MCP16301 2 300 mA D PAK Demo Board User’s Guide © 2011 Microchip Technology Inc. DS51983A

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. PIC32 logo, rfPIC and UNI/O are registered trademarks of MICROCHIP MAKES NO REPRESENTATIONS OR Microchip Technology Incorporated in the U.S.A. and other WARRANTIES OF ANY KIND WHETHER EXPRESS OR countries. IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, INCLUDING BUT NOT LIMITED TO ITS CONDITION, MXDEV, MXLAB, SEEVAL and The Embedded Control QUALITY, PERFORMANCE, MERCHANTABILITY OR Solutions Company are registered trademarks of Microchip FITNESS FOR PURPOSE. Microchip disclaims all liability Technology Incorporated in the U.S.A. arising from this information and its use. Use of Microchip Analog-for-the-Digital Age, Application Maestro, CodeGuard, devices in life support and/or safety applications is entirely at dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, the buyer’s risk, and the buyer agrees to defend, indemnify and ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial hold harmless Microchip from any and all damages, claims, Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified suits, or expenses resulting from such use. No licenses are logo, MPLIB, MPLINK, mTouch, Omniscient Code conveyed, implicitly or otherwise, under any Microchip Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, intellectual property rights. PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 978-1-61341-179-7 Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51983A-page 2 © 2011 Microchip Technology Inc.

2 MCP16301 300 mA D PAK DEMO BOARD USER’S GUIDE Table of Contents Preface ...........................................................................................................................5 Introduction............................................................................................................5 Document Layout..................................................................................................5 Conventions Used in this Guide............................................................................6 Recommended Reading........................................................................................7 The Microchip Web Site........................................................................................7 Customer Support.................................................................................................7 Document Revision History...................................................................................7 Chapter 1. Product Overview 1.1 Introduction .....................................................................................................9 1.2 MCP16301 Short Overview ............................................................................9 1.3 What is the MCP16301 300 mA D2PAK Demo Board? ...............................10 1.4 What Does the MCP16301 300 mA D2PAK Demo Board Kit Contain? .......10 Chapter 2. Installation and Operation 2.1 Introduction ...................................................................................................11 2.2 Getting Started .............................................................................................12 Appendix A. Schematics and Layouts A.1 Introduction ..................................................................................................13 A.2 Board – Schematic .......................................................................................14 A.3 Board – Top Silk and Pads ..........................................................................15 A.4 Board – Top Copper Layer ..........................................................................15 A.5 Board – Bottom Copper Layer .....................................................................16 Appendix B. Bill of Materials (BOM) Worldwide Sales and Service ....................................................................................18 © 2011 Microchip Technology Inc. DS51983A-page 3

2 MCP16301 300 mA D PAK Demo Board User’s Guide DS51983A-page 4 © 2011 Microchip Technology Inc.

2 MCP16301 300 mA D PAK DEMO BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP16301 300 mA D2PAK Demo Board. Items discussed in this chapter include: • Document Layout • Conventions Used in this Guide • Recommended Reading • The Microchip Web Site • Customer Support • Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP16301 300 mA D2PAK Demo Board as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1.“Product Overview” – Important information about the MCP16301 300 mA D2PAK Demo Board. • Chapter 2.“Installation and Operation” – Includes instructions on how to get started with MCP16301 300 mA D2PAK Demo Board and a description of the user’s guide. • Appendix A.“Schematics and Layouts” – Shows the schematic and layout diagrams for the MCP16301 300 mA D2PAK Demo Board. • Appendix B.“Bill of Materials (BOM)” – Lists the parts used to build the MCP16301 300 mA D2PAK Demo Board. © 2011 Microchip Technology Inc. DS51983A-page 5

