance. The source impedance of the input causes the voltage to vary on the DCLK transitions as the internal capacitors are switched in and out. A 10-nF to 100-nF capacitor across the differential inputs helps filter these glitches and act as an antialias filter in combination with the source impedance. Source impedance greater than 2 kΩ requires longer settling times and so CCLK should be reduced accordingly. For minimum power dissipation, the bias needed for each function is turned on, allowed to settle, and run only for the duration required for each conversion. Low rate data logging applications can capitalize on this by utilizing the internal oscillator as needed rather than running a slow system clock. Starting an A/D Conversion Cycle There are four ways to cause the ADS7870 to perform a conversion: (cid:1) 1. Send a direct mode instruction. 2. Write to register 4 with the CNV bit = 1 The next conversion queues up, waiting for the current conversion to complete 3. Write to register 5 with the CNV bit = 1 4. Assert the CONVERT pin (logic high) —A new conversion cycle starts at the second active edge of CCLK. Serial Interface The ADS7870 communicates with microprocessors and other external circuitry through a digital serial port interface. It is compatible with a wide variety of popular microcontrollers and digital signal processors (DSP). These include TI’s TMS320, MSC1210, and MSP430 product families. Other vendors products such as Motorola 68HC11, Intel 80C51, and MicroChip PIC Series are also supported. The serial interface consists of four primary pins, SCLK (serial bit clock), DIN (serial data input), DOUT (serial data output) and CS (chip select). SCLK synchronizes the data transfer with each bit being transmitted on the falling or rising SCLK edge as determined by the RISE/FALL pin. SDIN may also be used as a serial data output line. Additional pins expand the versatility of the basic serial interface and allow it to be used with different microcontrollers. The BUSY pin indicates when a conversion is in progress and may be used to generate interrupts for the microcontroller. The CONVERT pin can be used as a hardware-based method of causing the ADS7870 to start a conversion cycle. The RESET pin can be toggled in order to reset the ADS7870 to the power-on state. Communication through the serial interface is dependent on the microcontroller providing an instruction byte followed by either additional data (for a write operation) or just additional SCLKs to allow the ADS7870 to provide data (for a read operation). Special operating modes for reducing the instruction byte overhead for retrieving conversion results are available. Reset of device (RESET), start of conversion (CONVERT), and oscillator enable (OSC ENABLE) can be done by signals to external pins or entries to internal registers. The actual execution of each of these commands is a logical OR function; either pin or register signal TRUE causes the function to execute. The CONVERT pin signal is an edge-triggered event, with a hold time of two CCLK periods for debounce. 14

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Operating Modes The ADS7870 serial interface operates based on an instruction byte followed by an action commanded by the contents of that instruction. The 8-bit instruction word is clocked into the DIN input. There are two types of instruction bytes that may be written to the ADS7870 as determined by bit D7 of the instruction word (see Figure 14). These two instructions represent two different operating modes. In direct mode (bit D7 = 1), a conversion is started. A register mode (bit D7 = 0) instruction is followed by a read or write operation to the specified register. INSTRUCTION BYTE D7 (MSB) D6 D5 D4 D3 D2 D1 D0 Start Conversion 1 G2 G1 G0 M3 M2 M1 M0 (Direct Mode) OR Read/Write 0 R/W 16/8 A4 A3 A2 A1 A0 (Register Mode) START CONVERSION INSTRUCTION BYTE (Direct Mode)(1) BIT SYMBOL NAME VALUE FUNCTION D7 Mode select 1 Starts a conversion cycle (direct mode) D6−D4 G2−G0 PGA gain select 000 PGA Gain = 1 (power up default condition) 001 PGA Gain = 2 010 PGA Gain = 4 011 PGA Gain = 5 100 PGA Gain = 8 101 PGA Gain = 10 110 PGA Gain = 16 111 PGA Gain = 20 D3−D0 M3−M0 Input channel select See Figure 21 Determines input channel selection for the requested conversion, differential or single-ended configuration. (1)The seven lower bits of this byte are also written to register 4, the Gain/Mux register. READ/WRITE INSTRUCTION BYTE (Register Mode) BIT SYMBOL NAME VALUE FUNCTION D7 Mode Select 0 Initiates a read or write operation (register mode) D6 R/W Read/Write Select 0 Write operation 1 Read operation D5 16/8 Word Length 0 8-Bit word 1 16-Bit word (2 8-bit bytes) D4−D0 AS4−AS0 Register Address See Figure 15 Determines the address of the register that is to be read from or written to Figure 14. Instruction Byte Addressing Direct Mode In direct mode a conversion is initiated by writing a single 8-bit instruction byte to the ADS7870 (bit D7 is set to 1). Writing the direct mode command sets the configuration of the multiplexer, selects the gain of the PGA, and starts a conversion cycle. After the last bit of the instruction byte is received, the ADS7870 performs a conversion on the selected input channel with the PGA gain set as indicated in the instruction byte. The conversion cycle begins on the second falling edge of DCLK after the eighth active edge of SCLK of the instruction byte. When the conversion is complete, the conversion result is stored in the A/D output registers and is available to be clocked out of the serial interface by the controlling device using the READ operation in the register mode. The structure of the instruction byte for direct mode is shown in Figure 14. (cid:1) D7: This bit is set to 1 for direct mode operation (cid:1) D6 through D4 (G2 − G0): These bits control the gain of the programmable gain amplifier. PGA gains of 1, 2, 4, 5, 8, 10,16, and 20 are available. The coding is shown in Figure 14. (cid:1) D3 through D0 (M3 − M0): These bits configure the switches that determine the input channel selection. The input channels may be placed in either differential or single-ended configurations. In the case of differential configuration, the polarity of the input signal is reversible. The coding is shown in Figure 21. 15

