3.3 V, ±15 kV ESD-Protected, Half- and Full-Duplex, RS-485/RS-422 Transceivers ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E FEATURES FUNCTIONAL BLOCK DIAGRAMS TIA/EIA RS-485/RS-422 compliant VCC ±15 kV ESD protection on RS-485 input/output pins ADM3070E/ Data rates ADM3073E/ ADM3076E ADM3070E/ADM3071E/ADM3072E: 250 kbps A ADM3073E/ADM3074E/ADM3075E: 500 kbps RO R B ADM3076E/ADM3077E/ADM3078E: 16 Mbps RE Half- and full-duplex options DE True fail-safe receiver inputs Z DI D Up to 256 nodes on the bus Y −H4o0t-°sCw taop + i1n2p5u°tC s tterumcptuerrea tounre D oEp atniodn R E pins GND 06285-001 Figure 1. Reduced slew rates for low EMI Low power shutdown current (all except ADM3071E/ VCC ADM3074E/ADM3077E) ADM3071E/ Outputs high-Z when disabled or powered off ADM3074E/ ADM3077E Common-mode input range: −7 V to +12 V A Thermal shutdown and short-circuit protection RO R B 8-lead and 14-lead narrow SOIC packages APPLICATIONS Z DI D Power/energy metering Y ILnigdhutsitnrgia sl ycsotnetmrosl GND 06285-002 Telecommunications Figure 2. Security systems VCC Instrumentation ADM3072E/ ADM3075E/ GENERAL DESCRIPTION ADM3078E The ADM307xE are 3.3 V, low power data transceivers with RO R ±15 kV ESD protection suitable for full- and half-duplex RE A communication on multipoint bus transmission lines. They DE B are designed for balanced data transmission, and they comply with TIA/EIA standards: RS-485 and RS-422. DI D Talhloew dse uvipc etos h2a5v6e t raa ⅛ns uceniivte lrosa odn r eac beuivse. rB iencpauuts iem opnelyd aonncee d, wrihveicrh GND 06285-003 should be enabled at any time, the output of a disabled or powered- Figure 3. down driver is tristated to avoid overloading the bus. The receiver inputs have a true fail-safe feature, which eliminates the need for external bias resistors and ensures a logic high output level when the inputs are open or shorted. This guar- antees that the receiver outputs are in a known state before communication begins and when communication ceases. Rev. E Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Tel: 781.329.4700 www.analog.com Trademarks and registered trademarks are the property of their respective owners. Fax: 781.461.3113 ©2006–2009 Analog Devices, Inc. All rights reserved.

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ........................................... 12 Applications ....................................................................................... 1 Circuit Description......................................................................... 15 General Description ......................................................................... 1 Function Tables ........................................................................... 15 Functional Block Diagrams ............................................................. 1 Receiver Fail-Safe ....................................................................... 15 Revision History ............................................................................... 2 Hot-Swap Capability .................................................................. 16 Specifications ..................................................................................... 4 Line Length vs. Data Rate ......................................................... 16 ±15 kV ESD Protection ............................................................. 16 Timing Specifications— ADM3070E/ADM3071E/ADM3072E ....................................... 5 Human Body Model .................................................................. 16 Timing Specifications— 256 Transceivers on the Bus ...................................................... 16 ADM3073E/ADM3074E/ADM3075E ....................................... 6 Reduced EMI and Reflections .................................................. 16 Timing Specifications— Low Power Shutdown Mode ..................................................... 17 ADM3076E/ADM3077E/ADM3078E ....................................... 7 Driver Output Protection .......................................................... 17 Absolute Maximum Ratings ............................................................ 8 Typical Applications ................................................................... 17 ESD Caution .................................................................................. 8 Outline Dimensions ....................................................................... 19 Pin Configurations and Function Descriptions ........................... 9 Ordering Guide .......................................................................... 20 Test Circuits and Switching Characteristics ................................ 