2 MCP16301 300 mA D PAK Demo Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Represents Examples Arial font: Italic characters Referenced books MPLAB® IDE User’s Guide Emphasized text ...is the only compiler... Initial caps A window the Output window A dialog the Settings dialog A menu selection select Enable Programmer Quotes A field name in a window or “Save project before build” dialog Underlined, italic text with A menu path File>Save right angle bracket Bold characters A dialog button Click OK A tab Click the Power tab N‘Rnnnn A number in verilog format, 4‘b0010, 2‘hF1 where N is the total number of digits, R is the radix and n is a digit. Text in angle brackets < > A key on the keyboard Press <Enter>, <F1> Courier New font: Plain Courier New Sample source code #define START Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’ Italic Courier New A variable argument file.o, where file can be any valid filename Square brackets [ ] Optional arguments mcc18 [options] file [options] Curly brackets and pipe Choice of mutually exclusive errorlevel {0|1} character: { | } arguments; an OR selection Ellipses... Replaces repeated text var_name [, var_name...] Represents code supplied by void main (void) user { ... } DS51983A-page 6 © 2011 Microchip Technology Inc.

Preface RECOMMENDED READING This user's guide describes how to use the MCP16301 300 mA D2PAK Demo Board. Other useful documents are listed below. The following Microchip documents are avail- able and recommended as supplemental reference resources. • MCP16301 Data Sheet – “High Voltage Input Integrated Switch Step-Down Regulator” (DS25004) • AN1385 Application Note – “Dynamic Analysis of the MCP16301 Switch- mode Power Converter Utilizing the MCP16301 Design Analyzer” (DS01385) • MCP16301 User’s Guide – “MCP16301 600 mA Demo Board User’s Guide” (DS51978) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support. DOCUMENT REVISION HISTORY Revision A (May 2011) • Initial Release of this Document. © 2011 Microchip Technology Inc. DS51983A-page 7

2 MCP16301 300 mA D PAK Demo Board User’s Guide NOTES: DS51983A-page 8 © 2011 Microchip Technology Inc.

2 MCP16301 300 mA D PAK DEMO BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the MCP16301 300 mA D2PAK Demo Board, and covers the following topics: • MCP16301 Short Overview • What is the MCP16301 300 mA D2PAK Demo Board? 2 • What Does the MCP16301 300 mA D PAK Demo Board Kit Contain? 1.2 MCP16301 SHORT OVERVIEW The MCP16301 device is a highly integrated, high-efficiency, fixed frequency, step-down DC-DC converter in a popular 6-pin SOT-23 package, that operates from input voltage sources up to 30V. The integrated features include a high-side switch, fixed frequency peak current mode control, internal compensation, peak current limit and overtemperature protection. Minimal external components are needed to develop a high-efficiency power supply, operating from a high-voltage input. High-converter efficiency is achieved by integrating the current limited, low resistance, high-speed N-Channel MOSFET and associated drive circuitry. High-switching frequency minimizes the size of the external filtering components, resulting in a small solution size. The MCP16301 300 mA D2PAK Demo Board can supply 300mA of continuous cur- rent, while regulating the output voltage from 2.0V to 15V. An integrated, high-perfor- mance peak current mode architecture keeps the output voltage tightly regulated, even during input voltage steps and output current transient conditions that are common in power systems. For this evaluation board, the external components are sized such that they can fit into a smaller space than a D2PAK linear regulator. The external compo- nents, namely the Schottky diode and the inductor, limit the maximum output current for this application to less than 300mA. 1N4448 CBOOST L1 VOUT VIN BOOST 100nF 15µH 3.3V@150mA 4.0Vto26V SW VIN 30V COUT Schottky 22µF C IN Diode 2.2µF EN 31.2KΩ V FB GND 10KΩ FIGURE 1-1: 300mA Typical, MCP16301 Step-Down Application. © 2011 Microchip Technology Inc. DS51983A-page 9