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Note that the seven lower bits of this byte are written to register 4, the Gain/Mux register. All other controllable ADS7870 parameters are values previously stored in their respective registers. These values are either the power-up default values (0) or values that were previously written to one of the control registers in a register mode operation. No additional data is required for a direct mode instruction. Register Mode In register mode (Bit D7 of the Instruction Byte is 0) a read or write instruction to one of the ADS7870’s registers is initiated. All of the user determinable functions and features of the ADS7870 can be controlled by writing information to these registers (see Figure 15). Conversion results can be read from the A/D Output registers. REGISTER ADDRESS REGISTER CONTENT ADDR READ/ D7 A4 A3 A2 A1 A0 NO. WRITE (MSB) D6 D5 D4 D3 D2 D1 D0 REGISTER NAME A/D Output Data, 0 0 0 0 0 0 Read ADC3 ADC2 ADC1 ADC0 0 0 0 OVR LS Byte A/D Output Data, 0 0 0 0 1 1 Read ADC11 ADC10 ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 MS Byte 0 0 0 1 0 2 Read 0 0 VLD5 VLD4 VLD3 VLD2 VLD1 VLD0 PGA Valid Register 0 0 0 1 1 3 R/W 0 0 BIN 0 RMB1 RBM0 CFD1 CFD0 A/D Control Register CNV/ 0 0 1 0 0 4 R/W G2 G1 G0 M3 M2 M1 M0 Gain/Mux Register BSY CNV/ Digital I/O State 0 0 1 0 1 5 R/W 0 0 0 IO3 IO2 IO1 IO0 BSY Register Digital I/O Control 0 0 1 1 0 6 R/W 0 0 0 0 OE3 OE2 OE1 OE0 Register Ref/Oscillator 0 0 1 1 1 7 R/W 0 0 OSCR OSCE REFE BUFE R2V RBG Control Register Serial Interface 1 1 0 0 0 24 R/W LSB 2W/3W 8051 0 0 8501 2W/3W LSB Control Register 1 1 1 1 1 31 Read 0 0 0 0 0 0 0 1 ID Register Figure 15. Register Address Map The instruction byte (see Figure 14) contains the address of the register for the next read/write operation, determines whether the serial communication is to be done in 8-bit or 16-bit word length, and determines whether the next operation is read-from or written-to the addressed register. The structure of the instruction byte for register mode is shown in Figure 14. (cid:1) D7: This bit is set to 0 for register mode operation. (cid:1) D6 (R/W): Bit 6 of the instruction byte determines whether a read or write operation is performed, 1 for a read or 0 for a write. (cid:1) D5 (16/8): This bit determines the word length of the read or write operation that follows, 1 for sixteen bits (two eight-bit bytes) or 0 for eight bits. (cid:1) D4 through D0 (A4 − A0): These bits determine the address of the register that is to be read from or written to. Register address coding and other information are tabulated in Figure 15. For sixteen-bit operations, the first eight bits is written-to/read-from the address encoded by the instruction byte, bits A4 through A0 (register address). The address of the next eight bits depends upon whether the register address for the first byte is odd or even. If it is even, then the address for the second byte is the register address + 1. If the register address is odd, then the address for the second byte is the register address – 1. This arrangement allows transfer of conversion results from the two A/D Output Data registers either MS byte first or LS byte first (refer to the section Serial Interface Control Register). Register Summary A summary of information about the addressable registers is shown in Figure 15. Their descriptions follow, and more detailed information is provided later in the section Internal User-Accessible Registers. Registers 0 and 1, the A/D Output Data registers, contain the least significant and most significant bits of the A/D conversion result (ADC0 through ADC13). Register 0 also has three fixed zeros (D3, D2, and D1), and a bit to indicate if the internal voltage limits of the PGA have been over ranged (OVR). This is a read only register. Write an 8-bit word to register 0 and the ADS7870 resets. 16

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Register 2, the PGA Valid register, contains information that describes the nature of the problem in the event that the allowable input voltage to the PGA has been exceeded. Register 3, the A/D Control register, has two test bits (best left set to zero), a bit to convert the output format to straight binary (BIN), an unused bit set to zero, two bits to configure an automatic read back mode of the A/D results (RBM1, RBM0), and two bits that program the frequency divider for the CCLK (CDF1, CDF0). Register 4, the Gain/Mux register, contains the input channel selection information (M0 through M3) and the programmable gain amplifier gain set bits (G0 through G2). Register 5, the Digital I/O State register, contains the state of each of the digital I/O pins (I/O3 through I/O0). In addition, registers 4 and 5 contain a convert/busy bit (CNV/BSY) that can be used to start a conversion via a write instruction or sense when the converter is busy with a read instruction. Register 6, the Digital I/O Control register, contains the information that determines whether each of the four digital I/O pins is to be an input or an output function (OE3 through OE0). This sets the mode of each I/O pin. Register 7, the Ref/Oscillator Control register, controls whether the internal oscillator used for the conversion clock is on or off (OSCE), whether the internal voltage reference and buffer are on or off (REFE, BUFE), and whether the reference provides 2.5 V, 2.048 V, or 1.15 V. Register 24, the Serial Interface Control register, controls whether data is presented MSB or LSB first (LSB bit), whether the serial interface is configured for 2-wire or 3-wire operation (2W/3W bit), and determines proper timing control for 8051-type microprocessor interfaces (8051 bit). Register 31, the ID register, is read only. Reset There are three ways to reset. All register contents and the serial interface are reset on: 1. Cycle power. The power down time must be long enough to allow internal nodes to discharge. 2. Toggle the RESET pin. Minimum pulse width to reset is 50 ns. 3. Write an 8-bit byte to register 0. The ADS7870 does not wait for the data which would normally follow this instruction. All of these actions set all internal registers to zero, turns off the oscillator, reference, and buffer. Recovery time for the reference is dependent on capacitance on the reference and buffer outputs. Only the serial interface is reset (and disabled) when the CS signal is brought high. If CS is continuously held low, and the ADS7870 is reset by an 8-bit write to register 0 (even if inadvertently) then the next 1 input to DIN is the synchronizing bit for the serial interface. The next active edge of SCLK following this 1 latches in the first bit of the new instruction byte. For applications where CS cannot be cycled, and system synchronization is lost, the ADS7870 must be reset by writing 39 zeros and a one. The serial interface is then ready to accept the next command byte. This string length is based on the worst case conditions to ensure that the device is synchronized. NOTE: A noisy SCLK, with excessive ringing, can cause the ADS7870 to inadvertently reset. Sufficient capacitance to correct this problem may be provided by just a scope probe, which would mask this issue during debugging. A 100-Ω capacitor in series with the SCLK pin is usually sufficient to correct this problem. Since the data is changed on the opposite edge of SCLK, it is usually settled before the active edge of SCLK and would not need its own 100-Ω resistor, although it would not be detrimental. 17

