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ADL5534ACPZ-R7产品简介:
ICGOO电子元器件商城为您提供ADL5534ACPZ-R7由Analog设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 ADL5534ACPZ-R7价格参考。AnalogADL5534ACPZ-R7封装/规格:RF 放大器, 射频放大器 IC 通用 20MHz ~ 500MHz 16-LFCSP-WQ(5x5)。您可以下载ADL5534ACPZ-R7参考资料、Datasheet数据手册功能说明书,资料中有ADL5534ACPZ-R7 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | IC AMP IFA DUAL 500MHZ 16LFCSP |
产品分类 | |
品牌 | Analog Devices Inc |
数据手册 | |
产品图片 | |
P1dB | 20.4dBm(109.6mW) |
产品型号 | ADL5534ACPZ-R7 |
PCN其它 | |
PCN组件/产地 | |
RF类型 | 通用 |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | - |
产品目录页面 | |
供应商器件封装 | 16-LFCSP-VQ(5x5) |
其它名称 | ADL5534ACPZ-R7DKR |
包装 | Digi-Reel® |
噪声系数 | 3dB |
增益 | 19dB ~ 20.5dB |
封装/外壳 | 16-VQFN 裸露焊盘,CSP |
标准包装 | 1 |
测试频率 | 380MHz |
特色产品 | http://www.digikey.com/cn/zh/ph/analog-devices/rf2.html |
电压-电源 | 4.75 V ~ 5.25 V |
电流-电源 | 98mA ~ 110mA |
视频文件 | http://www.digikey.cn/classic/video.aspx?PlayerID=1364138032001&width=640&height=505&videoID=2245193150001 |
设计资源 | |
频率 | 20MHz ~ 500MHz |
20 MHz to 500 MHz Dual IF Amplifier Data Sheet ADL5534 FEATURES FUNCTIONAL BLOCK DIAGRAM Fixed gain of 20 dB T1 Operation up to 500 MHz FIN1 C C FOU R N N R Input/output internally matched to 50 Ω 16 15 14 13 Integrated bias control circuit OIP3 of 40 dBm at 70 MHz NC 1 12CLIN1 P1dB of 20.4 dBm at 70 MHz BIAS NC 2 11NC Noise figure of 2.5 dB at 70 MHz ADL5534 NC 3 10NC Temperature and power supply stable BIAS NC 4 9 NC Single 5 V power supply 5 6 7 8 2 C 2 2 RFIN N CLIN OUT NC = NO CONNECT RF 06836-001 Figure 1. GENERAL DESCRIPTION The ADL5534 contains two broadband, fixed-gain, linear The ADL5534 is fabricated on a GaAs HBT process. The amplifiers and operates at frequencies up to 500 MHz. The device is packaged in a 16-lead 5 mm × 5 mm LFCSP that device can be used in a wide variety of equipment, including uses an exposed paddle for excellent thermal impedance. cellular, satellite, broadband, and instrumentation equipment. The ADL5534 consumes 98 mA of current per amplifier on a single 5 V supply, and is fully specified for operation from The ADL5534 has a fixed gain of 20 dB, which is stable over −40°C to +85°C. frequency, temperature, power supply, and from device-to- device. The amplifiers are single-ended and internally matched A similar amplifier, ADL5531 (available from Analog Devices, to 50 Ω. Only input/output ac-coupling capacitors, power supply Inc.) is the 20 dB gain single-channel version. Fully populated decoupling capacitors, and an external bias inductor are evaluation boards for both the ADL5531 and ADL5534 are required for operation of each amplifier. available. Rev. B Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Tel: 781.329.4700 ©2008–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. Technical Support www.analog.com
ADL5534 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Basic Connections .......................................................................... 10 Functional Block Diagram .............................................................. 1 Using Baluns to Combine Both Amplifiers into a Single General Description ......................................................................... 1 Amplifier ..................................................................................... 11 Revision History ............................................................................... 2 ADC Driving Application ......................................................... 