HTSC427.xxx - 1206 High Temperature Silicon Capacitor Rev 3.1 Key features Key applications  All applications up to 200°C, such as  High stability up to 200°C: military, aerospace and automotive  Temperature <±1% (-55 °C to +200 °C) industries  Voltage <0.1 %/V  High reliability applications  Negligible capacitance loss through aging  Replacement of X7R and C0G dielectrics  Un ique high capacitance in EIA/1206 package  Decoupling / Filtering / Charge pump s ize, up to 1 µF (i.e.: motor management, temperature  Hi gh reliability (FIT <0.017 parts / billion hours) sensors)  Lo w leakage current down to 100 pA  Downsizing  Low ESL and Low ESR  Suitable for lead free reflow-soldering *Please refer to our assembly Application Note for further recommendations Thanks to the unique IPDiA Silicon capacitor The IPDiA technology offers industry leading tech nology, most of the problems encountered in performances relative to Failure rate with a demanding applications can be solved. FIT<0.017. High Temperature Silicon Capacitors are This technology also offers high reliability, up to dedicated to applications where reliability up to 10 times better than alternative capacitor 200 °C is the main parameter. technologies, such as Tantalum or MLCC, and This technology features a capacitor integration eliminates cracking phenomena. capability (up to 250nF/mm²) which offers This Silicon based technology is RoHS compliant capa citance value similar to X7R dielectric, but and compatible with lead free reflow soldering with better electrical performances than C0G/NP0 process. dielectrics, up to 200°C HTSC provide the highest capacitor stability over the full -55°C/+200°C temperature range in the market with a Temperature coefficient Lower than ±1%.

Arial 18 Bold Rev. Commercial Leaflet HTSC427.xxx Electrical specification Capacitance value Parameters Value 10 15 22 33 47 68 Capacitance range 10 nF to 1µF(***) 10nF Contact Contact Contact Contact Contact Capacitance tolerances ±15 %(***) 1 nF 935.132.427.510 IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales IPDIA Sales Operating temperature range -55 °C to 200 °C (**) nit 10 nF 935.113020.4n2F7 .610 IPCDoIAn tSacatl es IPCDoIAn tSacatl es IPCDoIAn tSacatl es IPCDoIAn tSacatl es IPCDoIAn tSacatl es STetomrapgeera tteumrep ceoraetfufirceise n t -< ±710 %°C, ftroo 2m1 5-5 °5C ° C to +200 °C U 1µF 0,1 µF 935.132.427.710 Breakdown voltage (BV) 11 VDC(***) Capacitance variation versus 1 µF RVDC 0.1 % /V (from 0 V to RVDC) Equivalent Serial Inductor (ESL) Max 1nH (*) Thinner thickness (as low as 100 µm thick) available, see Low Profile Silicon Capacitor product: LPSC Equivalent Serial Resistor (ESR) Max 500m(***) (**) Extended temperature range (up to +250 °C) available, see Xtreme Temperature Silicon Capacitor product: XTSC Insulation resistance 5200GG mmiinn @@ 33VV,,2250°0C°C Ageing Negligible, < 0.001 % / 1000h (***) Other values on request. Reliability FIT<0.017 parts / billion hours, Capacitor height Max 400 µm (*) DC Voltage stability ESL (nH) @25°C MLCC capacitors vs. PICS 0402 C0G(NPO) vs. PICS 10 1,1 0 PICS 1 C0G -10 C0G 0,9 Capacitance change (%)------765432000000 X7R ESL(nH)000000,,,,,,345678 -80 Y5V 0,2 PICS -90 0,1 -1000 1 2 3Bias voltage (V)4 5 6 7 00 50 100150 200 250 300350 4C00ap4a50cit5a0n0ce55 0(pF60)0 650700 750800 850900 9501000 Fig.1 Capacit ance change versus temperature Fig.2 Capacitance change versus voltage Fig.3 ESL versus capacitance value variation compared with alternative dielectrics variation compared with alternative dielectrics compared with alternative dielectrics Part Number 935.132. B.2 S. U xx Value 10 Breakdown 15 Voltage 22 i.e.: 1 µF/1206 case (HTSC type) 4 = 11V S7 i=ze 1 206 U0 n=i t1 0 f 5 = 1 n 3437  935.132.427.710 1 = 0.1 p 6 = 10 n 68 2 = 1 p 7 = 0.1 µ 3 = 10 p 8 = 1 µ 4 = 0.1 n 9 = 10 µ Termination and Outline Termination Package outline Lead-free nickel/solder coating compatible with automatic soldering technologies: L Typ. 1206 reflow and manual. W L 3.40±0.05 Comp. Typical dimensions, all dimensions in mm. size W 1.80±0.05 pLaattnedrn comIpPoDn ent SRoelsdiestr (1206 PCB footprint) Packaging Tape and reel, tray, waffle pack or wafer delivery. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information For more information, please visit: http://www.ipdia.com presented in this document does not form part of any To contact us, email to: sales@ipdia.com quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be Date of release: 28th February 2014 accepted by the publisher for any consequence of its use. Document identifier: CL431 111 615 129 Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.