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Write Operation To perform a write operation an instruction byte must first be written to the ADS7870 as described previously (see Figure 14). This instruction determines the target register as well as the word length (8 bits or 16 bits). The CS pin must be asserted (0) prior to the first active SCLK edge (rising or falling depending on the state of the RISE/FALL pin) that latches the first bit of the instruction byte. The first active edge after CS must have the first bit of the instruction byte. The remaining seven bits of the instruction byte are latched on the next seven active edges of SCLK. CS must remain low for the entire sequence. Setting CS high resets the serial interface. When starting a conversion by setting the CNV/BSY bit in the Gain/Mux register and/or the Digital I/O register, the conversion starts on the second falling edge of DCLK after the last active SCLK edge of the write operation. Figure 16 shows an example of an eight-bit write operation with LSB first and SCLK active on the rising edge. The double arrows indicate the SCLK transition when data is latched into its destination register. Instruction Latched Register is updated SCLK Ó Ó DIN ÓA0 A1 A2 A3 A4 0 0 0 D0 D1 D2 D3 D4 D5 D6 D7 Ó ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ CS Figure 16. Timing Diagram for an 8-Bit Write Operation Figure 17 shows an example of the timing for a 16-bit write to an even address with LSB first and SCLK active on the rising edge. Notice that both bytes are updated to their respective registers simultaneously. Also shown is that the address (ADDR) for the write of the second byte is incremented by one since the ADDR in the instruction byte was even. For an odd ADDR, the address for the second byte would be ADDR−1. Instruction Latched Both Bytes Updated SCLK Ó ÓÓ DIN 0 A1 A2 A3 A4 1 0 0 D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7 Ó ÓÓ Data for ADDR Data for ADDR + 1 ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ CS Figure 17. Timing Diagram of a 16-Bit Write Operation to an Even Address 18

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Read Operation A read operation is similar to a write operation except that data flow (after the instruction byte) is from the ADS7870 to the host controller. After the instruction byte has been latched (on the eighth active edge of SCLK), the DOUT pin (and the DIN pin if in two-wire mode) begins driving data on the next nonactive edge of SCLK. This allows the host controller to have valid data on the next active edge of SCLK. The data on DOUT (or DIN) transitions on the nonactive edges of SCLK. The DIN pin (two-wire mode) ceases driving data (return to high impedance) on the nonactive edge of SCLK following the eighth (or sixteenth) active edge of the read data. DOUT is only high impedance when CS is not asserted. With CS high (1), DOUT (or DIN) is forced to high impedance mode. In general, the ADS7870 is insensitive to the idle state of the clock except that the state of SCLK may determine if DIN is driving data or not. Upon completion of the read operation, the ADS7870 is ready to receive the next instruction byte. Read operations reflect the state of the ADS7870 on the first active edge of SCLK of the data byte transferred. Figure 18 shows an example of an eight-bit read operation with LSB first and SCLK active on the rising edge. The double rising arrows indicate when the instruction is latched. SCLK Ó ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DIN A0 A1 A2 A3 A4 0 1 0 Ó ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ D0 D1 D2 D3 D4 D5 D6 D7 CS Figure 18. Timing Diagram for an 8-Bit Read Operation Figure 19 provides an example of a 16-bit read operation from an odd address with LSB first and SCLK active on the rising edge. The address (ADDR) for the second byte is decremented by one since the ADDR in the instruction byte is odd. For an even ADDR, the address for the second byte would be incremented by one. SCLK Ó ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DIN Ó 1 A1 A2 A3 A4 1 1 0ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓD0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7 Data from ADDR Data from ADDR−1 CS Figure 19. Timing Diagram for a 16-Bit Read Operation to an Odd Address 19

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Multiplexer Addressing The last four bits in the instruction byte (during a start conversion instruction) or the Gain/Mux register (ADDR = 4) assign the multiplexer configuration for the requested conversion. The input channels may be placed in either differential or single-ended configurations. For differential configurations, the polarity of the input signal is reversible by the state of M2 (Bit D2). In single-ended mode, all input channels are measured with respect to system ground (pin 25). Figure 20 shows some examples of multiplexer assignments and Figure 21 provides the coding for the input channel selection. EXAMPLES OF MULTIPLEXER OPTIONS Differential and 4 Differential 8 Single−Ended Single−Ended Channel Channel Channel LN0, LN1 +– LLNN10 ++ LN0, LN1 +– + LN2 + – LN2, LN3 – LN3 + LN2, LN3 + LN4, LN5 –+ LLNN45 ++ LLNN45 ++ LN6, LN7 –+ LLNN67 ++ LLNN67 ++ Figure 20. Examples of Multiplexer Options CODING FOR SINGLE-ENDED INPUT CHANNEL SELECT CODING FOR DIFFERENTIAL INPUT CHANNEL SELECT (negative input is ground) SELECTION BITS INPUT LINES SELECTION BITS INPUT LINES M3 M2 M1 M0 LN0 LN1 LN2 LN3 LN4 LN5 LN6 LN7 M3 M2 M1 M0 LN0 NL1 LN2 LN3 LN4 LN5 LN6 LN7 0 0 0 0 + − 1 0 0 0 + 0 0 0 1 + − 1 0 0 1 + 0 0 1 0 + − 1 0 1 0 + 0 0 1 1 + − 1 0 1 1 + 0 1 0 0 − + 1 1 0 0 + 0 1 0 1 − + 1 1 0 1 + 0 1 1 0 − + 1 1 1 0 + 0 1 1 1 − + 1 1 1 1 + NOTE: Bit M3 selects either differential or single-ended mode. If differential mode is selected, bit M2 determines the polarity of the input channels. Bold items are power-up default conditions. Figure 21. Multiplexer Addressing 20

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 INTERNAL USER-ACCESSIBLE REGISTERS The registers in the ADS7870 are eight bits wide. Most of the registers are reserved, the ten user-accessible registers are summarized in the register address map (see Figure 15). Detailed information for each register follows. The default power-on/reset state of all bits in the registers is 0. ADC Output Registers The A/D output registers are read only registers located at ADDR = 0 and ADDR = 1 that contain the results of the A/D conversion, ADC11 through ADC0 (see Figure 22). The conversion result is in 2s complement format. The bits can be taken out of the registers MSB (D7) first or LSB (D0) first, as determined by the state of the LSB bits (D7 or D0) in the Serial Interface Control register. The ADDR = 0 register also contains the OVR bit which indicates if the internal voltage limits to the PGA have been exceeded. ADC OUTPUT REGISTERS ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 0 ADC3 ADC2 ADC1 ADC0 0 0 0 OVR 1 ADC11 ADC10 ADC9 ADC8 ADC7 ADC6 ADC5 ADC4 ADDR = 0 (LS Byte) BIT SYMBOL NAME VALUE FUNCTION ADC3− D7−D4 A/D Output (1) Four least significant bits of conversion result ADC0 D3−D1 — — 0 These bits are not used and are always 0. D0 OVR PGA Over-Range 0 Valid conversion result 1 An analog over-range problem has occurred in the PGA. Conversion result may be invalid. Details of the type of problem are stored in register 2, the PGA Valid register. ADDR = 1 (MS Byte) BIT SYMBOL NAME VALUE FUNCTION D7−D0 ADC11− ADC Output (1) Eight most significant bits of conversion result ADC4 (1)Value depends on conversion result. Figure 22. ADC Output Registers (ADDR = 0 and ADDR = 1) 21