12 Specifications ..................................................................................... 3 Soldering Information and Recommended PCB Land Pattern .......................................................................................... 13 Typical Scattering Parameters ..................................................... 4 Evaluation Board ............................................................................ 14 Absolute Maximum Ratings ............................................................ 5 Outline Dimensions ....................................................................... 16 ESD Caution .................................................................................. 5 Ordering Guide .......................................................................... 16 Pin Configuration and Function Descriptions ............................. 6 Typical Performance Characteristics ............................................. 7 REVISION HISTORY 2/14—Rev. A to Rev. B Updated Outline Dimensions ........................................................ 16 Changes to Ordering Guide ........................................................... 16 11/13—Rev. 0 to Rev. A Changes to Figure 2 ........................................................................... 6 Added Figure 15, Renumbered Sequentially ................................. 9 Updated Outline Dimensions ........................................................ 16 Changes to Ordering Guide ........................................................... 16 6/08—Revision 0: Initial Version Rev. B | Page 2 of 16
Data Sheet ADL5534 SPECIFICATIONS VPOS = 5 V and T = 25°C, unless otherwise noted. A Table 1. Parameter Conditions Min Typ Max Unit OVERALL FUNCTION Frequency Range 20 500 MHz Gain (S21) 190 MHz 20.4 dB Input Return Loss (S11) 190 MHz −18.0 dB Output Return Loss (S22) 190 MHz −29.0 dB Reverse Isolation (S12) 190 MHz −23.0 dB FREQUENCY = 70 MHz Gain 21.0 dB vs. Frequency ±5 MHz ±0.04 dB vs. Temperature −40°C ≤ T ≤ +85°C ±0.20 dB A vs. Supply 4.75 V to 5.25 V ±0.20 dB Output 1 dB Compression Point 20.4 dBm Output Third-Order Intercept ∆f = 1 MHz, output power (P ) = 0 dBm per tone 40.0 dBm OUT Noise Figure 2.5 dB Device-to-Device Isolation Measured at output with input applied to alternate device −46.0 dB FREQUENCY = 190 MHz Gain 19.5 20.4 21 dB vs. Frequency ±50 MHz ±0.15 dB vs. Temperature −40°C ≤ T ≤ +85°C ±0.20 dB A vs. Supply 4.75 V to 5.25 V ±0.17 dB Output 1 dB Compression Point 20.6 dBm Output Third-Order Intercept ∆f = 1 MHz, output power (P ) = 0 dBm per tone 39.0 dBm OUT Noise Figure 2.7 dB Device-to-Device Isolation Measured at output with input applied to an alternate device −38.0 dB FREQUENCY = 380 MHz Gain 19.0 19.8 20.5 dB vs. Frequency ±50 MHz ±0.18 dB vs. Temperature −40°C ≤ T ≤ +85°C ±0.22 dB A vs. Supply 4.75 V to 5.25 V ±0.16 dB Output 1 dB Compression Point 20.4 dBm Output Third-Order Intercept ∆f = 1 MHz, output power (P ) = 0 dBm per tone 36.0 dBm OUT Noise Figure 3.0 dB Device-to-Device Isolation Measured at output with input applied to an alternate device −34.0 dB POWER INTERFACE RFOUT1, RFOUT2 pins Supply Voltage 4.75 5 5.25 V Supply Current Per amplifier 98 110 mA vs. Temperature −40°C ≤ T ≤ +85°C ±15 mA A Power Dissipation 0.5 W Rev. B | Page 3 of 16
