Signal and Power Isolated CAN Transceiver with Integrated Isolated DC-to-DC Converter Data Sheet ADM3053 FEATURES GENERAL DESCRIPTION 2.5 kV rms signal and power isolated CAN transceiver The ADM3053 is an isolated controller area network (CAN) isoPower integrated isolated dc-to-dc converter physical layer transceiver with an integrated isolated dc-to-dc 5 V operation on V converter. The ADM3053 complies with the ISO 11898 standard. CC 5 V or 3.3 V operation on VIO The device employs Analog Devices, Inc., iCoupler® technology Complies with ISO 11898 standard to combine a 2-channel isolator, a CAN transceiver, and Analog High speed data rates of up to 1 Mbps Devices isoPower® dc-to-dc converter into a single SOIC surface Unpowered nodes do not disturb the bus mount package. An on-chip oscillator outputs a pair of square Connect 110 or more nodes on the bus waveforms that drive an internal transformer to provide isolated Slope control for reduced EMI power. The device is powered by a single 5 V supply realizing a Thermal shutdown protection fully isolated CAN solution. High common-mode transient immunity: >25 kV/μs The ADM3053 creates a fully isolated interface between the Safety and regulatory approvals CAN protocol controller and the physical layer bus. It is capable UL recognition of running at data rates of up to 1 Mbps. 2500 V rms for 1 minute per UL 1577 CSA Component Acceptance Notice 5A The device has current limiting and thermal shutdown features VDE Certificate of Conformity to protect against output short circuits. The part is fully specified DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 over the industrial temperature range and is available in a V = 560 V peak 20-lead, wide-body SOIC package. IORM Industrial operating temperature range (−40°C to +85°C) The ADM3053 contains isoPower technology that uses high Available in wide-body, 20-lead SOIC package frequency switching elements to transfer power through the APPLICATIONS transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to the CAN data buses AN-0971 Application Note, Recommendations for Control of Industrial field networks Radiated Emissions with isoPower Devices, for details on board layout considerations. FUNCTIONAL BLOCK DIAGRAM VCC isoPower DC-TO-DC CONVERTER ADM3053 VISOOUT OSCILLATOR RECTIFIER VISOIN REGULATOR VCC VIO TxD PROTECTION RS DIGITAL ISOLATIONiCoupler DRIVER RS SLOPE/ TxD ENCODE DECODE STANDBY RxD CANH CANL RECEIVER VREF REFERENCE RxD DECODE ENCODE VOLTAGE CAN TRANSCEIVER VREF GND2 GLNOD1GIC SIDE ISBOALRARTIEIORN PIN 11, PGINN D123 BUS SIDE GPINND 126, PIN 20 09293-001 Figure 1. Rev. E Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Tel: 781.329.4700 ©2011–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com

ADM3053 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Circuit Description......................................................................... 13 Applications ....................................................................................... 1 CAN Transceiver Operation ..................................................... 13 General Description ......................................................................... 1 Signal Isolation ........................................................................... 13 Functional Block Diagram .............................................................. 1 Power Isolation ........................................................................... 13 Revision History ............................................................................... 2 Truth Tables................................................................................. 13 Specifications ..................................................................................... 3 Thermal Shutdown .................................................................... 13 Timing Specifications .................................................................. 4 DC Correctness and Magnetic Field Immunity ........................... 14 Switching Characteristics ............................................................ 4 Applications Information .............................................................. 15 Regulatory Information ............................................................... 5 PCB Layout ................................................................................. 15 Insulation and Safety-Related Specifications ............................ 5 EMI Considerations ................................................................... 15 VDE 0884 Insulation Characteristics ........................................ 6 R Pin ............................................................................................ 16 S Absolute Maximum Ratings ............................................................ 7 Insulation Lifetime ..................................................................... 16 ESD Caution .................................................................................. 7 Typical Applications ....................................................................... 17 Pin Configuration and Function Descriptions ............................. 8 Outline Dimensions ....................................................................... 18 Typical Performance Characteristics ............................................. 9 Ordering Guide .......................................................................... 18 Test Circuits ..................................................................................... 12 REVISION HISTORY 12/2017—Rev. D to Rev. E 11/2016—Rev. B to Rev. C Changes to Logic Side isoPower Current, Dominant State Change to Table 4 .............................................................................. 5 Parameter and TxD/RxD Data Rate 1 Mbps Parameter, Changes to Figure 11 Caption ...................................................... 10 Table 1 ................................................................................................ 3 Changes to Ordering Guide .......................................................... 18 Moved Figure 3 ................................................................................. 4 Change to T Junction Temperature, Table 6 ................................ 7 2/2013—Rev. A to Rev. B J Changes to Figure 28 ...................................................................... 15 Changes to Features Section ............................................................ 1 Changes to Table 3 ............................................................................. 5 7/2017—Rev. C to Rev. D Changes to Table 7 ............................................................................. 7 Moved Figure 1 ................................................................................. 3 Changes to Figure 1 .......................................................................... 3 3/2012—Rev. 0 to Rev. A Change to Tracking Resistance (Comparative Tracking Changes to Features Section ............................................................ 1 Index) Parameter, Table 4 ................................................................ 6 Changes to Table 3 ............................................................................. 5 Changes to Table 8 ............................................................................ 9 Changes to VDE 0884 Insulation Characteristics Section ........... 6 Changes to Power Isolation Section ............................................. 14 Changes to Figure 6 ........................................................................... 9 Changes to PCB Layout Section and Figure 28 .......................... 16 Changes to Figure 11 ...................................................................... 10 Added R Pin Section ..................................................................... 17 Changes to Applications Information Section ........................... 15 S Changes to Figure 32 ...................................................................... 18 5/2011—Revision 0: Initial Version Rev. E | Page 2 of 18