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 PGA Valid Register The PGA Valid register (ADDR = 2) is a read only register that contains the individual results of each of the six comparators for the PGA, VLD5 through VLD0, as shown in Figure 23. PGA VALID REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 2 0 0 VLD5 VLD4 VLD3 VLD2 VLD1 VLD0 ADDR = 2 BIT SYMBOL NAME VALUE FUNCTION D7−D6 — — 0 These bits are not used and are always 0. D5 VLD5 PGA Valid 5 0 0 − Voltage at minus (−) output from the PGA is within its minimum value. 1 1 − Voltage at minus (−) output from the PGA has exceeded its minimum value. D4 VLD4 PGA Valid 4 0 0 − Voltage at minus (−) output from the PGA is within its maximum value. 1 1 − Voltage at minus (−) output from the PGA has exceeded its maximum value. D3 VLD3 PGA Valid 3 0 0 − Voltage at minus (−) input to the PGA is within its maximum value. 1 1 − Voltage at minus (−) input to the PGA has exceeded its maximum value. D2 VLD2 PGA Valid 2 0 0 − Voltage at plus (+) output from the PGA is within its minimum value. 1 1 − Voltage at plus (+) output from the PGA has exceeded its minimum value. D1 VLD1 PGA Valid 1 0 0 − Voltage at plus (+) output from the PGA is within its maximum value. 1 1 − Voltage at plus (+) output from the PGA has exceeded its maximum value. D0 VLD0 PGA Valid 0 0 0 − Voltage at plus (+) input to the PGA is within its maximum value. 1 1 − Voltage at plus (+) input to the PGA has exceeded its maximum value. Bold items are power-up default conditions. Figure 23. PGA Valid Register (ADDR = 2) 22

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 A/D Control Register The A/D Control register (ADDR = 3) configures the CCLK divider and read back mode option as shown in Figure 24. ADC CONTROL REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 3 0 0 BIN 0 RBM1 RBM0 CFD1 CFD0 ADDR = 3 BIT SYMBOL NAME VALUE FUNCTION D7−D6 — — 0 These bits are reserved and must always be written 0. D5 BIN Output Data 0 Mode 0 − Twos complement output data format Format 1 Mode 1 − Binary output data format D4 — — 0 This is a reserved bit and must always be written 0. D3−D2 RBM1−RBM0 Automatic Read 00 Mode 0 − Read instruction required to access ADC conversion result. Back Mode 01 Mode 1 − Most significant byte returned first 10 Mode 2 − Least significant byte returned first 11 Mode 3 − Only most significant byte returned D1−D0 CFD1−CFD0 CCLK Divide 00 Division factor for CCLK = 1 (DCLK = CCLK) 01 Division factor for CCLK = 2 (DCLK = CCLK/2) 10 Division factor for CCLK = 4 (DCLK = CCLK/4) 11 Division factor for CCLK = 8 (DCLK = CCLK/8) Bold items are power-up default conditions. Figure 24. ADC Control Register (ADDR = 3) Read Back Modes RBM1 and RBM0 determine which of four possible modes is used to read the A/D conversion result from the A/D Output registers. (cid:1) Mode 0 (default mode) requires a separate read instruction to be performed in order to read the output of the A/D Output registers (cid:1) Mode 1, 2, and 3: Provide for different types of automatic read-back options of the conversion results from the A/D Output registers without having to use separate read instructions: Mode 1: Provides data MS byte first Mode 2: Provides data LS byte first Mode 3: Output only the MS byte For more information refer to the Read Back Mode section. Clock Divider CFD1 and CFD0 set the CCLK divisor constant which determines the DCLK applied to the A/D, PGA, and reference. The A/D and PGA operate with a maximum clock of 2.5 MHz. In situations where an external clock is used to pace the conversion process it may be desirable to reduce the external clock frequency before it is actually applied to the PGA and A/D. The signal that is actually applied to the A/D and PGA is called DCLK, where DCLK = CCLK/DF (DF is the division factor determined by the CFD1 and CFD0 bits). For example, if the external clock applied to CCLK is 10 MHz and DF = 4 (CFD1 = 1, CFD0 = 0), DCLK equals 2.5 MHz. 23

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Gain/Mux Register The Gain/Mux register (ADDR = 4) contains the bits that configure the PGA gain (G2 − G0) and the input channel selection (M3 − M0) as shown in Figure 25. This register is also updated when direct mode is used to start a conversion so its bit definition is compatible with the instruction byte. GAIN/MUX REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 4 CNV/BSY G2 G1 G0 M3 M2 M1 M0 ADDR = 4 BIT SYMBOL NAME VALUE FUNCTION D7 CNV/BSY Convert/Busy 0 Idle Mode 1 Busy Mode; write = start conversion D6−D4 G2−G0 PGA Gain Select 000 PGA Gain = 1 001 PGA Gain = 2 010 PGA Gain = 4 011 PGA Gain = 5 100 PGA Gain = 8 101 PGA Gain = 10 110 PGA Gain = 16 111 PGA Gain = 20 D3−D0 M3−M0 Input Channel Select See Determines input channel selection for the requested conversion, differential or Figure 21 single-ended configuration. Bold items are power-up default conditions. Figure 25. Gain/Mux Register (ADDR = 4) Input Channel Selection Bits M3 through M0 configure the switches that determine the input channel selection. The input channels may be placed in either differential or single-ended configurations. In the case of differential configuration, the polarity of the input pins is reversible by the state of the M2 bit. The coding for input channels is given in Figure 21 and examples of different input configurations are shown in Figure 20. Convert/Busy If the CNV/BSY bit is set to a 1 during a write operation, a conversion starts on the second falling edge of DCLK after the active edge of SCLK that latched the data into the Gain/Mux register. The CNV/BSY bit may be read with a read instruction. The CNV/BSY bit is set to 1 in a read operation if the ADS7870 is performing a conversion at the time the register is sampled in the read operation. Gain Select Bits G2 through G0 control the gain of the programmable gain amplifier. PGA gains of 1, 2, 4, 5, 8, 10, 16, and 20 are available. The coding is shown in Figure 25. 24