2 MCP16301 300 mA D PAK Demo Board User’s Guide 1.3 WHAT IS THE MCP16301 300 MA D2PAK DEMO BOARD? The MCP16301 300 mA D2PAK Demo Board is designed to operate from a 4V to 26V input and regulate the output to 3.3V while delivering 300mA of load current. Test points for input power and load are provided to demonstrate the capability of the demo board over the entire range. The board was designed using small surface mount components, to show the small board area necessary for a high-input voltage, 300mA design, that fits into less board area than the popular D2PAK, commonly used for linear regulators. 1.4 WHAT DOES THE MCP16301 300 MA D2PAK DEMO BOARD KIT CONTAIN? The MCP16301 300 mA D2PAK Demo Board kit includes: • MCP16301 300 mA D2PAK Demo Board (102-00360) • Important Information Sheet. DS51983A-page 10 © 2011 Microchip Technology Inc.

2 MCP16301 300 mA D PAK DEMO BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION 2.1.1 MCP16301 Features The MCP16301 device has been developed to provide high input voltage applications with a precise low voltage regulated rail, while operating at high efficiency. The key features of the MCP16301 include: • Up to 96% Typical Efficiency • Input Voltage Range: 4.0V to 30V • Output Voltage Range: 2.0V to 15V • 2% Output Voltage Accuracy • Integrated N-Channel Buck Switch: 460mΩ • 600mA Output Current • 500kHz Fixed Frequency • Adjustable Output Voltage • Low Device Shutdown Current • Peak Current Mode Control • Internal Compensation • Stable with Ceramic Capacitors • Internal Soft-Start • Cycle-by-Cycle Peak Current Limit • Under Voltage Lockout (UVLO): 3.5V • Overtemperature Protection • Available Package: SOT-23 -6 A high performance peak current mode control system is used to deliver fast response to sudden line and load changes. 2.1.2 MCP16301 300 mA D2PAK Demo Board Features The MCP16301 300 mA D2PAK Demo Board is developed to demonstrate how the MCP16301 operates over a wide input voltage and load range. Test points are provided for input and output, allowing the demo board to be connected directly to a system. © 2011 Microchip Technology Inc. DS51983A-page 11

2 MCP16301 300 mA D PAK Demo Board User’s Guide 2.2 GETTING STARTED The MCP16301 300 mA D2PAK Demo Board is fully assembled and tested to evaluate and demonstrate the MCP16301 capability. 2.2.1 Power Input and Output Connection 2.2.1.1 POWERING THE MCP16301 300 MA D2PAK DEMO BOARD The MCP16301 300 mA D2PAK Demo Board is fully assembled, tested and ready for evaluation. Apply positive input voltage to the V terminal and the corresponding IN return to the GND terminal. The maximum input voltage should not exceed 26V. An electronic load or resistive load can be used for evaluation or the intended system load can be connected. The electronic loads attempt to sink current at 0V during startup. A resistive load or constant resistance is recommended for startup evaluation. Connect the positive voltage terminal of the load to the V terminal on the demo board, and OUT connect the negative or return side of the load to the GND terminal. 2.2.1.2 BOARD TESTING To test the board, follow the next steps: 1. Apply the input voltage. 2. An internal pull up resistor is connected from V to the EN input of the IN MCP16301. Once the input voltage is greater than 3.5V, the device begins to switch. Apply greater than 4V supply to the input for proper operation. A minimum load is required to regulate the output to 3.3V. For minimum load requirements (light load conditions), detailed information is provided in the data sheet. 3. The measured output voltage should be 3.3V typical. Adjusting the input voltage and load should not cause the output to vary more than a few mV over the oper- ating range of the converter. 2.2.2 How the MCP16301 300 mA D2PAK Demo Board Boost Strap Operates The MCP16301 integrates a low resistance N-Channel MOSFET. A high side or floating supply is needed to drive the gate of the N-Channel MOSFET above the input voltage to turn it on. The demo board uses the output voltage (3.3V) to charge the boost cap, while inductor current flows, clamping the SW node to a diode drop below ground. Prior to start up, there is no inductor current, so an internal pre-charge circuit charges the boost cap up to a minimum threshold. Once charged, the N-Channel can be turned on, ramping current into the inductor. The worst case operating conditions for charging the boost capacitor occur at minimum V and no load. At minimum V (4V), there is not enough head room to pre-charge IN IN the boost cap to a high value. At no load, the converter is operating at a minimum or very low duty cycle, putting a small amount of current into the inductor. When the switch turns off the inductor, current decays very quickly, resulting in a small time to recharge the boost capacitor. DS51983A-page 12 © 2011 Microchip Technology Inc.