10 REVISION HISTORY 8/09—Rev. D to Rev. E Changes to Ordering Guide .......................................................... 20 4/09—Rev. C to Rev. D Changes to Ordering Guide .......................................................... 20 1/09—Rev. B to Rev. C Changes to Ordering Guide .......................................................... 20 8/08—Rev. A to Rev. B Changes to Table 3 ............................................................................ 5 Changes to Figure 36 ...................................................................... 18 Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 20 10/06—Rev. 0 to Rev. A Added ADM3077E and ADM3078E ............................... Universal Changes to Figure 2 and Figure 3 ................................................... 1 Changes to Figure 5 and Figure 6 ................................................... 9 Changes to Figure 34 and Figure 35 ............................................. 17 Updated Outline Dimensions ....................................................... 19 Changes to Ordering Guide .......................................................... 20 8/06—Revision 0: Initial Version Rev. E | Page 2 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E The driver outputs of the 250 kbps and 500 kbps devices are slew The parts are fully specified over the industrial temperature rate limited to reduce EMI and data errors caused by reflections ranges and are available in 8-lead and 14-lead narrow SOIC from improperly terminated buses. Excessive power dissipation packages. caused by bus contention or by output shorting is prevented with a thermal shutdown circuit. Table 1. Selection Table Half/Full Data Rate Slew Rate Driver/Receiver Low Power Nodes on ±15 kV ESD Pin Part No. Duplex (Mbps) Limited Enable Shutdown Bus on Bus Pins Count ADM3070E Full 0.25 Yes Yes Yes 256 Yes 14 ADM3071E Full 0.25 Yes No No 256 Yes 8 ADM3072E Half 0.25 Yes Yes Yes 256 Yes 8 ADM3073E Full 0.5 Yes Yes Yes 256 Yes 14 ADM3074E Full 0.5 Yes No No 256 Yes 8 ADM3075E Half 0.5 Yes Yes Yes 256 Yes 8 ADM3076E Full 16 No Yes Yes 256 Yes 14 ADM3077E Full 16 No No No 256 Yes 8 ADM3078E Half 16 No Yes Yes 256 Yes 8 Rev. E | Page 3 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E SPECIFICATIONS V = 3.3 V ± 10%, T = T to T , unless otherwise noted. CC A MIN MAX Table 2. ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Differential Outputs Differential Output Voltage V 2.0 V V R = 100 Ω (RS-422) (see Figure 7) OD CC L 1.5 V V R = 54 Ω (RS-485) (see Figure 7) CC L V V No load CC Δ|V | for Complementary Output States1 ΔV 0.2 V R = 54 Ω or 100 Ω (see Figure 7) OD OD L Common-Mode Output Voltage V V /2 3 V R = 54 Ω or 100 Ω (see Figure 7) OC CC L Δ|V | for Complementary Output States1 ΔV 0.2 V R = 54 Ω or 100 Ω (see Figure 7) OC OC L Short-Circuit Output Current I 40 250 mA 0 V < V < 12 V OSD OUT −250 −40 mA −7 V < V < V OUT CC Short-Circuit Foldback Output Current I 20 mA (V − 1 V) < V < 12 V OSDF CC OUT −20 mA −7 V < V < +1 V OUT Output Leakage (Y, Z) Full Duplex I 125 μA DE = 0 V, RE = 0 V, V = 0 V or 3.6 V, V = 12 V O CC IN −100 μA DE = 0 V, RE = 0 V, V = 0 V or 3.6 V, V = −7 V CC IN Logic Inputs Input High Voltage V 2.0 V DE, DI, RE IH Input Low Voltage V 0.8 V DE, DI, RE IL Input Hysteresis V 100 mV DE, DI, RE HYS Logic Input Current I ±1 μA DE, DI, RE IN Input Impedance First Transition 1 10 kΩ DE Thermal Shutdown Threshold T 175 °C TS Thermal Shutdown Hysteresis T 15 °C TSH RECEIVER Differential Inputs Differential Input Threshold Voltage V −200 −125 −50 mV −7 V < V < +12 V TH CM Input Hysteresis ΔV 15 mV V + V = 0 V TH A B Input Resistance (A, B) R 96 kΩ −7 V < V < +12 V IN CM Input Current (A, B) I I 125 μA DE = 0 V, V = 0 V or 3.6 V, V = 12 V A, B CC IN −100 μA DE = 0 V, V = 0 V or 3.6 V, V = −7 V CC IN RO Logic Output Output High Voltage V V − 0.6 V I = −1 mA OH CC OUT Output Low Voltage V 0.4 V I = 1 mA OL OUT Short-Circuit Output Current I ±80 mA 0 V < V < V OSR RO CC Tristate Output Leakage Current I ±1 μA V = 3.6 V, 0 V < V < V OZR CC OUT CC POWER SUPPLY Supply Current I 0.8 1.5 mA No load, DE = V , RE = 0 V CC CC 0.8 1.5 mA No load, DE = VCC, RE = VCC 0.8 1.5 mA No load, DE = 0 V, RE = 0 V Shutdown Current ISHDN 0.05 10 μA DE = 0 V, RE = VCC ESD PROTECTION A, B, Y, Z Pins ±15 kV Human body model All Pins Except A, B, Y, Z Pins ±4 kV Human body model 1 Δ|VOD| and Δ|VOC| are the changes in VOD and VOC, respectively, when the DI input changes state. Rev. E | Page 4 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TIMING SPECIFICATIONS—ADM3070E/ADM3071E/ADM3072E V = 3.3 V ± 10%, T = T to T , unless otherwise noted. CC A MIN MAX Table 3. Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 250 kbps Propagation Delay, Low-to-High Level t 250 1500 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPLH L L Propagation Delay, High-to-Low Level t 250 1500 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPHL L L Rise Time/Fall Time t /t 350 1600 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DR DF L L |t − t | Differential Driver Output Skew t 200 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9)1 DPLH DPHL DSKEW L L Enable to Output High t 2500 ns See Figure 10 DZH Enable to Output Low t 2500 ns See Figure 11 DZL Disable Time from Low t 100 ns See Figure 11 DLZ Disable Time from High t 100 ns See Figure 10 DHZ Enable Time from Shutdown to High t 5500 ns See Figure 10 DZH(SHDN) Enable Time from Shutdown to Low t 5500 ns See Figure 11 DZL(SHDN) RECEIVER Maximum Data Rate 250 kbps Propagation Delay, Low-to-High Level t 200 ns C = 15 pF (see Figure 12 and Figure 13) RPLH L Propagation Delay, High-to-Low Level t 200 ns C = 15 pF (see Figure 12 and Figure 13) RPHL L |t − t | Output Skew t 30 ns C = 15 pF (see Figure 12 and Figure 13) RPLH RPHL RSKEW L Enable to Output High t 50 ns See Figure 14 RZH Enable to Output Low t 50 ns See Figure 14 RZL Disable Time from Low t 50 ns See Figure 14 RLZ Disable Time from High t 50 ns See Figure 14 RHZ Enable Time from Shutdown to High t 4000 ns See Figure 14 RZH(SHDN) Enable Time from Shutdown to Low t 4000 ns See Figure 14 RZL(SHDN) TIME TO SHUTDOWN t 50 200 600 ns SHDN 1 VCC = 3.3 V. Rev. E | Page 5 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TIMING SPECIFICATIONS—ADM3073E/ADM3074E/ADM3075E V = 3.3 V ± 10%, T = T to T , unless otherwise noted. CC A MIN MAX Table 4. Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 500 kbps Propagation Delay, Low-to-High Level t 180 800 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPLH L L Propagation Delay, High-to-Low Level t 180 800 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPHL L L Rise Time/Fall Time t /t 200 800 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DR DF L L |t − t | Differential Driver Output Skew t 100 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPLH DPHL DSKEW L L Enable to Output High t 2500 ns See Figure 10 DZH Enable to Output Low t 2500 ns See Figure 11 DZL Disable Time from Low t 100 ns See Figure 11 DLZ Disable Time from High t 100 ns See Figure 10 DHZ Enable Time from Shutdown to High t 4500 ns See Figure 10 DZH(SHDN) Enable Time from Shutdown to Low t 4500 ns See Figure 11 DZL(SHDN) RECEIVER Maximum Data Rate 500 kbps Propagation Delay, Low-to-High Level t 200 ns C = 15 pF (see Figure 12 and Figure 13) RPLH L Propagation Delay, High-to-Low Level t 200 ns C = 15 pF (see Figure 12 and Figure 13) RPHL L |t − t | Output Skew t 30 ns C = 15 pF (see Figure 12 and Figure 13) RPLH RPHL RSKEW L Enable to Output High t 50 ns See Figure 14 RZH Enable to Output Low t 50 ns See Figure 14 RZL Disable Time from Low t 50 ns See Figure 14 RLZ Disable Time from High t 50 ns See Figure 14 RHZ Enable Time from Shutdown to High t 4000 ns See Figure 14 RZH(SHDN) Enable Time from Shutdown to Low t 4000 ns See Figure 14 RZL(SHDN) TIME TO SHUTDOWN t 50 200 600 ns SHDN Rev. E | Page 6 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TIMING SPECIFICATIONS—ADM3076E/ADM3077E/ADM3078E V = 3.3 V ± 10%, T = T to T , unless otherwise noted. CC A MIN MAX Table 5. Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 16 Mbps Propagation Delay, Low-to-High Level t 50 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPLH L L Propagation Delay, High-to-Low Level t 50 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPHL L L Rise Time/Fall Time t /t 15 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DR DF L L |t − t | Differential Driver Output Skew t 8 ns C = 50 pF, R = 54 Ω (see Figure 8 and Figure 9) DPLH DPHL DSKEW L L Enable to Output High t 150 ns See Figure 10 DZH Enable to Output Low t 150 ns See Figure 11 DZL Disable Time from Low t 100 ns See Figure 11 DLZ Disable Time from High t 100 ns See Figure 10 DHZ Enable Time from Shutdown to High t 1250 1800 ns See Figure 10 DZH(SHDN) Enable Time from Shutdown to Low t 1250 1800 ns See Figure 11 DZL(SHDN) RECEIVER Maximum Data Rate 16 Mbps Propagation Delay, Low-to-High Level t 40 75 ns C = 15 pF (see Figure 12 and Figure 13) RPLH L Propagation Delay, High-to-Low Level t 40 75 ns C = 15 pF (see Figure 12 and Figure 13) RPHL L |t − t | Output Skew t 8 ns C = 15 pF (see Figure 12 and Figure 13) RPLH RPHL RSKEW L Enable to Output High t 50 ns See Figure 14 RZH Enable to Output Low t 50 ns See Figure 14 RZL Disable Time from Low t 50 ns See Figure 14 RLZ Disable Time from High t 50 ns See