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Digital Input/Output State Register The Digital I/O State register (ADDR = 5) contains the state of each of the four digital I/O pins. Each pin can function as a digital input (the state of the pin is set by an external signal connected to it) or a digital output (the state of the pin is set by data from a serial input to the ADS7870). The input/output functional control is established by the digital I/O mode control bits (OE3 − OE0) in the Digital I/O Control register. In addition, the convert/busy bit (CNV/BSY) can be used to start a conversion via a write instruction or determine if the converter is busy by executing a read instruction. Digital I/O State Bits Bits D3 through D0 (I/O3 − I/O0) of the Digital I/O State register are the state bits. If the corresponding mode bit makes the pin a digital input, the state bit indicates whether the external signal connected to the pin is a 1 or a 0, and it is not possible to control the state of the corresponding bit with a write operation. The state of the bit is only controlled by the external signal connected to the digital I/O pin. Coding is shown in Figure 26. DIGITAL I/O STATE REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 5 CNV/BSY 0 0 0 IO3 IO2 IO1 IO0 ADDR = 5 BIT SYMBOL NAME VALUE FUNCTION D7 CNV/BSY Convert/Busy 0 Idle Mode 1 Busy Mode; write = start conversion D6−D4 — — 0 These bits are not used and are always 0. D3 IO3 State for I/O3 0 Input or Output State = 0 1 Input or Output State = 1 D2 IO2 State for I/O2 0 Input or Output State = 0 1 Input or Output State = 1 D1 IO1 State for I/O1 0 Input or Output State = 0 1 Input or Output State = 1 D0 IO0 State for I/O0 0 Input or Output State = 0 1 Input or Output State = 1 Bold items are power-up default conditions. NOTE: When the mode control makes a pin a digital input, it is not possible to control the state of the corresponding bit in the Digital I/O State register with a write operation. The state of the bit is only controlled by the external signal connected to the digital I/O pin. Figure 26. Digital I/O State Register (ADDR = 5) The four digital I/O pins allow control of external circuitry, such as a multiplexer, or allow the digital status lines from other devices to be read without using any additional microcontroller pins. Reads from this register always reflect the state of the pin, not the state of the latch inside the ADS7870. Convert/Busy If CNV/BSY is set to a 1 during a write operation, a conversion starts on the second falling edge of DCLK after the active edge of SCLK that latched the data into the Digital I/O register. The CNV/BSY bit may be read with a read instruction. The CNV/BSY bit is set to 1 in a read operation if the ADS7870 is performing a conversion at the time the register is sampled in the read operation. 25

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Digital I/O Control Register The Digital I/O Control register (ADDR = 6) contains the information that determines whether each of the four digital I/O lines is configured as an input or output. Setting the appropriate OE bit to 1 enables the corresponding I/O pin as an output. Setting the appropriate OE bit to 0 enables the corresponding I/O pin as an input (see Figure 27). DIGITAL I/O CONTROL REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 6 0 0 0 0 OE3 OE2 OE1 OE0 ADDR = 6 BIT SYMBOL NAME VALUE FUNCTION D7−D4 — — 0 These bits are reserved and must always be set to 0. D3 OE3 State for I/O3 0 Digital I/O 1 − digital input 1 Digital I/O 1 = digital output D2 OE2 State for I/O2 0 Digital I/O 2− digital input 1 Digital I/O 2 − digital output D1 OE1 State for I/O1 0 Digital I/O 3− digital input 1 Digital I/O 3 − digital output D0 OE0 State for I/O0 0 Digital I/O 4− digital input 1 Digital I/O 4 − digital output Bold items are power-up default conditions. Figure 27. Digital I/O Control Register (ADDR = 6) 26

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Reference/Oscillator Configuration Register The Reference/Oscillator Configuration register (ADDR = 7) determines whether the internal oscillator is used (OSCE and OSCR), whether the internal voltage reference and buffer are on or off (REFE and BUFE), and whether the reference is 2.5 V, 2.048 V, or 1.15 V as shown in Figure 28. REFERENCE/OSCILLATOR REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 7 0 0 OSCR OSCE REFE BUFE R2V RBG ADDR = 7 BIT SYMBOL NAME VALUE FUNCTION D7−D6 — — 0 These bits are reserved and must always be set to 0. D5 OSCR Oscillator Control 0 Source of clock for internal VREF is CCLK pin. 1 Clocking signal comes from the internal oscillator. D4 OSCE Oscillator Enable 0 CCLK is configured as an input. 1 CCLK outputs a 2.5-MHz signal (70 µA). D3 REFE Reference Enable 0 Reference is powered down. 1 Reference is powered up. D2 BUFE Buffer Enable 0 Buffer is powered down and draws no current. 1 Buffer is powered up and draws 150 µA of current. D1 R2V 2-V Reference 0 VREF = 2.5 V (RBG bit = 0) 1 VREF = 2.048 V (RBG bit = 0) D0 RBG Bandgap Reference 0 Bit R2V determines the value of the reference voltage. 1 VREF = 1.15 V Bold items are power-up default conditions. Figure 28. Reference/Oscillator Configuration Register (ADDR = 7) Oscillator Control The internal voltage reference uses a switched capacitor technique which requires a clocking signal input. When OSCR = 1, the clocking signal for the reference comes from the internal oscillator. When OSCR = 0, the clocking signal for the reference is derived from the signal on the CCLK pin and affected by the frequency divider controlled by the CFD0 and CFD1 bits in the A/D Control register. The OSCE bit is the internal oscillator enable bit. When it is set to 1, power is applied to the internal oscillator causing it to produce a 2.5-MHz output and causing the signal to appear at the CCLK pin. The internal oscillator is also enabled when the OSCR bit and the REFE bit are set to 1, but does not make CCLK an output pin. The internal oscillator is also enabled when the OSC ENABLE pin is set to 1. The power-up default condition is 0 for OSCE and OSCR. If either the OSC ENABLE pin is held high, or either of these control register bits are 1, then the oscillator is turned on. Voltage Reference and Buffer Enable When the REFE bit = 0 (power-up default condition), the reference is powered down and draws no current. When REFE is set to 1, the reference is powered up and draws approximately 190 µA of current. When the BUFE bit = 0 (power-up default condition), the buffer amplifier is powered down and draws no current. When the buffer amplifier is set to 1, it is powered up and draws approximately 150 µA of current. Selecting the Reference Voltage When the RBG bit is set to 1, the voltage on the VREF pin is 1.15 V and the R2V bit has no effect. When this bit is set to 0 (power-up default condition), the R2V bit determines the value of the reference voltage. When R2V = 0 and RBG = 0 (power-up default condition), the voltage at the VREF pin is 2.5 V. When R2V = 1 and RBG = 0, the reference voltage is 2.048 V. A 12-bit bipolar input A/D converter has 4096 states and each state corresponds to 1.22 mV with the 2.5 V reference. With a 2.048 V reference, each A/D bit corresponds to 1 mV. 27