ADL5534 Data Sheet TYPICAL SCATTERING PARAMETERS VPOS = 5 V and T = 25°C; the effects of the test fixture have been de-embedded up to the pins of the device. A Table 2. S11 S21 S12 S22 Freq. (MHz) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) Magnitude (dB) Angle (°) 20 −22.72 −102.04 21.79 174.78 −24.08 5.82 −18.56 −42.21 50 −20.40 −138.34 21.07 171.81 −23.40 6.92 −21.33 −71.17 100 −19.83 −160.87 20.66 169.90 −23.11 7.81 −25.56 −90.45 150 −19.95 −170.03 20.51 167.16 −23.01 9.36 −27.64 −95.94 200 −20.29 −174.24 20.39 164.06 −22.93 11.42 −27.78 −94.45 250 −20.72 −176.35 20.27 160.68 −22.85 13.45 −26.69 −91.22 300 −20.93 −175.04 20.16 157.31 −22.77 15.66 −24.58 −89.94 350 −21.06 −174.10 20.01 153.74 −22.69 17.74 −22.78 −90.89 400 −21.43 −171.87 19.85 150.30 −22.61 20.07 −20.76 −91.14 450 −21.58 −168.25 19.68 146.82 −22.51 22.24 −18.97 −92.39 500 −21.75 −163.79 19.45 142.72 −22.36 24.88 −17.10 −92.91 Rev. B | Page 4 of 16
Data Sheet ADL5534 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under Absolute Maximum Ratings Table 3. may cause permanent damage to the device. This is a stress Parameter Rating rating only; functional operation of the device at these or any Supply Voltage on RFOUT1, RFOUT2 5.5 V other conditions above those indicated in the operational Input Power on RFIN1, RFIN2 10 dBm section of this specification is not implied. Exposure to absolute Internal Power Dissipation (Paddle Soldered) 900 mW maximum rating conditions for extended periods may affect θ (Junction-to-Air) 54°C/W JA device reliability. Maximum Junction Temperature 150°C Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C ESD CAUTION Rev. B | Page 5 of 16
ADL5534 Data Sheet PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 T FIN1 C C FOU R N N R 16 15 14 13 PIN 1 NC 1 INDICATOR 12CLIN1 NC 2 ADL5534 11NC TOP VIEW NC 3 10NC (Not to Scale) NC 4 9 NC 5 6 7 8 2 C 2 2 RFIN N CLIN OUT F R NOTES 1.NC = NO CONNECT. 2.CITMHOPENE NEDEXACPNTOCESEDE G DTR OPO AGUDNNDDDL. EPS LOISAL NIDNEET.RE RTNOA AL LLYOW 06836-002 Figure 2. Pin Configuration Table 4. Pin Function Descriptions Pin No. Mnemonic Description 1, 2, 3, 4, 6, 9, NC No Connect. 10, 11, 14, 15 5, 16 RFIN2, RFIN1 RF Input. Requires a dc blocking capacitor. Use a 10 nF capacitor for normal operation. 7, 12 CLIN2, CLIN1 A 1 nF capacitor connected from Pin 7 to ground and Pin12 to ground provides decoupling for the on-board linearizer. 8, 13 RFOUT2, RFOUT1 RF Output and Bias. DC bias is provided to this pin through an inductor. A 470 nH inductor is recommended for normal operation. The RF path requires a dc blocking capacitor. Use a 10 nF capacitor for normal operation. Exposed Paddle GND. Solder this paddle to a low impedance ground plane. Rev. B | Page 6 of 16
Data Sheet ADL5534 TYPICAL PERFORMANCE CHARACTERISTICS 22 45 23.0 42 20 42 –40°C 22.5 40 E FIGURE AND GAIN (dB) 11111024688 POG1IAPdI3BN 223333470369 P1dB AND OIP3 (dBm) P1dB (dBm)22220112....5050 +85°C +8+52°5C°C +25°C 33332468 OIP3 (dBm) OIS 6 21 20.0 –40°C 30 N 4 18 19.5 28 2 15 NOISE FIGURE 0 12 19.0 26 0 50 100 150 FR2E00QUE2N5C0Y (3M0H0z) 350 400 450 500 06836-003 0 50 100 150 FR2E00QUE2N5C0Y (3M0H0z) 350 400 450 500 06836-006 Figure 3. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency Figure 6. P1dB and OIP3 vs. Frequency and Temperature 21.4 42 21.2 40 190MHz 21.0 70MHz 38 20.8 20.6 36 AIN (dB)2200..24 –40°C P3 (dBm) 3324 500MHz 380MHz G20.0 OI 19.8 30 +25°C 19.6 28 +85°C 19.4 26 20MHz 19.2 19.0 24 0 50 100 150 FR2E00QUE2N5C0Y (3M0H0z) 350 400 450 500 06836-004 –6 –4 –2 0 2 4POU6T (dB8m)10 12 14 16 18 20 06836-007 Figure 4. Gain vs. Frequency and Temperature Figure 7. OIP3 vs. Output Power and Frequency –5 5.0 4.5 –10 4.0 dB) –15 B) RS ( S11 E (d 3.5 +85°C ETE –20 GUR 3.0 –PARAM –25 S12 NOISE FI 2.5 S +25°C 2.0 S22 –40°C –30 1.5 –35 1.0 20 60 100 140 180FR2E2Q0UE2N6C0Y 3(0M0Hz3)40 380 420 460 500 06836-005 0 50 100 150 FR2E00QUE2N5C0Y (3M0H0z) 350 400 450 500 06836-008 Figure 5. Input Return Loss (S11), Output Return Loss (S22), and Reverse Figure 8. Noise Figure vs. Frequency and Temperature Isolation (S12) vs. Frequency Rev. B | Page 7 of 16
ADL5534 Data Sheet 60 –25 B) d N ( 50 TIO –30 A L O E (%) 40 UT IS –35 G P NTA 30 OUT –40 CE TE R A PE 20 ERN –45 T L A 10 TO –50 T U P 036.637.037.437.838.238.6O3IP9.30 (3d9B.m43)9.840.240.641.041.441.8 06836-009 IN –5520 60 100 140 180FR2E2Q0UE2N6C0Y 3(0M0Hz3)40 380 420 460 500 06836-011 Figure 9. OIP3 Distribution at 190 MHz Figure 12. Device-to-Device Isolation vs. Frequency 100 4.0 90 3.8 80 3.6 %) 70 dB) 3.4 E ( 60 E ( 3.2 G R A U T 50 G 3.0 RCEN 40 SE FI 2.8 PE 30 NOI 2.6 20 2.4 10 2.2 0 2.0 19.0 19.4 19.8 2P01.2dB (dB2m0.6) 21.0 21.4 21.8 06836-010 0 50 100 150 FR2E00QUE2N5C0Y (3M0H0z) 350 400 450 500 06836-013 Figure 10. P1dB Distribution at 190 MHz Figure 13. Noise Figure vs. Frequency at 25°C, Multiple Devices Shown 70 150 140 60 130 %) 50 mA) 120 AGE ( 40 RENT ( 110 5.25V RCENT 30 Y CUR 10900 PE 20 UPPL 80 5V S 70 10 60 4.75V 019.719.819.920.020.120.2G2A0.I3N2 (0d.B4)20.520.620.720.820.921.0 06836-012 50–40 –30 –20 –10 0 TE1M0PE2R0AT3U0RE 4(°0C)50 60 70 80 90 06836-014 Figure 11. Gain Distribution at 190 MHz Figure 14. Supply Current vs. Temperature and Supply Voltage Rev. B | Page 8 of 16
Data Sheet ADL5534 115 110 +85°C 105 A) 100 T (m 95 +25°C EN 90 R UR 85 C Y 80 –40°C L P P 75 U S 70 65 60 55 –6 –4 –2 0 2 4 P6OUT 8(dB1m0) 12 14 16 18 20 22 06836-100 Figure 15. Supply Current vs. POUT and Temperature V Supply = 5 V Rev. B | Page 9 of 16
ADL5534 Data Sheet BASIC CONNECTIONS VPOS L1 C7 C9 470nH 10nF 1µF GND RFIN1 C1 C2 RFOUT1 10nF 16 15 14 13 10nF 1 C C 1 1 NC RFIN N N FOUT LIN1 12 C5 2 R C 11 1nF NC Z1 NC 3 ADL5534 10 NC NC 4 NC FIN2 C LIN2 FOUT2NC 9 R N C R RFIN2 C3 C4 RFOUT2 5 6 7 8 10nF 10nF C6 L2 1nF 470nH VPOS1 C108nF C1µ1F0 GND1 06836-015 Figure 16. Basic Connections Table 5. Recommended Components for Basic Connections Frequency C1, C2, C3, C4, C7, C8 L1, L2 C5, C6 C9, C10 20 MHz to 500 MHz 10 nF 470 nH 1 nF 1 μF The basic connections for operating the ADL5534 are shown in L1 and L2 inductors connected to the RFOUT1 and RFOUT2 Figure 16. Recommended components are listed in Table 5. The pins. The recommended inductors for L1 and L2 are Coilcraft, inputs and outputs should be ac-coupled with appropriately 1008CS-471XJLC or equivalent. The bias voltage should be sized capacitors (device characterization was performed with decoupled using 10 nF and 1 μF capacitors. A bias voltage 10 nF capacitors). DC bias is provided to the amplifier via the of 5 V is required. Rev. B | Page 10 of 16