Figure 14 RHZ Enable Time from Shutdown to High t 1800 ns See Figure 14 RZH(SHDN) Enable Time from Shutdown to Low t 1800 ns See Figure 14 RZL(SHDN) TIME TO SHUTDOWN t 50 200 600 ns SHDN Rev. E | Page 7 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E ABSOLUTE MAXIMUM RATINGS T = 25°C, unless otherwise noted. A Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress Table 6. rating only; functional operation of the device at these or any Parameter Rating other conditions above those indicated in the operational V to GND −0.3 V to +6 V CC section of this specification is not implied. Exposure to absolute Digital Input/Output Voltage (DE, RE, DI) −0.3 V to +6 V maximum rating conditions for extended periods may affect Receiver Output Voltage (RO) −0.3 V to (V + 0.3 V) CC device reliability. Driver Output (A, B, Y, Z)/Receiver Input (A, B) Voltage −8 V to +13 V Driver Output Current ±250 mA ESD CAUTION Operating Temperature Range ADM307xEA −40°C to +85°C ADM307xEY −40°C to +125°C Storage Temperature Range −65°C to +150°C θJA Thermal Impedance 8-Lead SOIC_N 158°C/W 14-Lead SOIC_N 120°C/W Lead Temperature, Soldering (20 sec) 260°C Rev. E | Page 8 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS NC 1 14 VCC RO 2 13 NC ADM3070E/ RE 3 ADM3073E/ 12 A DE 4 ADM3076E 11 B GNDDI 56 (NToOt Pto V SIEcWale) 190 ZY VRCOC 21 AAADDDMMM333000777147EEE// 87 AB RROE 12 AAADDDMMM333000777258EEE// 87 VBCC GND 7NC = NO CONNECT8 NC 06285-004 GNDDI 34 (NToOt Pto V SIEcWale) 65 ZY 06285-005 DDEI 34 (NToOt Pto V SIEcWale) 65 AGND 06285-006 Figure 4. ADM3070E/ADM3073E/ADM3076E Figure 5. ADM3071E/ADM3074E/ADM3077E Figure 6. ADM3072E/ADM3075E/ADM3078E Pin Configuration Pin Configuration Pin Configuration Table 7. Pin Function Descriptions ADM3070E/ ADM3071E/ ADM3072E/ ADM3073E/ ADM3074E/ ADM3075E/ ADM3076E ADM3077E ADM3078E Pin No. Pin No. Pin No. Mnemonic Description 2 2 1 RO Receiver Output. When enabled, if (A − B) ≥ −50 mV, RO is high. If (A − B) ≤ −200 mV, RO is low. 3 N/A 2 RE Receiver Output Enable. A low level enables the receiver output. A high level places it in a high impedance state. If RE is high and DE is low, the device enters a low power shutdown mode. 4 N/A 3 DE Driver Output Enable. A high level enables the driver differential A and B outputs. A low level places it in a high impedance state. If RE is high and DE is low, the device enters a low power shutdown mode. 5 3 4 DI Driver Input. With a half-duplex part when the driver is enabled, a logic low on DI forces A low and B high; a logic high on DI forces A high and B low. With a full-duplex part when the driver is enabled, a logic low on DI forces Y low and Z high; a logic high on DI forces Y high and Z low. 6, 7 4 5 GND Ground. 9 5 N/A Y Noninverting Driver Output. N/A N/A 6 A Noninverting Receiver Input A and Noninverting Driver Output A. 12 8 N/A A Noninverting Receiver Input A. 10 6 N/A Z Inverting Driver Output. N/A N/A 7 B Inverting Receiver Input B and Inverting Driver Output B. 11 7 N/A B Inverting Receiver Input B. 14 1 8 VCC Power Supply, 3.3 V ± 10%. Bypass VCC to GND with a 0.1 μF capacitor. 1, 8, 13 N/A N/A NC No Connect. Not internally connected; can be connected to GND. Rev. E | Page 9 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TEST CIRCUITS AND SWITCHING CHARACTERISTICS VCC Y S1 R50L0Ω 0V OR 3V D OUT RL/2 +CL VOD 50pF Z RL/2 VOC 06285-007 GENERATOR 50Ω Figure 7. Driver DC Test Load VCC DE3V DE tDZL,tDZL(SHDN) VCC/2 0V Y tDLZ VOD RL CL VCC DI OUT VOM = (VOL + VCC)/2 Z 06285-008 VOL 0.25V 06285-011 Figure 8. Driver Timing Test Circuit Figure 11. Driver Enable and Disable Times (tDZL, tDLZ, tDZL(SHDN)) VCC DI VCC/2 0V t t DPLH DPHL 1/2VO Z VO Y 1/2VO +VO VDIFF = V (Y) – V (Z) B ROEUCTEPIUVTER VDIFF –0VVO 10% 90t%DtDRSKEW = |tDPLH –tDtPDH9FL0|% 10% 06285-009 ATE VID A R 06285-012 Figure 9. Driver Propagation Delays Figure 12. Receiver Propagation Delay Test Circuit S1 0V OR 3V D OUT +CL RL 50pF 500Ω GENERATOR 50Ω A +1V VCC DE tDZH,tDZH(SHDN) VCC/2 0V B tRPLH tRPH–L1V 0.25V VOH VOH RO VOL 1.5V OUT VOM = (0+ VOH)/2 tDHZ 0V 06285-010 N1.O TTHEES RISE TIME AND FALL TIME OF INPUT A AND INPUT B < 4ns. 06285-013 Figure 10. Driver Enable and Disable Times (tDHZ, tDZH, tDZH(SHDN)) Figure 13. Receiver Propagation Delays Rev. E | Page 10 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E +1.5V S3 S1 1kΩ VCC –1.5V VID +CL 15pF S2 GENERATOR 50Ω S1 OPEN S1 CLOSED S2 CLOSED S2 OPEN S3 = +1.5V S3 = –1.5V 3V 3V RE RE 1.5V 0V 0V tRZL,tRZL(SHDN) tRZH,tRZH(SHDN) VOH VCC RO VOH/2 RO (VOL + VCC)/2 0V VOL S1 OPEN S1 CLOSED S2 CLOSED S2 OPEN S3 = +1.5V S3 = –1.5V 3V 3V RE 1.5V RE 1.5V 0V 0V t t RLZ RHZ VOH VCC RO 0.25V RO 0V 0.25V VOL 06285-014 Figure 14. Receiver