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Serial Interface Control Register The Serial Interface Control register (ADDR = 24), see Figure 29, allows certain aspects of the serial interface to be controlled by the user. It controls whether data is presented MSB or LSB first and whether the serial interface is configured for 2-wire or 3-wire operation, and it determines proper timing control for 8051-type microprocessor interfaces. The information in this register is formatted with the information symmetric about its center. This is done so that it may be read or written either LSB (bit D7) or MSB (bit D0) first. Each control bit has two locations in the register. If either of the two is set, the function is activated. This arrangement can potentially simplify microcontroller communication code. The instruction byte to write this configuration data to Register 24 is itself symmetric. From Figure 14, a register mode write instruction of 8 bits to address 24 is 0001 1000 in binary form. Therefore, this command to write to this register is valid under all conditions. SERIAL INTERFACE CONTROL REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 24 LSB 2W/3W 8051 0 0 8051 2W/3W LSB ADDR = 7 BIT SYMBOL NAME VALUE FUNCTION D7 LSB LSB or MSB first 0 Serial interface receives and transmits MSB first. 1 Serial interface receives and transmits LSB first. D6 2W/3W 2 Wire or 3 Wire 0 3-Wire mode 1 2-Wire mode D5 8051 Serial Interface 0 DIN high impedance on the next inactive edge or when CS goes inactive. 1 DIN pin is high impedance on last active SCLK edge of the bye of data transfer D4−D3 — — 0 These bits are reserved and must always be set 0. D2 8051 Serial Interface 0 DIN high impedance on the next inactive edge or when CS goes inactive. 1 DIN pin is high impedance on last active SCLK edge of the byte of data transfer D1 2W/3W 2 Wire or 3 Wire 0 3-Wire mode 1 2-Wire mode D0 LSB LSB or MSB first 0 Serial interface receives and transmits MSB first. 1 Serial interface receives and transmits LSB first. Bold items are power-up default conditions. Figure 29. Serial Interface Control Register (ADDR = 24) LSB or MSB The LSB bit determines whether the serial interface receives and transmits either LSB or MSB first. Setting the LSB bit (1) configures the interface to expect all bytes LSB first as opposed to the default MSB first (LSB = 0). 2-Wire or 3-Wire Operation The 2W/3W bit configures the ADS7870 for 2-wire or 3-wire mode. In two-wire mode (2W/3W = 1), the DIN pin is enabled as an output during the data output portion of a read instruction. The DIN pin accepts data when the ADS7870 is receiving and it outputs data when the ADS7870 is transmitting. When data is being sent out of the DIN pin, it also appears on the DOUT pin as well. In three-wire mode (2W/3W = 0), data to the ADS7870 is received on the DIN pin and is transmitted on the DOUT pin. The power-up default condition is three-wire mode. 28

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Serial Interface Timing (8051 Bit) The 8051 bit changes the timing of when the DIN pin goes to high impedance at the end of an operation. When the bit is a 1, the pin goes to high impedance on the last active SCLK edge of the last byte of data transfer instead of waiting for the next inactive edge, or CS to go inactive. This allows the ADS7870 to disconnect from the data lines soon enough to avoid contention with an 80C51-type interface. The 80C51 drives data four CPU cycles before an inactive SCLK edge and for two CPU cycles after an active SCLK edge. When the 8051 bit is a 0, the DIN pin goes high impedance on the next inactive SCLK edge or when CS goes inactive (1). Figure 30 and Figure 31 show the timing of when the ADS7870 sets the DIN pin to high impedance at the end of a read operation when the 2W/3W bit is set. The behavior of DOUT does not depend of the state of 2W/3W. The 8051 bit is not set for these two examples. Micro drives DIN ADS7870 drives DIN DIN high−impedance on CS SCLK DIN A0 A1 A2 A3 A4 0 1 0 D0 D1 D2 D3 D4 D5 D6 D7 ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓD0 D1 D2 D3 D4 D5 D6 D7 CS Figure 30. Timing for High Impedance State on DIN/DOUT (CS = 1) Micro drives DIN ADS7870 drives DIN DIN high−impedance on inactive edge SCLK DIN A0 A1 A2 A3 A4 0 1 0 D0 D1 D2 D3 D4 D5 D6 D7 ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ D0 D1 D2 D3 D4 D5 D6 D7 ÓÓ CS Figure 31. Timing for High Impedance State on DIN/DOUT (Inactive SCLK Edge) 29

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Figure 32 shows the timing for entering the high impedance state when the 8051 bit is set. Notice that on the last bit of the read operation the DIN (and DOUT) pin goes to the high impedance state on the active edge of SCLK instead of waiting for the inactive edge of SCLK or CS going high as shown in Figure 30 and Figure 31. This is for compatibility with 80C51 mode 0 type serial interfaces. An 80C51 forces DIN valid before the SCLK falling edge and holds it valid until after the SCLK rising edge. This can lead to contention but setting the 8051 bit fixes this potential problem without requiring CS to be toggled high after every read operation. Micro drives DIN ADS7870 drives DIN DIN high−impedance on active SCLK edge SCLK DIN A0 A1 A2 A3 A4 0 1 0 D0 D1 D2 D3 D4 D5 D6 D7 ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ D0 D1 D2 D3 D4 D5 D6 D7 CS Figure 32. Timing for High-Impedance State on DIN/DOUT (8051 Bit = 1) ID Register The ADS7870 has an ID register (at ADDR = 31) to allow the user to identify which revision of the ADS7870 is installed. This is shown in Figure 33. ID REGISTER ADDR D7 (MSB) D6 D5 D4 D3 D2 D1 D0 31 0 0 0 0 0 0 0 1 ADDR = 31 BIT SYMBOL NAME VALUE FUNCTION D7−D0 — — — The contents of this register identify the revision of the ADS7870 Figure 33. ID Register (ADDR = 31) Remaining Registers The remaining register addresses are not used in the normal operation of the ADS7870. These registers return random values when read and nonzero writes to these registers cause erratic behavior. Unused bits in the partially used registers must always be written low. 30

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 STARTING A CONVERSION THROUGH THE SERIAL INTERFACE There are two methods of starting a conversion cycle through the serial interface. The first (nonaddressed or direct mode) is by using the start conversion byte as described earlier. The second (addressed mode) is by setting the CNV/BSY bit of register 4 or register 5 by performing a write instruction. The conversion starts on the second falling edge of DCLK after the eighth active edge of SCLK (for the instruction in nonaddressed mode or the data in addressed mode). The BUSY pin goes active (1) one DCLK period (1, 2, 4, or 8 CCLK periods depending on CFD1 and CFD0) after the start of a conversion. This delay is to allow BUSY to go inactive when conversions are queued to follow in immediate succession. BUSY goes inactive at the end of the conversion. If a conversion is already in progress when the CNV/BSY bit is set on the eighth active SCLK edge, the CNV/BSY bit is placed in the queue and the current conversion is allowed to finish. If a conversion is already queued, the new one replaces the currently queued conversion. The queue is only one conversion long. Immediately upon completion of the current conversion, the next conversion starts. This allows for maximum throughput through the A/D converter. Since BUSY is defined to be inactive for the first DCLK clock period of the conversion, the inactive (falling) edge of BUSY can be used to mark the end of a conversion (and start of the next conversion). Figure 34 shows the timing of a conversion start using the convert start instruction byte. The double rising arrow on SCLK indicates when the instruction is latched. The double falling arrow on CCLK indicates where the conversion cycle actually starts (second falling edge of CCLK after the eighth active edge of SCLK). This example is for LSB first, CCLK divider = 1, and SCLK active on rising edge. Notice that BUSY goes active one CCLK period later since CCLK divider = 1. ÓÓÓÓÓÓÓÓ SCLK ÓÓÓÓÓÓÓÓ ÓÓÓ ÓÓÓÓÓÓÓÓ DIN ÓÓÓ M0 M1 M2 M3 G0 G1 G2 1 ÓÓÓÓÓÓÓÓ DOUT CS Conversion Starts CCLK BUSY Figure 34. Timing Diagram for a Conversion Start Using Serial Interface Convert Instruction 31