Data Sheet ADL5534 VPOS L1 C7 C9 W1 470nH 10nF 1µF GND 16 15 14 13 1 C C 1 1 NC RFIN N N FOUT LIN1 12 C5 RFOUT 2 R C 11 1nF 1 NC Z1 NC RFIN ADT2-1T-1PT+1 C101n5F 34 NNCC FIN2ADCL55LIN234FOUT2NNCC 190 1C0n1F6 1TA2DT2-1T-1P+ R N C R 5 6 7 8 C6 L2 1nF 470nH VPOS1 C108nF C1µ1F0 WG2ND1 06836-016 Figure 17. Connections for Operating as a Balanced Amplifier 45 90 USING BALUNS TO COMBINE BOTH AMPLIFIERS m) OIP3 INTO A SINGLE AMPLIFIER B 40 80 d The ADL5534 is ideal for use in a balanced amplifier confi- 3 (dB, 35 OIP2 70 P guration. To accomplish this, flux-coupled RF transformers OI 30 60 with a 2:1 impedance ratio can be used for wide band 1dB, 25 P1dB 50 Bm) P d operation. Alternatively, a balun can be constructed using RE, 20 40 P2 ( lumped element components for operation over a narrow GU OI frequency range. Figure 17 shows the necessary connections E FI 15 GAIN 30 S for configuring the ADL5534 for operation as a balanced OI 10 20 N amplifier. Figure 18 shows the performance of the ADL5534 AIN, 5 NOISE FIGURE 10 G operating in a balanced configuration. 0 0 0 50 100 150 FR2E00QUE2N5C0Y (3M0H0z) 350 400 450 500 06836-017 Figure 18. Performance of the ADL5534 Operating in Balanced Configuration Rev. B | Page 11 of 16
ADL5534 Data Sheet VPOS 470nH 10nF 1µF GND 16 15 14 13 1 C C 1 1 NC RFIN N N FOUT LIN1 12 1nF 120nH 120nH 33Ω 2 R C 11 RFIN 3 NC ADLZ51534 NC 10 100pF 16pF C4M9L.9Ω 4.7pF AD9640 NC NC 100pF 49.9Ω 10nF 4 NC FIN2 C LIN2 FOUT2NC 9 120nH 120nH 33Ω R N C R 5 6 7 8 1nF 470nH VPOS1 10nF 1µF GND1 06836-018 Figure 19. Narrow-Band IF Sampling Solution for Unbuffered ADC ADC DRIVING APPLICATION 0 SNR = 69.334dBc SFDR = 82.267dBc The ADL5534 is a high linearity, fixed gain IF amplifier suitable –15 NOISE FLOOR = –109.519dB FUND = –1.05dBFs for use as an ADC driver. The ADL5534 has a differential input –30 SECOND = –82.262dBc THIRD = –88.688dBc and output impedance of 100 Ω. A flux-coupled RF transformer –45 with a 2:1 impedance ratio was used to perform the single-ended- S) –60 F to-differential conversion at the input of the ADL5534. The dB –75 ( interface between the ADL5534 and the AD9640 is a third- –90 order low pass filter presenting a 100 Ω differential impedance –105 to the source and load. The ADL5534 must be ac-coupled to –120 prevent dc bias from entering the inputs of the ADC. Capacitors –135 of 100 pF were chosen to reduce any low frequency noise coming frreosumlt tsh feo rA tDhiLs5 i5n3te4r faancde pshroovwids e0 .d5c d bBlo icnkseinrtgi.o Tn hloes ms feoar sau 2re0d M Hz 0 6 12 18 FR24EQUE3N0CY (3M6Hz)42 48 54 60 06836-020 bandwidth centered around 92 MHz. The wideband response for Figure 21. Measured Single-Tone Performance of the Circuit in Figure 19 the interface is shown in Figure 20. The single-tone results in Figure 21 show an SNR of 69.3 dB and an SFDR of 82 dBc. The 0 SFDR =78.267dBc NOISEFLOOR =–110.131dB two-tone results in Figure 22 show an IMD3 of −80.5 dBc and –15 FUND 1= –7.181dBFs an SFDR of 78 dBc. FUND 2= –7.191dBFs –30 IMD (2F1 –F2)= –80.538dBc 5 IMD (2F2 –F1)= –82.086dBc –45 0 S) –60 F –5 dB –75 B) ( S (d –10 –90 OS –15 –105 L ED –20 –120 Z ALI –25 –135 M R NO ––3350 0 6 12 18 FR2E4QUE3N0CY (3M6Hz)42 48 54 60 06836-021 –40 Figure 22. Measured Two-Tone Performance of the Circuit in Figure 19 –45 50 100 150 FRE2Q00UENCY2 5(M0Hz) 300 350 400 06836-019 Figure 20. Measured Frequency Response of ADC interface in Figure 19 Rev. B | Page 12 of 16
Data Sheet ADL5534 SOLDERING INFORMATION AND RECOMMENDED 4.8mm PCB LAND PATTERN Figure 23 shows the recommended land pattern for ADL5534. To minimize thermal impedance, the exposed paddle on the package underside should be soldered down to a ground plane. If multiple ground layers exist, they should be stitched together using vias. Pin 1 to Pin 4, Pin 6, Pin 9 to Pin 11, and Pin 14 to Pin 15 can be left unconnected, or can be connected to ground. Connecting these pins to ground improves device-to-device isolation and slightly enhances thermal impedance. For more 3.1mm 0.2mm information on land pattern design and layout, refer to the AN-772 Application Note, A Design and Manufacturing Guide for 0.8mm the Lead Frame Chip Scale Package (LFCSP). 2.4mm 06836-022 Figure 23. Recommended Land Pattern Rev. B | Page 13 of 16