Data Sheet ADM3053 SPECIFICATIONS All voltages are relative to their respective grounds; 4.5 V ≤ V ≤ 5.5 V; 3.0 V ≤ V ≤ 5.5 V. All minimum/maximum specifications apply CC IO over the entire recommended operation range, unless otherwise noted. All typical specifications are at T = 25°C, V = 5 V, and V = 5 V A CC IO unless otherwise noted. Table 1. Parameter Symbol Min Typ Max Unit Test Conditions/Comments SUPPLY CURRENT Logic Side isoPower Current Recessive State I 29 36 mA R = 60 Ω, R = low, see Figure 25 CC L S Dominant State I 195 260 mA R = 60 Ω, R = low, see Figure 25 CC L S TxD/RxD Data Rate 1 Mbps I 139 200 mA R = 60 Ω, R = low, see Figure 25 CC L S Logic Side iCoupler Current TxD/RxD Data Rate 1 Mbps I 1.6 2.5 mA IO DRIVER Logic Inputs Input Voltage High V 0.7 V V Output recessive IH IO Input Voltage Low V 0.25 V V Output dominant IL IO CMOS Logic Input Currents I , I 500 µA TxD IH IL Differential Outputs Recessive Bus Voltage V , V 2.0 3.0 V TxD = high, R = ∞, see Figure 22 CANL CANH L CANH Output Voltage V 2.75 4.5 V TxD = low, see Figure 22 CANH CANL Output Voltage V 0.5 2.0 V TxD = low, see Figure 22 CANL Differential Output Voltage V 1.5 3.0 V TxD = low, R = 45 Ω, see Figure 22 OD L V −500 +50 mV TxD = high, R = ∞, see Figure 22 OD L Short-Circuit Current, CANH I −200 mA V = −5 V SCCANH CANH −100 mA V = −36 V CANH Short-Circuit Current, CANL I 200 mA V = 36 V SCCANL CANL RECEIVER Differential Inputs Differential Input Voltage Recessive V −1.0 +0.5 V −7 V < V , V < +12 V, see Figure 23, IDR CANL CANH C = 15 pF L Differential Input Voltage Dominant V 0.9 5.0 V −7 V < V , V < +12 V, see Figure 23, IDD CANL CANH C = 15 pF L Input Voltage Hysteresis V 150 mV See Figure 3 HYS CANH, CANL Input Resistance R 5 25 kΩ IN Differential Input Resistance R 20 100 kΩ DIFF Logic Outputs Output Low Voltage V 0.2 0.4 V I = 1.5 mA OL OUT Output High Voltage V V − 0.3 V − 0.2 V I = −1.5 mA OH IO IO OUT Short Circuit Current I 7 85 mA V = GND1 or V OS OUT IO VOLTAGE REFERENCE Reference Output Voltage V 2.025 3.025 V |I = 50 µA| REF REF COMMON-MODE TRANSIENT IMMUNITY1 25 kV/µs V = 1 kV, transient magnitude = 800 V CM SLOPE CONTROL Current for Slope Control Mode I −10 −200 µA SLOPE Slope Control Mode Voltage V 1.8 3.3 V SLOPE 1 CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification compliant operation. VCM is the common-mode potential difference between the logic and bus sides. The transient magnitude is the range over which the common mode is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges. Rev. E | Page 3 of 18

ADM3053 Data Sheet TIMING SPECIFICATIONS All voltages are relative to their respective ground; 3.0 V ≤ V ≤ 5.5 V; 4.5 V ≤ V ≤ 5.5 V. T = −40°C to +85°C, unless otherwise noted. IO CC A Table 2. Parameter Symbol Min Typ Max Unit Test Conditions/Comments DRIVER Maximum Data Rate 1 Mbps Propagation Delay from TxD On to Bus Active t 90 ns R = 0 Ω; see Figure 2 and Figure 24 onTxD S R = 60 Ω, C = 100 pF L L Propagation Delay from TxD Off to Bus Inactive t 120 ns R = 0 Ω; see Figure 2 and Figure 24 offTxD S R = 60 Ω, C = 100 pF L L RECEIVER Propagation Delay from TxD On to Receiver Active t 200 ns R = 0 Ω; see Figure 2 onRxD S 630 ns R = 47 kΩ; see Figure 2 S Propagation Delay from TxD Off to Receiver Inactive1 t 250 ns R = 0 Ω; see Figure 2 offRxD S 480 ns R = 47 kΩ; see Figure 2 S CANH, CANL SLEW RATE |SR| 7 V/µs R = 47 kΩ S 1 Guaranteed by design and characterization. SWITCHING CHARACTERISTICS VIO 0.7VIO VTxD 0.25VIO 0V VOD VDIFF = VCANH – VCANL VDIFF 0.9V 0.5V VOR tonTxD toffTxD VIO VIO – 0.3V VRxD 0.4V 0V tonRxD toffRxD 09293-002 Figure 2. Driver Propagation Delay, Rise/Fall Timing VRxD HIGH LOW VHYS 0.5 0.9 VID (V) 09293-004 Figure 3. Receiver Input Hysteresis Rev. E | Page 4 of 18