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Figure 35 shows an example of a conversion start using an 8-bit write operation to the Gain/Mux register with the CNV/BSY bit set to 1. The double rising arrow on SCLK indicates where the data is latched into the Gain/Mux register and the double arrow on CCLK indicates when the conversion starts. The example is for LSB first, CCLK divider = 1, and SCLK active on the rising edge. ÓÓÓÓÓ SCLK ÓÓÓÓÓ ÓÓÓ ÓÓÓÓ DIN A0 A1 A2 A3 A4 0 0 0 M0 M1 M2 M3 G0 G1 G2 1 ÓÓÓ ÓÓÓÓ DOUT CS Conversion Starts CCLK BUSY Figure 35. Timing Diagram for a Conversion Start Using 8-Bit Write to the Gain/Mux Register Figure 36 shows the timing of a conversion start using the convert start instruction byte when a conversion is already in progress (indicated by BUSY high). The double rising arrow on SCLK indicates when the instruction is latched. The second falling arrow on CCLK indicates when the conversion cycle would have started had a conversion not been in progress. The double falling arrow on CCLK indicates where the conversion cycle actually starts (immediately after completion of the previous conversion). This example is for LSB first, CCLK divider = 2, and SCLK active on the rising edge. Notice that BUSY is low for two CCLK periods because the CCLK divider = 2. ÓÓÓÓÓÓÓÓÓÓÓÓÓ SCLK ÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓ DINÓÓÓ M0 M1 M2 M3 G0 G1 G2 1 ÓÓÓÓÓÓÓÓÓÓÓÓÓ DOzyUT CS Normal Start Delayed Start CCLK BUSY Figure 36. Timing Diagram of Delayed Conversion Start With Serial Interface 32

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 STARTING A CONVERSION USING THE CONVERT PIN A conversion can also be started by an active (rising) edge on the CONVERT pin. Similar to the CNV/BSY register bit, the conversion starts on the second falling edge of CCLK after the CONVERT rising edge. The CONVERT pin must stay high for at least two CCLK periods. CONVERT must also be low for at least two CCLK periods before going high. BUSY goes active one DCLK period after the start of the conversion. Contrary to the CNV/BSY bit in the register, the CONVERT pin aborts any conversion in process and restarts a new conversion. BUSY goes low at the end of the conversion. CS may be either high or low when the CONVERT pin starts a conversion. Figure 37 shows the timing of a conversion start using the CONVERT pin. The double falling arrow on CCLK indicates when the conversion cycle actually starts (the second active CCLK edge after CONVERT goes active). This example is for CCLK divider = 4. Notice that BUSY goes active four CCLK periods later. Conversion Starts CCLK BUSY ÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓ CONV Figure 37. Timing Diagram of Conversion Start Using CONVERT Pin READ BACK MODES There are four modes available to read the A/D conversion result from the A/D Output registers. The RBM1 and RBM0 bits in the A/D Control register (ADDR = 3) control which mode is used by the ADS7870. Read Back Mode 0 (default mode) requires a separate read instruction to retrieve the conversion result Read Back Mode 1 (automatic) provides the output most significant byte first Read Back Mode 2 (automatic) provides the output least significant byte first Read Back Mode 3 (automatic) provides only the most significant byte Mode 3 does not short cycle the A/D. Automatic read back mode is only triggered when starting a conversion using the serial interface. Conversions started using the CONVERT pin do not trigger the read back mode. The first bit of data for an automatic read back is loaded on the first active SCLK edge of the read portion of instruction. The remaining bits are loaded on the next inactive SCLK edge (the first one after the first active edge). To avoid getting one bit from one conversion and the remainder of the byte from another conversion, a conversion should not finish between the first active SCLK edge and the next inactive edge. Mode 0 Mode 0 (default operating mode) requires a read instruction to be performed to retrieve a conversion result. MS byte first format is achieved by performing a sixteen bit read from ADDR = 1. LS byte first format is achieved by performing a sixteen bit read from ADDR = 0. Reading only the most significant byte can be achieved by performing an eight bit read from ADDR = 1. To increase throughput it is possible to read the result of a conversion while a conversion is in progress. The last conversion completed prior to the first active SCLK edge of the conversion data word (not the instruction byte) is retrieved. This overlapping allows a sequence of start conversion N, read conversion N – 1, start conversion N +1, read conversion N, etc. For conversion 0, the result of conversion –1 would need to be discarded. 33

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 Mode 1 In this mode, the serial interface configures itself to clockout a conversion result as soon as a conversion is started. This is useful since a read instruction is not required so eight SCLK cycles are saved. This mode operates like an implied sixteen bit read instruction byte for ADDR = 1 was sent to the ADS7870 after starting the conversion. It is not necessary to wait for the end of the conversion to start clocking out conversion results. The last completed conversion at the sampling edge of SCLK is read back (whether a conversion is in progress or not). Mode 2 This mode is similar to Mode 1 except that the conversion result is provided LS byte first (equivalent to a sixteen bit read from ADDR = 0). Figure 38 and Figure 39 show timing examples of an automatic read back operation using mode 2. In Figure 38, the result of the previous conversion is retrieved. This example is for LSB first, CCLK divider = 2, and SCLK active on the rising edge. The data may be read back immediately after the start conversion instruction. It is not necessary to wait for the conversion to actually start (or finish). First output bit loaded in the output register The remaining output bits loaded in the output register SCLK ÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DIN M0 M1 M2 M3 G0 G1 G2 1 ÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DOUT OVR 0 0 0 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ CS CCLK BUSY Figure 38. Timing Diagram for Automatic Read Back of Previous Conversion Result Using Mode 2 34