ADL5534 Data Sheet EVALUATION BOARD Figure 24 shows the schematic for the ADL5534 evaluation VPOS biases the amplifier corresponding to RFIN1 and board. The board is powered by a single 5 V supply. The RFOUT1. Applying 5 V to VPOS1 biases the amplifier components used on the board are listed in Table 6. corresponding to RFIN2 and RFOUT2. To bias both amplifiers Transformers (T1 and T2) are provided so the ADL5534 from a single supply, connect 5 V to VPOS or VPOS1 and can be configured as a balanced amplifier. Applying 5 V to attach a jumper across W3. VPOS L1 C7 C9 W1 470nH 10nF 1µF GND C1 C2 RFIN1 10nF 10nF RFOUT1 16 15 14 13 ORPE5NOPERN1 CO1P1EN 1 NC RFIN1 NC NC FOUT1 LIN1 12 C5 CO1P3EN OPERN2 ORPE6N 1 2 R C 11 1nF ORPE7N ADT2-1T-1PT+1 CO1P5EN 3 NNCC ADLZ51534 NNCC 10 C16 1TA2DT2-1T-1P+ ORPE8N R3 C12 4 NC FIN2 C LIN2 FOUT2NC 9 OPEN C14 R4 OPEN OPEN R N C R OPEN OPEN RFIN2 RFOUT2 5 6 7 8 C3 C4 10nF C6 L2 10nF 1nF 470nH VPOS1 VPOS W3 VPOS1 C108nF C1µ1F0 WG2ND1 06836-023 Figure 24. Evaluation Board Schematic Table 6. Evaluation Board Configuration Options Component Description Default Condition C1, C2, C3, C4 AC coupling capacitors 10 nF, Size 0402 C5, C6 Provides decoupling for the on-board linearizer 1 nF, Size 0603 C11, C12, C13, C14, Optional components used for configuring ADL5534 as a balanced amplifier Open, Size 0402 C15, C16 C9, C10 Power-supply decoupling capacitors 1 µF, Size 0603 C7, C8 Power-supply decoupling capacitors 10 nF, Size 0603 R1, R2, R3, R4, R5, Optional components used for configuring ADL5534 as a balanced amplifier Open, Size 0603 R6, R7, R8 T1, T2 T1 and T2 are 50 Ω to100 Ω impedance transformers used to configure the ADL5534 Installed (Mini-Circuits® as a balanced amplifier; T1 and T2 are used to present a 100 Ω differential impedance ADT2-1T-1P+) to the ADL5534 L1, L2 DC bias inductor 470 nH, Size 1008 VPOS, GND, Clip-on terminals for power supply VPOS, VPOS1; red VPOS1, GND1 GND, GND1; black W1, W2 2-pin jumper for connection of ground and supply via cable W1, W2 W3 2-pin jumper used to connect VPOS to VPOS1 W3 Rev. B | Page 14 of 16
Data Sheet ADL5534 06836-024 06836-025 Figure 25. Evaluation Board Layout (Top) Figure 26. Evaluation Board Layout (Bottom) Rev. B | Page 15 of 16
ADL5534 Data Sheet OUTLINE DIMENSIONS 5.10 5.00 SQ PIN 1 4.90 INDICATOR PIN 1 13 16 INDICATOR 0.80 1 BSC 12 EXPOSED 3.25 PAD 3.10 SQ 2.95 9 4 0.75 8 5 0.25 MIN TOP VIEW 0.60 BOTTOM VIEW 0.50 0.80 0.75 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.70 0.02 NOM THE PIN CONFIGURATION AND COPLANARITY FUNCTION DESCRIPTIONS SEATING 0.35 0.08 SECTION OF THIS DATA SHEET. PLANE 0.30 0.20 REF 0C.2O5MPLIANTTOJEDEC STANDARDS MO-220-WHHB. 06-10-2011-A Figure 27. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 5 mm × 5 mm Body, Very Very Thin Quad CP-16-31 Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option Ordering Quantity ADL5534ACPZ-R7 −40°C to +85°C 16-Lead LFCSP_WQ, 7” Tape and Reel CP-16-31 1500 ADL5534-EVALZ Evaluation Board 1 1 Z = RoHS Compliant Part. ©2008–2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06836-0-2/14(B) Rev. B | Page 16 of 16