Data Sheet ADM3053 REGULATORY INFORMATION Table 3. ADM3053 Approvals Organization Approval Type Notes UL Recognized under the Component Recognition In accordance with UL 1577, each ADM3053 is proof tested by applying Program of Underwriters Laboratories, Inc. an insulation test voltage ≥2500 V rms for 1 second. File E214100. VDE Certified according to DIN EN 60747-5-2 (VDE In accordance with VDE 0884-2. File 2471900-4880-0001. 0884 Part 2): 2003-01. CSA Approved under CSA Component Acceptance Basic insulation at 760 V rms (1074 V peak) working voltage. Reinforced Notice 5A. Testing was conducted per CSA insulation at 380 V rms (537 V peak) working voltage. 60950-1-07 and IEC 60950-1, 2nd Edition at Basic insulation at 424 V rms (600 V peak) working voltage. Reinforced 2.5 kV rated voltage. insulation at 300 V rms (424 V peak) working voltage. Testing was conducted per CSA 61010-1-04 File 205078. and IEC 61010-1 2nd Edition at 2.5 kV rated voltage. INSULATION AND SAFETY-RELATED SPECIFICATIONS Table 4. Parameter Symbol Value Unit Test Conditions/Comments Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration Minimum External Air Gap (Clearance) L(I01) 7.7 mm Measured from input terminals to output terminals, shortest distance through air Minimum External Tracking (Creepage) L(I02) 7.6 mm Measured from input terminals to output terminals, shortest distance along body Minimum Internal Gap (Internal 0.017 min mm Insulation distance through insulation Clearance) Tracking Resistance (Comparative CTI >400 V DIN IEC 112/VDE 0303-1 Tracking Index) Isolation Group II Material group (DIN VDE 0110: 1989-01, Table 1) Rev. E | Page 5 of 18

ADM3053 Data Sheet VDE 0884 INSULATION CHARACTERISTICS This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by means of protective circuits. Table 5. Description Test Conditions/Comments Symbol Characteristic Unit CLASSIFICATIONS Installation Classification per DIN VDE 0110 for Rated Mains Voltage ≤150 V rms I to IV ≤300 V rms I to III ≤400 V rms I to II Climatic Classification 40/85/21 Pollution Degree DIN VDE 0110, see Table 3 2 VOLTAGE Maximum Working Insulation Voltage V 560 V IORM PEAK Input-to-Output Test Voltage V PR Method b1 V × 1.875 = V , 100% production tested, 1050 V IORM PR PEAK t = 1 sec, partial discharge < 5 pC m Highest Allowable Overvoltage (Transient overvoltage, t = 10 sec) V 4000 V TR TR PEAK SAFETY-LIMITING VALUES Maximum value allowed in the event of a failure Case Temperature T 150 °C S Input Current I 265 mA S, INPUT Output Current I 335 mA S, OUTPUT Insulation Resistance at T V = 500 V R >109 Ω S IO S Rev. E | Page 6 of 18

Data Sheet ADM3053 ABSOLUTE MAXIMUM RATINGS T = 25°C, unless otherwise noted. All voltages are relative to A Table 7. Maximum Continuous Working Voltage1 their respective ground. Parameter Max Unit Reference Standard AC Voltage Table 6. Bipolar Waveform 424 V peak 50 year minimum Parameter Rating lifetime V −0.5 V to +6 V CC Unipolar Waveform V −0.5 V to +6 V IO Basic Insulation 1074 V peak Maximum approved Digital Input Voltage, TxD −0.5 V to V + 0.5 V IO working voltage per Digital Output Voltage, RxD −0.5 V to VIO + 0.5 V IEC60950-1 CANH, CANL −36 V to +36 V Reinforced Insulation 537 V peak Maximum approved VREF −0.5 V to +6 V working voltage per R −0.5 V to +6 V IEC60950-1 S Operating Temperature Range −40°C to +85°C DC Voltage Storage Temperature Range −55°C to +150°C Basic Insulation 1074 V peak Maximum approved ESD (Human Body Model) 3 kV working voltage per IEC60950-1 Lead Temperature Reinforced Insulation 537 V peak Maximum approved Soldering (10 sec) 300°C working voltage per Vapor Phase (60 sec) 215°C IEC60950-1 Infrared (15 sec) 220°C θ Thermal Impedance 53°C/W 1 Refers to continuous voltage magnitude imposed across the isolation JA barrier. See the Insulation Lifetime section for more details. TJ Junction Temperature 150°C ESD CAUTION Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. E | Page 7 of 18