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 In Figure 39 the result of the just requested conversion is retrieved. The microcontroller must wait for BUSY to go inactive before clocking out the ADC Output register. CS must stay low while waiting for BUSY. This example is for LS byte first, CCLK divider = 1, and SCLK active on the falling edge. Notice that the DOUT pin is not driven with correct data until the appropriate active edge of SCLK. SCLK ÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ DIN 1 G2 G1 G0 M3 M2 M1 M0 ÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ B3 B2 B1 B0 0 0 0 OVR B11 B10 B9 B8 B7 B6 B5 B4 DOUT ÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓÓ CS CCLK BUSY Figure 39. Timing Diagram for Automatic Read Back of Current Conversion Result Using Mode 2 Mode 3 This mode only returns the most significant byte of the conversion. It is equivalent to an eight bit read from ADDR= 1. 35

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 APPLICATION INFORMATION REQUIRED SUPPORT ELEMENTS As with any precision analog integrated circuit, good power supply bypassing is required. A low ESR ceramic capacitor in parallel with a large value electrolytic capacitor across the supply line furnishes the required performance. Typical values are 0.1 µF and 10 µF respectively. Noise performance of the internal voltage reference circuit is improved if a ceramic capacitor of approximately 0.01 µF is connected from VREF to ground. Increasing the value of this capacitor may bring slight improvement in the noise on VREF but increases the time required to stabilize after turn on. If the internal buffer amplifier is used, it must have an output filter capacitor connected to ground to ensure stability. A nominal value of 0.47 µF provides the best performance. Any value between 0.1 µF and 10 µF is acceptable. In installations where one ADS7870 buffer is used to drive several devices, an additional filter capacitor of 0.1 µF should be installed at each of the slave devices. The circuit in Figure 40 shows a typical installation with all control functions under control of the host embedded controller. The SCLK is active on the falling edge. If the internal voltage reference and oscillator are used, they must be turned on by setting the corresponding control bits in the device registers. These registers must be set on power up and after any reset operation. V DD ADS7870 0.01 µF 10 µF 24 RESET VDD 25 RISE/FALL GND 23 11 CS I/O0 12 I/O1 20 13 SCLK I/O2 Serial Interface 21 DIN I/O3 14 22 DOUT Digital I/O − 4 Lines 1 LN0 18 2 OSC_ENABLE LN1 19 3 CCLK LN2 16 4 CONVERT LN3 17 5 BUSY LN4 26 6 VREF LN5 27 7 BUFIN LN6 0.01 µF 28 BUFOUT/ REFINLN7 8 15 0.47 µF NC Analog In − 8 Lines Figure 40. Typical Operation With Recommended Capacitor Values 36

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 APPLICATION INFORMATION MICROCONTROLLER CONNECTIONS The ADS7870 is quite flexible in interfacing to various microcontrollers. Connections using the hardware mode of two types of controllers (Motorola M68HC11, Intel 80C51) are described below. Motorola M68HC11 (SPI) The Motorola M68HC11 has a three-wire (four if you count the slave select) serial interface that is commonly referred to as SPI (serial peripheral interface), where the data is transmitted MSB first. This interface is usually described as the microcontroller and the peripheral each having two 8-bit shift registers (one for receiving and one for transmitting). The transmit shift register of the microcontroller and the receive shift register of the peripheral are connected together and vice versa. SCK controls the shift registers. SPI is capable of full duplex operation (simultaneous read and write). The ADS7870 does not support full duplex operation. The ADS7870 can only be written to or read from. It cannot do both simultaneously. Since the M68HC11 can configure SCK to have either rising or falling edge active, the RISE/FALL pin on the ADS7870 can be in whichever state is appropriate for the desired mode of operation of the M68HC11 for compatibility with other peripherals. In the Interface Control register (see Figure 29), the 2W/3W bit should be cleared (default). The LSB bit should be clear (default). The 8051 bit should also be clear (default). Since the ADS7870 defaults to SPI mode, the M68HC11 should not need to initialize the ADS7870 Interface Configuration register after power-on or reset. Figure 41 shows a typical physical connection between an M68HC11 and a ADS7870. A pull-up resister on DOUT may be needed to keep DOUT from floating during write operations. CS may be permanently tied low if desired, but then the ADS7870 must be the only peripheral. VDD 10 kΩ typ M68HC11 ADS7870 MISO DIN MOSI DOUT SCK SCLK SS CS Figure 41. Connection of a M68HC11 to an ADS7870 37

(cid:1)(cid:2)(cid:3)(cid:4)(cid:5)(cid:4)(cid:6) www.ti.com SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005 APPLICATION INFORMATION Intel 80C51 The Intel 80C51 operated in serial port mode 0 has a two-wire (three-wire if an additional I/O pin is used for CS) serial interface. The TXD pin provides the clock for the serial interface and RXD serves as the data input and output. The data is transferred LSB first. Best compatibility is achieved by connecting the RISE/FALL pin of the ADS7870 high (rising edge of SCLK active). In the Interface Configuration register, the LSB bit and the 8051 bit should be set. The 2W/3W bit should also be set. The first instruction after power-on or reset should be a write operation to the Interface Configuration register. Figure 42 shows a typical physical connection between an 80C51 and an ADS7870. CS may be permanently tied low if desired, but then the ADS7870 must be the only peripheral. VDD 10 kΩ typ 80C51 ADS7870 RXD DIN DOUT TXD SCLK Px.x CS Figure 42. Connection of an 80C51 to an ADS7870 38

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) ADS7870EA ACTIVE SSOP DB 28 50 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS7870EA & no Sb/Br) ADS7870EA/1K ACTIVE SSOP DB 28 1000 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS7870EA & no Sb/Br) ADS7870EAG4 ACTIVE SSOP DB 28 50 Green (RoHS NIPDAU Level-2-260C-1 YEAR -40 to 85 ADS7870EA & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) ADS7870EA/1K SSOP DB 28 1000 330.0 16.4 8.45 10.55 2.5 12.0 16.2 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 13-Feb-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) ADS7870EA/1K SSOP DB 28 1000 367.0 367.0 38.0 PackMaterials-Page2

PACKAGE OUTLINE DB0028A SSOP - 2 mm max height SCALE 1.500 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 26X 0.65 28 1 2X 10.5 8.45 9.9 NOTE 3 14 15 0.38 28X 0.22 5.6 0.15 C A B B 5.0 NOTE 4 2 MAX 0.25 (0.15) TYP SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214853/B 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0028A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 28X (1.85) SYMM (R0.05) TYP 1 28X (0.45) 28 26X (0.65) SYMM 14 15 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214853/B 03/2018 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0028A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 28X (1.85) SYMM (R0.05) TYP 1 28X (0.45) 28 26X (0.65) SYMM 14 15 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214853/B 03/2018 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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