2 MCP16301 300 mA D PAK DEMO BOARD USER’S GUIDE Appendix A. Schematics and Layouts A.1 INTRODUCTION This appendix contains the following schematics and layouts for the MCP16301 300 mA D2PAK Demo Board: • Board – Schematic • Board – Top Silk and Pads • Board – Top Copper Layer • Board – Bottom Copper Layer © 2011 Microchip Technology Inc. DS51983A-page 13

2 MCP16301 300 mA D PAK Demo Board User’s Guide A.2 BOARD – SCHEMATIC UT D1 O N V G 1 1 3 4 P P T T C222µ0603 1 2 1 2 R231.6k 0603 R310k0402 5 1 L115µ PS30 L 3 2 3 D2 D- Y O K S AT 1V 1OT D0H 3C S 2 2 1 1 2 F 2 3µ 0 C0.1 04 1 6 3 23 ST SW FB T O O O S B 1 0 3 6 1 P C D M Vin EN GN U1 5 4 2 1 2 k 2 1 0 0 R 0 4 1 0 µ 5 C12.2 080 1 2 P P T T 1 1 N D VI GN DS51983A-page 14 © 2011 Microchip Technology Inc.

Schematics and Layouts A.3 BOARD – TOP SILK AND PADS A.4 BOARD – TOP COPPER LAYER © 2011 Microchip Technology Inc. DS51983A-page 15

2 MCP16301 300 mA D PAK Demo Board User’s Guide A.5 BOARD – BOTTOM COPPER LAYER DS51983A-page 16 © 2011 Microchip Technology Inc.

2 MCP16301 300 mA D PAK DEMO BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: BILL OF MATERIALS (BOM) Qty Reference Description Manufacturer Part Number 1 C1 CAP CER 2.2 µF 50V X5R 0805 TDK® Corporation C2012X5R1H225K 1 C2 CAP CER 10uF 6.3V X5R 0603 Taiyo Yuden® JMK107BJ106MA-T 1 C3 CAP CER 0.10uF 6.3V X5R 0402 TDK Corporation C1005X5R0J104M 1 D1 DIODE SCHOTTKY 30V 1A Diodes® Incorporated PD3S130HDICT-ND PWRDI-323 1 D2 DIODE SWITCH 75V 200mW Diodes Incorporated 1N4448WS-7-F SOD-323 1 L1 Sheilded Power Inductor 15 µH Coilcraft® Inc. LPS3015-153MLB 1 PCB RoHS Compliant Bare PCB MCP16301 — 104-00360 D2PAK Board 1 R1 RES 1.00M OHM 1/10W 1% 0402 SMD Panasonic®-ECG ERJ-2RKF1004X 1 R2 RES 31.6K OHM 1/10W 1% 0402 SMD Panasonic-ECG ERJ-2RKF3162X 1 R3 RES 10.0K OHM 1/10W 1% 0402 SMD Panasonic-ECG ERJ-2RKF1002X 4 TP1, TP2, PC TEST POINT TIN SMD Harwin Inc S1751-46R TP3, TP4 1 U1 MCP16301 High Input Buck Converter Microchip Technology Inc. MCP16301T-I/CHY SOT-23 Note1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. © 2011 Microchip Technology Inc. DS51983A-page 17

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