ADM3053 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND1 1 20 GND2 NC 2 19 VISOIN GND1 3 18 RS RxD 4 17 CANH ADM3053 TxD 5 16 GND2 TOP VIEW VIO 6 (Not to Scale) 15 CANL GND1 7 14 VREF VCC 8 13 GND2 GND1 9 12 VISOOUT GND1 10 11 GND2 NOTES 1.NC = NO CONNECT. DO NOT 2.CPCIOONNN 1NN2EE ACCNTTDE T DPO IE NTX H1T9IES R MPNIUNAS.LTL BYE. 09293-005 Figure 4. Pin Configuration Table 8. Pin Function Descriptions Pin No. Mnemonic Description 1, 3, 7, 9, 10 GND1 Ground, Logic Side. 2 NC No Connect. Do not connect to this pin. 4 RxD Receiver Output Data. 5 TxD Driver Input Data. 6 VIO iCoupler Power Supply. It is recommended that a 0.1 μF and a 0.01 μF decoupling capacitor be fitted between Pin 6 and GND1. See Figure 28 for layout recommendations. 8 VCC isoPower Power Supply. It is recommended that a 0.1 μF and a 10 μF decoupling capacitor be fitted between Pin 8 and Pin 9. 11, 13 GND2 Ground for Isolated DC-to-DC Converter. It is recommended to connect Pin 11 and Pin 13 together through one ferrite bead to the PCB ground. 12 V Isolated Power Supply Output. This pin must be connected externally to V . It is recommended that a ferrite ISOOUT ISOIN bead reservoir capacitor of 10 μF and a decoupling capacitor of 0.1 μF be fitted between Pin 12 and Pin 11. 14 V Reference Voltage Output. It is recommended not to connect to this pin. REF 15 CANL Low-Level CAN Voltage Input/Output. 16, 20 GND2 Ground, Bus Side. 17 CANH High-Level CAN Voltage Input/Output. 18 R Slope Control Pin. Short this pin to GND2 (Pin 16 or Pin 20) for full speed operation. Use a weak pull-down for S slope control. An input high places the transceiver in standby. This pin must not be left floating. 19 V Isolated Power Supply Input. This pin must be connected externally to V . It is recommended this pin ISOIN ISOOUT have a 0.1 μF capacitor to GND2 (Pin13 or Pin 11). Connect this pin through a ferrite bead and short trace length to V for operation. ISOIN Rev. E | Page 8 of 18

Data Sheet ADM3053 TYPICAL PERFORMANCE CHARACTERISTICS 160 180 140 VCC = 4.5V, VIO = 5V mV) 175 RRENT, I (mA)CC 11028000 VCC = 5V, VIO = 5V VCC = 5.5V, VIO = 5V T HYSTERESIS ( 117605 U U LY C 60 R INP 160 SUPP 40 CEIVE VCC = 5V, VIO = 5V RE 155 20 VCC = 5V, VIO = 3.3V 0 150 100 DATA RATE (kbps) 1000 09293-100 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-103 Figure 5. Supply Current, ICC vs. Data Rate Figure 8. Receiver Input Hysteresis vs. Temperature 50 53 E, V 45 TI C A 52 40 S U B 35 O EW RATE (V/µs) 322050 ELAY TxD ON Tt (ns)onTxD5510 VCC = 5V, VIO = 3.3V SL 15 ON D 49 TI VCC = 5V, VIO = 5V 10 A G 48 A 5 OP R P 0 47 0 10 20 RE3S0ISTAN4C0E, RS 5(k0Ω) 60 70 80 09293-101 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-104 Figure 6. Driver Slew Rate vs. Resistance, RS Figure 9. Propagation Delay from TxD On to Bus Active vs. Temperature 5.5 96 US 94 B URRENT, I (mA)IO 43..55 DELAY TxD OFF TO tVE, (ns)offTxD99882086 VCC = 5V, VIO = 3.3V PPLY C 2.5 ATION INACTI 84 VCC = 5V, VIO = 5V SU VIO = 5V AG 82 1.5 P O R VIO = 3.3V P 80 0.5100 DATA RATE (kbps) 1000 09293-102 78–40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-105 Figure 7. Supply Current, IIO vs. Data Rate Figure 10. Propagation Delay from TxD Off to Bus Inactive vs. Temperature Rev. E | Page 9 of 18

ADM3053 Data Sheet 152 330 PROPAGATION DELAY TxD ON TO RECEIVERtACTIVE, (ns)onRxD111111115444443308642086 VCC = 5VV, VCCIO == 53V.3, VV,I OR =S =5V 0,Ω RS = 0Ω PROPAGATION DELAY TxD OFF TO RECEIVERtINACTIVE, (ns)offRxD333333222222110099885050505050 VCC = 5VV,C VCI O= =5 V3,. 3VVIO, R=S 5 =V ,4 R7kSΩ = 47kΩ 134 275 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-106 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-109 Figure 11. Propagation Delay from TxD On to Receiver Active vs. Figure 14. Propagation Delay from TxD Off to Receiver Inactive vs. Temperature Temperature 600 2.55 R VCC = 5V, VIO = 3.3V, RS = 47kΩ T, E N V A ECEI 500 VCC = 5V, VIO = 5V, RS = 47kΩ OMIN 2.50 O R E D N Tns)400 AG 2.45 AGATION DELAY TxD OtACTIVE, (onRxD321000000 RENTIAL OUTPUT VOLTV (V)OD222...433050 VVVVCCCCCCCC ==== 5555VVVV,,,, VVVVIIIIOOOO ==== 5353V.V.33,,VV RR,, LLRR ==LL ==6405 64ΩΩ05ΩΩ OP FE R F P DI 0 2.25 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-107 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-110 Figure 12. Propagation Delay from TxD On to Receiver Active vs. Figure 15. Differential Output Voltage Dominant vs. Temperature Temperature 250 2.55 EIVER VCC = 5V, VIO = 3.3V, RS = 0Ω NANT, VIO = 5V, TA = 25°C, RL = 60Ω REC 200 OMI 2.50 ELAY TxD OFF TO tTIVE, (ns)offRxD115000 VCC = 5V, VIO = 5V, RS = 0Ω UTPUT VOLTAGE DV (V)OD22..4450 GATION DINAC 50 ENTIAL O 2.35 VIO = 5V, TA = 25°C, RL = 45Ω A R 2.30 P E O F PR DIF 0 2.25 –40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-108 4.5 4.7 SUPPL4Y.9 VOLTAGE5,. 1VCC (V) 5.3 5.5 09293-111 Figure 13. Propagation Delay from TxD Off to Receiver Inactive vs. Figure 16. Differential Output Voltage Dominant vs. Supply Voltage, VCC Temperature Rev. E | Page 10 of 18

