Tflex™ 600 Series Thermal Gap Filler EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER Tflex™ 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal resistances. Tflex™ 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex™ 600 is electrically insulating, stable from –45°C to 200°C and meets UL 94 V0 rating. FEATURES AND BENEFITS APPLICATIONS • Very high compliancy for low stress • Cooling components to the chassis or frame applications • High speed mass storage drives • 3 W/mK thermal conductivity • RDRAM memory modules • Available in thicknesses from 0.020” - 0.200” • Heat pipe thermal solutions (0.5mm - 5.0mm) • Automotive engine control units • Naturally tacky, needs no further • Telecommunications hardware adhesive coating Americas: +1.800.843.4556 Europe: +49.8031.24600 Asia: +86.755.2714.116 CLV-customerservice@lairdtech.com

Tflex™ 600 Series Thermal Gap Filler Tflex™ 600 TEST METHOD Construction & Composition Boron nitride filled silicone elastomer Color Blue-Violet Visual Thickness Range 0.020” (0.50mm) - 0.200” (5.08mm) Thickness Tolerance ± 10% Density (g/cc) 1.34 Helium Pycnometer 51; 3 seconds Hardness (Shore 00) ASTM D2240 48; 30 seconds Tensile Strength 15 psi ASTM D412 % Elongation 75 ASTM D412 Outgassing Conditions Post cured Outgassing TML (weight %) 0.13% ASTM E595 Outgassing CVCM (weight %) 0.05% ASTM E595 UL Flammability Rating 94 V0 UL FILE E180840 Temperature Range -45°C to 200°C Thermal Conductivity 3.0 W/mK Hot Disk Thermal Impedance @ 40 mils, 10 psi 0.62°C–in2/W ASTM D5470 @ 1 mm, 69kPa 4.00°C–cm2/W (modified) IPC-TM-650 Thermal Expansion 430 ppm/°C 2.4.24 Volume Resistivity 2 x 1013 ohm-cm ASTM D257 Dielectric Constant @ 1MHz 331% ASTM D150 STANDARD THICKNESSES 0.020 to 0.200-inch (0.5 to 5.0mm) 0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments Inquire about availability of material and options above 0.200-inches STANDARD SHEET SIZES 9 x 9” (229 x 229mm). 18 x 18” (457 x 457mm). 9 x 9” only over 0.100” thickness. TflexTM 600 can be die cut to individual shapes. Pressure sensitive adhesive is not applicable for TflexTM 600 products. TACKY ONE SIDE ONLY Tflex™ 600 is naturally tacky on both sides. Tflex™ 600 can be provided tacky on one side only. This is indicated by the suffix “DC1”. This option offers good separation properties allowing the tacky side to stick to the heatsink/chasis/cold plate/etc. and the other “dry” side to release easily from the component(s). REINFORCEMENT Fiberglass is required in 0.020” (0.51mm) and 0.030” (0.76mm). Thicknesses of 0.040” (1.02mm) and above do not require reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. THR-DS-TFLEX-600_07_2_14 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A13512-00 Rev. K EO #9655, 06/2014.

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