Enable and Disable Times Rev. E | Page 11 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E TYPICAL PERFORMANCE CHARACTERISTICS 1.2 3.30 IRO = –1mA 1.1 3.25 V) mA) 1.0 GE ( 3.20 ENT ( 0.9 OLTA Y CURR 0.8 HIGH V 3.15 SUPPL 0.7 UTPUT 3.10 O 3.05 0.6 0.5 3.00 –40 –10 T2E0MPERATU50RE (°C) 80 110 06285-020 –50 –25 0 TEMP25ERATUR5E0 (°C) 75 100 125 06285-023 Figure 15. Supply Current vs. Temperature Figure 18. Receiver Output High Voltage vs. Temperature –18 0.7 IRO = 1mA –16 0.6 –14 V) URRENT (mA) ––1120 W VOLTAGE ( 00..54 T C –8 LO 0.3 U T OUTP –6 UTPU 0.2 –4 O 0.1 –2 0 0 0 0.5 1O.0UTPUT1 H.5IGH VO2L.0TAGE (2V.)5 3.0 3.5 06285-021 –50 –25 0 TEMP25ERATUR5E0 (°C) 75 100 125 06285-024 Figure 16. Output Current vs. Receiver Output High Voltage Figure 19. Receiver Output Low Voltage vs. Temperature 25 100 90 20 80 mA) mA) 70 NT ( 15 NT ( 60 E E R R R R 50 U U C C UT 10 UT 40 P P T T U U 30 O O 5 20 10 0 0 0 0.5 1O.0UTPUT1 L.5OW VO2L.0TAGE (V2.)5 3.0 3.5 06285-022 0 0.5 DIFF1E.0RENTIA1L.5 OUTPU2T.0 VOLTA2G.5E (V) 3.0 3.5 06285-025 Figure 17. Output Current vs. Receiver Output Low Voltage Figure 20. Driver Output Current vs. Differential Output Voltage Rev. E | Page 12 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E 2.6 0.9 RL = 54Ω V) 2.5 0.8 E ( 2.4 AG A) 0.7 OLT 2.3 T (µ 0.6 OUTPUT V 22..21 N CURREN 00..54 AL 2.0 OW ERENTI 1.9 SHUTD 00..32 F 1.8 F DI 1.7 0.1 1.6 0 –50 –25 0 TEMP25ERATUR5E0 (°C) 75 100 125 06285-026 –50 –25 0 TEMP25ERATUR5E0 (°C) 75 100 125 06285-029 Figure 21. Driver Differential Output Voltage vs. Temperature Figure 24. Shutdown Current vs. Temperature 120 1200 100 1000 mA) 80 Y (ns) 800 tDPHL NT ( ELA tDPLH E D URR 60 ON 600 C TI UT GA TP 40 PA 400 U O O R P 20 200 0 0 –7 –6 –5 –O4UTP–3UT H–IG2H V–O1LTAG0E (V)1 2 3 4 06285-027 –40 TEMPERA25TURE (°C) 125 06285-030 Figure 22. Output Current vs. Driver Output High Voltage Figure 25. ADM3070E/ADM3071E/ADM3072E Driver Propagation Delay vs. Temperature (250 kbps) 120 700 600 100 t s) DPHL T (mA) 80 LAY (n 500 tDPLH EN DE 400 UTPUT CURR 4600 OPAGATION 230000 O R P 20 100 0 0 0 2 OU4TPUT LOW6 VOLTAGE8 (V) 10 12 06285-028 –40 TEMPERA25TURE (°C) 125 06285-031 Figure 23. Output Current vs. Driver Output Low Voltage Figure 26. ADM3073E/ADM3074E/ADM3075E Driver Propagation Delay vs. Temperature (500 kbps) Rev. E | Page 13 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E 35 t DPLH 30 DI t DPHL s) 3 Y (n 25 A L DE 20 N O ATI 15 M1 G A P RO 10 VY– VZ P 50 06285-036 –50 –25 0 TEMP25ERATUR5E0 (°C) 75 100 125 06285-032 CMHA3T H 21. 0 2V.01V M 440000nss 125MS/s 8ns/pt A CH2 1.24V Figure 27. ADM3076E/ADM3077E/ADM3078E Driver Figure 30. ADM3073E/ADM3074E/ADM3075E Driver Propagation Delay vs. Temperature (16 Mbps) Propagation Delay (500 kbps) 70 60 tDPLH Y (ns) 50 tDPHL M1 VY– VZ A L DE 40 N O ATI 30 G A P O 20 R P DI 100 3 06285-037 –50 –25 0 TEMP25ERATUR5E0 (°C) 75 100 125 06285-033 CMHA3T H 21. 0 1V.0ΩV 2M02n0sns 1.25GS/s IT 400ps/pt A CH3 1.64V Figure 28. Receiver Propagation Delay vs. Temperature Figure 31. ADM3076E/ADM3077E/ADM3078E Driver Propagation Delay (16 Mbps) DI 3 VA– VB M1 M1 VY– VZ RO 06285-034 3 06285-035 CH3 2.0V M1.0µs 50MS/s 20ns/pt A CH2 1.24V CH3 2.0V Ω M200ns 250MS/s 4ns/pt A CH2 1.24V MATH1 2.01V 1.0µs MATH1 2.01V 200ns Figure 29. ADM3070E/ADM3071E/ADM3072E Driver Figure 32. Receiver Propagation Delay Propagation Delay (250 kbps) Rev. E | Page 14 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E CIRCUIT DESCRIPTION The ADM307xE series are high speed transceivers for RS­485 ADM3071E/ADM3074E/ADM3077E and RS-422 communications. Each device contains one driver Table 10. Transmitting Truth Table and one receiver. All devices feature fail-safe circuitry, which Transmitting Input Transmitting Outputs guarantees a logic high receiver output when the receiver inputs DI Y Z are open or shorted or when they are connected to a terminated 1 1 0 transmission line with all drivers disabled (see the Receiver Fail- 0 0 1 Safe section). The ADM307xE also feature a hot-swap capability, allowing line insertion without erroneous data transfer (see the Table 11. Receiving Truth Table Hot-Swap Capability section). The ADM3070E/ADM3071E/ Receiving Input Receiving Output ADM3072E feature reduced slew rate drivers that minimize A − B RO EMI and reduce reflections caused by improperly terminated ≥ −50 mV 1 cables, allowing for error-free data transmission at rates up to ≤ −200 mV 0 250 kbps. Open/shorted 1 The ADM3073E/ADM3074E/ADM3075E also offer slew rate limits, allowing transmit speeds up to 500 kbps. The ADM3076E/ ADM3072E/ADM3075E/ADM3078E ADM3077E/ADM3078E driver slew rates are not limited, making Table 12. Transmitting Truth Table possible transmit speeds of up to 16 Mbps. The ADM3072E/ Transmitting Inputs Transmitting Outputs ADM3075E/ADM3078E are half-duplex transceivers; the ADM3070E/ADM3071E/ADM3073E/ADM3074E/ADM3076E/ RE DE DI A, Y B, Z ADM3077E are each full-duplex transceivers. All devices operate X1 1 1 1 0 from a single 3.3 V supply. Drivers are output short-circuit X1 1 0 0 1 current limited, and thermal shutdown circuitry protects 0 0 X1 High-Z2 High-Z2 drivers against excessive power dissipation. When activated, 1 0 X1 Shutdown Shutdown the thermal shutdown circuitry places the driver outputs into 1 X = don't care. a high impedance state. 