Data Sheet ADM3053 2.80 4.895 V) 2.75 (H4.890 O E, V (V)REF 22..7605 VVCCCC = = 5 V5V, ,V VIOIO = = 55VV,, IRIREEFF == ++550µµAA OLTAGE, V 44..888805 VCC = 5V, VIO = 5V, IOUT = –1.5mA G V OLTA 2.60 VCC = 5V, VIO = 5V, IREF = –5µA HIGH 4.875 E V VCC = 5V, VIO = 5V, IREF = –50µA UT NC 2.55 TP 4.870 E U R O FE 2.50 R 4.865 E E R V EI 2.45 C 4.860 E R 2.40–40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-112 4.855–40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-115 Figure 17. Reference Voltage vs. Temperature Figure 20. Receiver Output High Voltage vs. Temperature 160 120 VVCIOC = = 5 5VV mV) 140 DRAL T=A 6 0RΩATE = 1Mbps V (OL 100 mA) 120 GE, ENT, I (CC 100 W VOLTA 80 R 80 O 60 Y CUR 60 PUT L PL UT 40 P O SU 40 R E 20 CEIV 20 E R 0–40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-113 0–40 –15 TE1M0PERATURE3 5(°C) 60 85 09293-116 Figure 18. Supply Current ICC vs. Temperature Figure 21. Receiver Output Low Voltage vs. Temperature 140 VIO = 5V 138 TA = 25°C DATA RATE = 1Mbps 136 A) m 134 (C T, IC 132 N 130 E R UR 128 C Y 126 L P UP 124 S 122 120 118 4.5 4.6 4.7 4S.U8PPL4Y.9 VOL5T.0AGE5,. 1VCC (5V.2) 5.3 5.4 5.5 09293-114 Figure 19. Supply Current, ICC vs. Supply Voltage VCC Rev. E | Page 11 of 18

ADM3053 Data Sheet TEST CIRCUITS CANH RL 2 TxD VOD VCANH R2L VOC TxD RL CL VCANH CANL 09293-006 RxD 15pF 09293-008 Figure 22. Driver Voltage Measurement Figure 24. Switching Characteristics Measurements CANH VID RxD CANL CL 09293-007 Figure 23. Receiver Voltage Measurements 100nF 10µF 100nF 10µF VCC VISOOUT isoPower DC-TO-DCCONVERTER OSCILLATOR RECTIFIER REGULATOR VIO VISOIN 10µF 100nF 100nF 10µF VCC DIGITAL ISOLATIONiCoupler TxD PROTECTION RS TxD ENCODE DECODE DRIVER RS RS SLOPE/ STANDBY CANH RxD RxD DECODE ENCODE RL RECEIVER CANL VREF REFERENCE VOLTAGE CAN TRANSCEIVER VREF ADM3053 GND2 GND1 ISOLATION GND2 LOGIC SIDE BARRIER BUS SIDE 09293-009 Figure 25. Supply Current Measurement Test Circuit Rev. E | Page 12 of 18

Data Sheet ADM3053 CIRCUIT DESCRIPTION CAN TRANSCEIVER OPERATION The ADM3053 integrated dc-to-dc converter is designed as a self contained solution and must not drive an external load. To A CAN bus has two states called dominant and recessive. A meet additional isolated power needs, isoPower isolated dc-to- dominant state is present on the bus when the differential voltage dc converters are available in a variety of power or power plus between CANH and CANL is greater than 0.9 V. A recessive state standard data channel options. is present on the bus when the differential voltage between CANH and CANL is less than 0.5 V. During a dominant bus state, the TRUTH TABLES CANH pin is high, and the CANL pin is low. During a recessive The truth tables in this section use the abbreviations found in bus state, both the CANH and CANL pins are in the high Table 9. impedance state. Table 9. Truth Table Abbreviations Pin 18 (R) allows two different modes of operation to be selected: S Letter Description high-speed and slope control. For high-speed operation, the H High level transmitter output transistors are simply switched on and off as L Low level fast as possible. In this mode, no measures are taken to limit the X Don’t care rise and fall slopes. A shielded cable is recommended to avoid Z High impedance (off) electromagnetic interference (EMI) problems. High-speed mode I Indeterminate is selected by connecting Pin 18 to ground. NC Not connected Slope control mode allows the use of an unshielded twisted pair or a parallel pair of wires as bus lines. To reduce EMI, the rise and fall slopes must be limited. The rise and fall slopes can be Table 10. Transmitting programmed with a resistor connected from Pin 18 to ground. Supply Status Input Outputs The slope is proportional to the current output at Pin 18. VIO VCC TxD Bus State CANH CANL On On L Dominant H L SIGNAL ISOLATION On On H Recessive Z Z The ADM3053 signal isolation is implemented on the logic side of On On Floating Recessive Z Z the interface. The part achieves signal isolation by having a digital Off On X Recessive Z Z isolation section and a transceiver section (see Figure 1). Data On Off L Indeterminate I I applied to the TxD pin referenced to logic ground (GND1) are coupled across an isolation barrier to appear at the transceiver Table 11. Receiving section referenced to isolated ground (GND2). Similarly, the single- Supply Status Inputs Output ended receiver output signal, referenced to isolated ground in the transceiver section, is coupled across the isolation barrier to VIO VCC VID = CANH − CANL Bus State RxD appear at the RxD pin referenced to logic ground (GND1). The On On ≥ 0.9 V Dominant L signal isolation is powered by the V pin and allows the digital On On ≤ 0.5 V Recessive H IO interface to 3.3 V or 5 V logic. On On 0.5 V < VID < 0.9 V X1 I On On Inputs open Recessive H POWER ISOLATION Off On X1 X1 I The ADM3053 power isolation is implemented using an isoPower On Off X1 X1 H integrated isolated dc-to-dc converter. The dc-to-dc converter section of the ADM3053 works on principles that are common to 1 X means don’t care. most modern power supplies. It is a secondary side controller THERMAL SHUTDOWN architecture with isolated pulse-width modulation (PWM) feedback. VCC power is supplied to an oscillating circuit that The ADM3053 contains thermal shutdown circuitry that protects switches current into a chip-scale air core transformer. Power the part from excessive power dissipation during fault conditions. transferred to the secondary side is rectified and regulated to 5 V. Shorting the driver outputs to a low impedance source can result in The secondary (VISO) side controller regulates the output by high driver currents. The thermal sensing circuitry detects the creating a PWM control signal that is sent to the primary (VCC) increase in die temperature under this condition and disables the side by a dedicated iCoupler data channel. The PWM modulates driver outputs. This circuitry is designed to disable the driver the oscillator circuit to control the power being sent to the outputs when a die temperature of 150°C is reached. As the secondary side. Feedback allows for significantly higher power device cools, the drivers are reenabled at a temperature of 140°C. and efficiency. Rev. E | Page 13 of 18