2 High-Z = high impedance. FUNCTION TABLES Table 13. Receiving Truth Table ADM3070E/ADM3073E/ADM3076E Receiving Inputs Receiving Output RE DE A − B RO Table 8. Transmitting Truth Table 0 0 ≥ −50 mV 1 Transmitting Inputs Transmitting Outputs 0 0 ≤ −200 mV 0 RE DE DI Y Z 0 0 Open/shorted 1 X1 1 1 1 0 1 1 X1 High-Z2 X1 1 0 0 1 1 0 X1 Shutdown 0 0 X1 High-Z2 High-Z2 1 0 X1 Shutdown Shutdown 1 X = don't care. 2 High-Z = high impedance. 1 X = don't care. 2 High-Z = high impedance. RECEIVER FAIL-SAFE Table 9. Receiving Truth Table The ADM307xE family guarantees a logic high receiver output Receiving Inputs Receiving Outputs when the receiver inputs are shorted, open, or connected to a RE DE A − B RO terminated transmission line with all drivers disabled. This is done by setting the receiver input threshold between −50 mV 0 X1 ≥ −50 mV 1 and −200 mV. If the differential receiver input voltage (A − B) 0 X1 ≤ −200 mV 0 is greater than or equal to −50 mV, RO is logic high. If A − B 0 X1 Open/shorted 1 is less than or equal to −200 mV, RO is logic low. In the case 1 1 X1 High-Z2 of a terminated bus with all transmitters disabled, the receiver 1 0 X1 Shutdown differential input voltage is pulled to 0 V by the termination. With the receiver thresholds of the ADM307xE family, this 1 X = don't care. 2 High-Z = high impedance. results in a logic high with a 50 mV minimum noise margin. Rev. E | Page 15 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E HOT-SWAP CAPABILITY carried out while device power is applied. This type of testing (ALL EXCEPT ADM3071E/ADM3074E/ADM3077E) is more representative of a real-world input/output discharge, which occurs when equipment is operating normally. Hot-Swap Inputs The transmitter outputs and receiver inputs of the ADM307xE When a circuit board is inserted into a hot (or powered) back- family are characterized for protection to a ±15 kV limit using plane, differential disturbances to the data bus can lead to data the human body model. errors. During this period, processor logic output drivers are high impedance and are unable to drive the DE and RE inputs HUMAN BODY MODEL of the RS-485 transceivers to a defined logic level. Leakage currents Figure 33 shows the human body model and the current up to ±10 μA from the high impedance state of the processor waveform it generates when discharged into low impedance. logic drivers can cause standard CMOS enable inputs of a tran- This model consists of a 100 pF capacitor charged to the ESD sceiver to drift to an incorrect logic level. Additionally, parasitic voltage of interest, which is then discharged into the test device circuit board capacitance can cause coupling of V or GND to CC through a 1.5 kΩ resistor. the enable inputs. Without the hot-swap capability, these factors can improperly enable the driver or receiver of the transceiver. HIGH R1 R2 VOLTAGE When VCC rises, an internal pull-down circuit holds DE low and GENERATOR DEVICE UNDER RE high. After the initial power-up sequence, the pull-down C1 TEST circuit becomes transparent, resetting the hot-swap tolerable input. ESD TEST METHOD R2 C1 LINE LENGTH vs. DATA RATE HUMAN BODY MODEL 1.5kΩ 100pF ESD ASSOC. STD 55.1 The RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, Figure 37 illustrates an example line repeater. 100% ±15 kV ESD PROTECTION 90% Two coupling methods are used for ESD testing: contact discharge and air-gap discharge. Contact discharge calls for K A E a direct connection to the unit being tested. Air-gap discharge IP uses a higher test voltage but does not make direct contact with the test unit. With air-gap discharge, the discharge gun is moved 36.8% toward the unit under test, developing an arc across the air gap, thus the term air-gap discharge. This method is influenced by humidity, temperature, barometric pressure, distance, and rate 10% of closure of the discharge gun. The contact discharge method, while less realistic, is more repeatable and is gaining acceptance tRL tDL TIMEt 06285-015 and preference over the air-gap method. Figure 33. Human Body Model and Current Waveform