ADM3053 Data Sheet DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY 100 X U The digital signals transmit across the isolation barrier using L F iCoupler technology. This technique uses chip-scale transformer TIC 10 E windings to couple the digital signals magnetically from one N side of the barrier to the other. E MAGgauss) 1 Lk Digital inputs are encoded into waveforms that are capable of ABY ( ewxicnidtiinngg ,t hthee p irnimduacreyd t rwaanvsefoforrmmesr awrien ddeicnogd. Aedt tinhteo s tehceo nbdinaarryy ALLOWDENSIT0.1 M value that was originally transmitted. U XIM 0.01 Positive and negative logic transitions at the isolator input cause A M narrow (~1 ns) pulses to be sent to the decoder via the transformer. Tpuhles edse,c ionddeirc aist ibnigst ainbpleu atn lodg isic, tthrearnesfiotrioe,n esi.t hIner t sheet aobr sreensecte b oyf t lhoeg ic 0.0011k 10kMAGNETI1C0 0FkIELD FREQ1MUENCY (Hz1)0M 100M 09293-010 transitions at the input for more than 1 µs, periodic sets of refresh Figure 26. Maximum Allowable External Magnetic Flux Density pulses indicative of the correct input state are sent to ensure dc For example, at a magnetic field frequency of 1 MHz, the correctness at the output. If the decoder receives no internal pulses maximum allowable magnetic field of 0.2 kgauss induces a voltage of more than approximately 5 μs, the input side is assumed to be of 0.25 V at the receiving coil. This is about 50% of the sensing unpowered or nonfunctional, in which case, the isolator output threshold and does not cause a faulty output transition. Similarly, is forced to a default state by the watchdog timer circuit. if such an event occurs during a transmitted pulse (and is of the This situation must occur in the ADM3053 devices only during worst-case polarity), it reduces the received pulse from >1.0 V to power-up and power-down operations. The limitation on the 0.75 V, which is still well above the 0.5 V sensing threshold of ADM3053 magnetic field immunity is set by the condition in the decoder. which induced voltage in the transformer receiving coil is The preceding magnetic flux density values correspond to sufficiently large to either falsely set or reset the decoder. The specific current magnitudes at given distances from the following analysis defines the conditions under which this ADM3053 transformers. Figure 27 expresses these allowable can occur. current magnitudes as a function of frequency for selected The 3.3 V operating condition of the ADM3053 is examined distances. As shown in Figure 27, the ADM3053 is extremely because it represents the most susceptible mode of operation. The immune and can be affected only by extremely large currents pulses at the transformer output have an amplitude of >1.0 V. The operated at high frequency very close to the component. For the decoder has a sensing threshold of about 0.5 V, thus establishing a 1 MHz example, a 0.5 kA current must be placed 5 mm away from 0.5 V margin in which induced voltages can be tolerated. The the ADM3053 to affect component operation. voltage induced across the receiving coil is given by 1k V = (−dβ/dt)Σπrn2; n = 1, 2, … , N A) DISTANCE = 1m k where: NT ( 100 E β is magnetic flux density (gauss). RR U N is the number of turns in the receiving coil. E C 10 rn is the radius of the nth turn in the receiving coil (cm). ABL DISTANCE = 100mm W Given the geometry of the receiving coil in the ADM3053 and LO 1 L an imposed requirement that the induced voltage be, at most, M A DISTANCE = 5mm 50% of the 0.5 V margin at the decoder, a maximum allowable MU XI 0.1 magnetic field is calculated as shown in Figure 26. A M 0.01 1k 10kMAGNET1IC00 FkIELD FRE1QMUENCY (H1z0)M 100M 09293-011 Figure 27. Maximum Allowable Current for Various Current-to-ADM3053 Spacings Note that in combinations of strong magnetic field and high frequency, any loops formed by the printed circuit board (PCB) traces can induce error voltages sufficiently large to trigger the thresholds of succeeding circuitry. Proceed with caution in the layout of such traces to prevent this from occurring. Rev. E | Page 14 of 18