Although very little energy is contained within an ESD pulse, the 256 TRANSCEIVERS ON THE BUS extremely fast rise time, coupled with high voltages, can cause The standard RS-485 receiver input impedance is 12 kΩ (1 unit failures in unprotected semiconductors. Catastrophic destruc- load), and the standard driver can drive up to 32 unit loads. The tion can occur immediately as a result of arcing or heating. ADM307xE family of transceivers has a ⅛ unit load receiver Even if catastrophic failure does not occur immediately, the input impedance (96 kΩ), allowing up to 256 transceivers to be device can suffer from parametric degradation that can result connected in parallel on one communication line. Any combi- in degraded performance. The cumulative effects of continuous nation of these devices and other RS-485 transceivers with a exposure can eventually lead to complete failure. total of 32 unit loads or fewer can be connected to the line. Input/output lines are particularly vulnerable to ESD damage. REDUCED EMI AND REFLECTIONS Simply touching or connecting an input/output cable can result in a static discharge that damages or completely destroys the The ADM3070E/ADM3071E/ADM3072E feature reduced interface product connected to the input/output port. It is slew rate drivers that minimize EMI and reduce reflections extremely important, therefore, to have high levels of ESD caused by improperly terminated cables, allowing for error- protection on the input/output lines. free data transmission at rates up to 250 kbps. The ADM3073E/ ADM3074E/ADM3075E offer higher driver output slew rate The ESD discharge can induce latch-up in the device under test, limits, allowing for transmit speeds of up to 500 kbps. so it is important that ESD testing on the input/output pins be Rev. E | Page 16 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E LOW POWER SHUTDOWN MODE output stage provides immediate protection against short (ALL EXCEPT ADM3071E/ADM3074E/ADM3077E) circuits over the whole common-mode voltage range (see Figure 22 and Figure 23). In addition, a thermal shutdown Low power shutdown mode is initiated by bringing both RE circuit forces the driver outputs into a high impedance state high and DE low. In shutdown mode, the device draws less if the die temperature rises excessively. than 1 μA of supply current. RE and DE can be driven simulta- TYPICAL APPLICATIONS neously, but the parts are guaranteed not to enter shutdown if RE is high and DE is low for fewer than 50 ns. If the inputs are The ADM3072E/ADM3075E/ADM3078E transceivers are in this state for 600 ns or more, the parts are guaranteed to enter designed for bidirectional data communications on multipoint shutdown. Enable times tZH and tZL assume that the part was not bus transmission lines. Figure 34 shows a typical network originally in a low power shutdown state (see the Test Circuits applications circuit. The ADM3071E/ADM3074E/ADM3077E and Switching Characteristics section). Enable times (tZH(SHDN) transceivers are designed for point-to-point transmission lines and tZL(SHDN)) assume that the part was originally shut down. It (see Figure 35). The ADM3070E/ADM3073E/ADM3076E takes drivers and receivers longer to become enabled from low transceivers are designed for full-duplex RS-485 networks power shutdown mode (tZH(SHDN), tZL(SHDN)) than from driver/ (see Figure 36). receiver disable mode (t , t ). ZH ZL To minimize reflections, terminate the line at both ends with DRIVER OUTPUT PROTECTION a termination resistor (the value of the termination resistor should be equal to the characteristic impedance of the cable The ADM307xE family features two methods to prevent used) and keep stub lengths off the main line as short as excessive output current and power dissipation caused by possible. faults or by bus contention. Current limit protection on the ADM3072E/ ADM3072E/ ADM3075E/ ADM3075E/ ADM3078E ADM3078E RO R R RO A A RE RE RT RT DE DE B B DI D D DI A B A B ADM3072E/ ADM3072E/ ADM3075E/ ADM3075E/ ADM3078E ADM3078E R R D D RO RE DE DI RO RE DE DI N12..O RMTTAE IXSSI MEUQMU ANLUTMOB ETHRE O CFH NAORDAECST:E 2R5I6S.TIC IMPEDANCE OF THE CABLE USED. 06285-016 Figure 34. ADM3072E/ADM3075E/ADM3078E Typical Half-Duplex RS-485 Network MASTER SLAVE ADM3071E/ ADM3071E/ ADM3074E/ ADM3074E/ ADM3077E ADM3077E A Y RO R D DI B Z Z B DI D R RO Y A 06285-017 Figure 35. ADM3071E/ADM3074E/ADM3077E Full-Duplex Point-to-Point Applications Rev. E | Page 17 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E MASTER SLAVE ADM3070E/ ADM3070E/ ADM3073E/ ADM3073E/ ADM3076E ADM3076E A Y DE RO R B RT Z D DI RE DE Z B DI D Y RT A R RO RE SLAVE A B Z Y A B Z Y SLAVE R R ADM3070E/ D D ADM3070E/ ADM3073E/ ADM3073E/ ADM3076E ADM3076E RO RE DE DI RO RE DE DI N12..O RMTTAE IXSSI MEUQMU ANLUTMOB ETHRE O CFH NAORDAECST:E 2R5I6S.TIC IMPEDANCE OF THE CABLE USED. 06285-019 Figure 36. ADM3070E/ADM3073E/ADM3076E Full-Duplex RS-485 Network ADM3070E/ ADM3073E/ ADM3076E A RO R B RT DATA IN RE DE Z DI D Y RT DATA OUT N1 . O RIMTTEP ISSE DEAQNUCAEL OTOF TTHHEE CCAHBALREA CUTSEERDI.STIC 06285-018 Figure 37. Line Repeater for ADM3070E/ADM3073E/ADM3076E Rev. E | Page 18 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E OUTLINE DIMENSIONS 5.00(0.1968) 4.80(0.1890) 8 5 4.00 (0.1574) 6.20 (0.2441) 3.80 (0.1497) 1 4 5.80 (0.2284) 1.27 (0.0500) 0.50 (0.0196) BSC 1.75 (0.0688) 0.25 (0.0099) 45° 0.25 (0.0098) 1.35 (0.0532) 8° 0.10 (0.0040) 0° COPLANARITY 0.51 (0.0201) 0.10 SEATING 0.31 (0.0122) 0.25 (0.0098) 10..2470 ((00..00510507)) PLANE 0.17 (0.0067) COMPLIANTTO JEDEC STANDARDS MS-012-AA C(RINOEFNPETARRREOENNLCLTEIHN EOGSN DELSIYM)AEANNRDSEI AORRNOESU NANORDEET DAIN-PO MPFRIFLO LMPIIMRLELIATIMTEEER TFSEO; RIRN ECUQHSU EDI VIINMA LEDENENSSTIIOGSN NFS.OR 012407-A Figure 38. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-8) Dimensions shown in millimeters and (inches) 8.75 (0.3445) 8.55 (0.3366) 4.00 (0.1575) 14 8 6.20 (0.2441) 3.80 (0.1496) 1 7 5.80 (0.2283) 1.27 (0.0500) 0.50 (0.0197) BSC 1.75 (0.0689) 0.25 (0.0098) 45° 0.25 (0.0098) 1.35 (0.0531) 8° 0.10 (0.0039) 0° COPLANARITY SEATING 0.10 0.51 (0.0201) PLANE 0.25 (0.0098) 1.27 (0.0500) 0.31 (0.0122) 0.17 (0.0067) 0.40 (0.0157) COMPLIANTTO JEDEC STANDARDS MS-012-AB C(RINOEFNPETARRREOENNLCLTEIHN EOGSN EDLSIYM)AEANNRDSEI AORRNOESU NANORDEET DAIN-PO MPFRIFLO LMPIIMRLELIATIMTEEER TFSEO; RIRN ECUQHSU EDI VIINMA LEDENENSSTIIOGSN NFS.OR 060606-A Figure 39. 14-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-14) Dimensions shown in millimeters and (inches) Rev. E | Page 19 of 20

ADM3070E/ADM3071E/ADM3072E/ADM3073E/ADM3074E/ADM3075E/ADM3076E/ADM3077E/ADM3078E ORDERING GUIDE Temperature Package Ordering Model Range Package Description Option Quantity ADM3070EARZ1 −40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 ADM3070EARZ-REEL71 −40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3070EYRZ1 −40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 ADM3070EYRZ-REEL71 −40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3071EARZ1 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3071EARZ-REEL71 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3071EYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3071EYRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3072EARZ1 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3072EARZ-REEL71 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3072EYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3072EYRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3073EARZ1 −40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 ADM3073EARZ-REEL71 −40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3073EYRZ1 −40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 ADM3073EYRZ-REEL71 −40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3074EARZ1 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3074EARZ-REEL71 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3074EYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3074EYRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3075EARZ1 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3075EARZ-REEL71 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3075EWYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3075EWYRZ-RL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3075EYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3075EYRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3076EARZ1 −40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 ADM3076EARZ-REEL71 −40°C to +85°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3076EYRZ1 −40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 ADM3076EYRZ-REEL71 −40°C to +125°C 14-Lead Standard Small Outline Package (SOIC_N) R-14 1,000 ADM3077EARZ1 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3077EARZ-REEL71 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3077EYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3077EYRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3078EARZ1 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3078EARZ-REEL71 −40°C to +85°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 ADM3078EYRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 ADM3078EYRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8 1,000 1 Z = RoHS Compliant Part. ©2006–2009 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06285-0-8/09(E) Rev. E | Page 20 of 20