Data Sheet ADM3053 APPLICATIONS INFORMATION PCB LAYOUT ADM3053 0.01µF0.1µF The ADM3053 signal and power isolated CAN transceiver contains 1 GND1 GND2 20 an isoPower integrated dc-to-dc converter, requiring no external 2 NC VISOIN 19 interface circuitry for the logic interfaces. Power supply bypassing 3 GND1 RS 18 4 RxD CANH 17 is required at the input and output supply pins (see Figure 28). 5 TxD GND2 16 0.1µF0.01µF The power supply section of the ADM3053 uses a 180 MHz 6 VIO CANL 15 oscillator frequency to pass power efficiently through its chip- 7 GND1 VREF 14 0.1µF 10µF scale transformers. In addition, the normal operation of the 8 VCC GND2 13 tdhaet ap soewcteiro snu opfp tlhy ep iiCnso. u pler introduces switching transients on 10µF 0.1µF 190 GGNNDD11 VISGONODU2T 1121 FERRITES 09293-028 Figure 28. Recommended PCB Layout Bypass capacitors are required for several operating frequencies. Noise suppression requires a low inductance, high frequency In applications involving high common-mode transients, ensure capacitor, whereas ripple suppression and proper regulation that board coupling across the isolation barrier is minimized. require a large value capacitor. These capacitors are connected Furthermore, design the board layout such that any coupling between GND1 and Pin 6 (V ) for V . It is recommended that that does occur equally affects all pins on a given component side. IO IO a combination of 100 nF and 10 nF be placed as shown in Figure 28 Failure to ensure this can cause voltage differentials between pins (C6 and C4). It is recommended that a combination of two exceeding the absolute maximum ratings for the device, thereby capacitors, with values of 100 nF and 10 µF, are placed between leading to latch-up and/or permanent damage. Pin 8 (V ) and Pin 9 (GND1) for V as shown in Figure 28 (C2 CC CC The ADM3053 dissipates approximately 650 mW of power when and C1). The V and V capacitors are connected between ISOIN ISOOUT fully loaded. Because it is not possible to apply a heat sink to an Pin 11 (GND2) and Pin 12 (V ) with recommended values ISOOUT isolation device, the devices primarily depend on heat dissipation of 100 nF and 10 µF as shown in Figure 28 (C5 and C8). Two into the PCB through the GND pins. If the devices are used at capacitors are recommended to be fitted Pin 19 (V ) and Pin 20 ISOIN high ambient temperatures, provide a thermal path from the GND (GND2) with values of 100nF and 10nF as shown in Figure 28 pins to the PCB ground plane. The board layout in Figure 28 shows (C9 and C7). The best practice recommended is to use a very low enlarged pads for Pin 1, Pin 3, Pin 9, Pin 10, Pin 11, Pin 14, Pin 16, inductance ceramic capacitor, or its equivalent, for the smaller and Pin 20. Implement multiple vias from the pad to the ground value. The total lead length between both ends of the capacitor plane to reduce the temperature inside the chip significantly. The and the input power supply pin must not exceed 10 mm. dimensions of the expanded pads are at the discretion of the The ADM3053 features an internal split paddle, lead frame on the designer and dependent on the available board space. bus side. For the best noise suppression, filter both the GND2 EMI CONSIDERATIONS pins (Pin 11 and Pin13) and V signals of the integrated dc- ISOOUT to-dc converter for high frequency currents. Use surface-mount The dc-to-dc converter section of the ADM3053 must, of necessity, ferrite beads in series with the signals before routing back to the operate at very high frequency to allow efficient power transfer device. See Figure 28 for the recommended PCB layout. through the small transformers. This creates high frequency currents that can propagate in circuit board ground and power The impedance of the ferrite bead is chosen to be about 2 kΩ planes, causing edge and dipole radiation. Grounded enclosures between the 100 MHz and 1 GHz frequency range, to reduce are recommended for applications that use these devices. If the emissions at the 180 MHz primary switching frequency and grounded enclosures are not possible, good RF design practices the 360 MHz secondary side rectifying frequency and must be followed in the layout of the PCB. See the AN-0971 harmonics. Application Note, Recommendations for Control of Radiated Emissions with isoPower Devices, for more information. Rev. E | Page 15 of 18

ADM3053 Data Sheet R PIN Bipolar ac voltage is the most stringent environment. A 50 year S operating lifetime under the bipolar ac condition determines For high speed mode, the R pin is connected directly to GND2 S the Analog Devices recommended maximum working voltage. (Pin 16 or Pin 20). The transition time of the CAN bus signals are short as possible, allowing higher speed signaling. A shielded In the case of unipolar ac or dc voltage, the stress on the insulation cable is recommended to avoid EMI problems in high speed mode. is significantly lower. This allows operation at higher working voltages while still achieving a 50 year service life. The working Slope control mode allows the use of unshielded twisted pair voltages listed in Table 5 can be applied while maintaining the wires or parallel pair wires as bus lines. The signal rise and fall 50 year minimum lifetime, provided the voltage conforms to either transition times are slowed to reduce EMI and ringing. The rise the unipolar ac or dc voltage cases. Any cross insulation voltage and fall slopes are adjusted with the resistor (R ) connected SLOPE waveform that does not conform to Figure 30 or Figure 31 must from R to GND2. See Figure 6 for details. S be treated as a bipolar ac waveform, and its peak voltage must The R pin cannot be left floating. S be limited to the 50-year lifetime voltage value listed in Table 5. INSULATION LIFETIME RATED PEAK VOLTAGE Avolllt iangseu slatrteiossn osvtreur cat usurefsfi ceiveennttluy alollny gb rpeearkio ddo. wTnh ew rhaeten o sfu ibnjseucltaetdio tno 0V 09293-013 degradation is dependent on the characteristics of the voltage Figure 29. Bipolar AC Waveform waveform applied across the insulation. Analog Devices conducts RATED PEAK VOLTAGE an extensive set of evaluations to determine the lifetime of the iAncscuellaetrioatne dst lriufec ttuerseti nwgi tihsi pne trhfoe rAmDeMd u3s0i5n3g. v oltage levels higher 0V 09293-014 Figure 30. DC Waveform than the rated continuous working voltage. Acceleration factors for several operating conditions are determined, allowing calculation RATED PEAK VOLTAGE of the time to failure at the working voltage of interest. The values shown in Table 5 summarize the peak voltages for 50 years of service life in several operating conditions. In many cases, the 0V NOTES working voltage approved by agency testing is higher than the 50 1. THE VOLTAGE IS SHOWN AS SINUSODIAL FOR ILLUSTRATION PURPOSES ONLY. IT IS MEANT TO REPRESENT ANY VOLTAGE ytheea rs eservrvicicee l ilfiefe v vooltlataggee l.i sOtepde lreaatidosn t oa tp wreomrkaitnugr ev oinltsaugleasti honig hfaeirlu trhea. n WTVHOAELV TLEAIFMGOIETR IMCNA GVN AVNRAOYLTIUN CEGR C BOAESNTS WB 0EEV E.PNO S0 IATINVDE SOORM NEE LGIAMTITIVINEG, B VUATL TUHEE. 09293-015 Figure 31. Unipolar AC Waveform The insulation lifetime of the ADM3053 depends on the voltage waveform type imposed across the isolation barrier. The iCoupler insulation structure degrades at different rates, depending on whether the waveform is bipolar ac, unipolar ac, or dc. Figure 29, Figure 30, and Figure 31 illustrate these different isolation voltage waveforms. Rev. E | Page 16 of 18

Data Sheet ADM3053 TYPICAL APPLICATIONS Figure 32 is an example circuit diagram using the ADM3053. 5V SUPPLY 100nF 10µF 10µF 100nF VCC VISOOUT PIN 11, PGINN D123 isoPowerDC-TO-DCCONVERTER OSCILLATOR RECTIFIER 3.3V/5V SUPPLY REGULATOR VIO VISOIN 10nF 100nF 100nF 10nF VCC DIGITAL ISOLATIONiCoupler TxD TxD PROTECTION RS ENCODE DECODE DRIVER RS RS SLOPE/ CONTCRAONLLER RxD RxD STANDBY CANH CANH DECODE ENCODE RT CANL RECEIVER CANL VREF REFERENCE VOLTAGE BUS CAN TRANSCEIVER VREF CONNECTOR ADM3053 GND2 GND1 GND2 LOGIC SIDE ISBOALRARTIEIORN BUS SIDE PIN 16, PIN 20 09293-016 Figure 32. Example Circuit Diagram Using the ADM3053 Rev. E | Page 17 of 18

ADM3053 Data Sheet OUTLINE DIMENSIONS 13.00(0.5118) 12.60(0.4961) 20 11 7.60(0.2992) 7.40(0.2913) 1 10 10.65(0.4193) 10.00(0.3937) 0.75(0.0295) 45° 2.65(0.1043) 0.25(0.0098) 0.30(0.0118) 2.35(0.0925) 8° 0.10(0.0039) 0° COPLANARITY 0.10 (01.0.25700) 00..5311((00..00210212)) SPLEAATNIENG 00..3230((00..00103709)) 10..2470((00..00150507)) BSC (RCINEOFNPEATRRREOENNLCLTEIHNCEOGOSNDMELISPYM)LAEAIANNRNDSETIAORTRNOOESUJNANEORDDETEEDAICN-POSMPFTRIFALONLMPIDMIRLAELIRATIMTDEEESRTFSMEO;SRIRN-0ECU1QH3SU-EADIVCIINMAELDENENSSTIIOGSNNFS.OR 06-07-2006-A Figure 33. 20-Lead Standard Small Outline Package [SOIC_W] Wide Body (RW-20) Dimensions shown in millimeters and (inches) ORDERING GUIDE Package Model1 Temperature Range Package Description Option ADM3053BRWZ −40°C to +85°C 20-Lead Standard Small Outline Package [SOIC_W] RW-20 ADM3053BRWZ-REEL7 −40°C to +85°C 20-Lead Standard Small Outline Package [SOIC_W] RW-20 EVAL-ADM3053EBZ Evaluation Board EZLINX-IIIDE-EBZ iCoupler Isolated Interface Development Environment Evaluation Board 1 Z = RoHS Compliant Part. ©2011–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09293-0-12/17(E) Rev. E | Page 18 of 18

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: A nalog Devices Inc.: EVAL-ADM3053EBZ EZLINX-IIIDE-EBZ ADM3053BRWZ-REEL7 ADM3053BRWZ