IIIIIIIIIIIIIINNNNNNNNNNNNNNTTTTTTTTTTTTTTEEEEEEEEEEEEEERRRRRRRRRRRRRRCCCCCCCCCCCCCCOOOOOOOOOOOOOONNNNNNNNNNNNNNNNNNNNNNNNNNNNEEEEEEEEEEEEEECCCCCCCCCCCCCCTTTTTTTTTTTTTTSSSSSSSSSSSSSS SERIES 834 & 835 • .100” GRID OFP® PASS-THROUGH SOCKETS Ø.030” & .025” PINS• SINGLE AND DOUBLE ROW STRIPS • 834/835 Series Pass-Through Sockets have a low .130” profi le and will accept Ø.030” round pin, as well as industry standard .025” square pin headers. • They are typically used to interconnect two or more parallel circuit boards. • Sockets are designed for hand, wave or refl ow* soldering. The high temperature insulator is compatible with all solder processes. • Unique ORGANIC FIBRE PLUG® barriers prevent solder, paste or fl ux from contaminating the internal spring contacts. After soldering, the OFP® barriers are pushed out of the socket when UPPER Typical Application the mating header is inserted. CIRCUIT BOARD INTERCONNECTION • Mill-Max sockets use a receptacle consisting of a PIN precision-machined brass sleeve with a press-fi t Ø.030"or beryllium copper “multi-fi nger” spring contact. .025"PINS #47SPRING CONTACT • Recommended mounting holes are Ø.046 ±.003” MIDDLE CIRCUIT PTH (1,2 mm drilled prior to plating). BOARD SOCKET INSULATOR *Intrusive refl ow (also called “pin-in-paste”) is a technique of using conventional through-hole components in a PASS THROUGH refl ow soldering process. The pass-through socket is placed SOCKETS into plated through-holes in the circuit board (solder paste RECEPTACLE SLEEVE has previously been screen printed on pads adjacent to the CIRCUIT holes) and the board is refl owed in the same pass as other BOARD SMT components. Solder will fi ll the plated through-holes and achieve solder joints as reliable as wave soldering. The LOWER CIRCUIT OFP® barrier prevents solder paste from being picked up BOARD inside the contact during assembly. SOLDER ORGANICFIBERPLUG® JOINT PUSHEDOUTBYINTERCONNECT PINAFTERSOLDERING .025-.036 US Patent #7,086,870 .025*.025 Number of Pins .100 X .100" ORDERING INFORMATION .110 .088 .130 Series 834...001 Single Row OFP® Pass-Through Socket .061 DIA. FIG. 1 834-XX-0 _ _-10-001000 .043 DIA. .080 .036 DIA. Specify number of pins 01-64 Through-Hole ® .100 FIG. 1 Series 835...001 Double Row OFP® Pass-Through Socket FIG. 2 835-XX-0 _ _-10-001000 TS .025-.036 C .200.025*.025 NuXm .b1e0r0 "o f/ P2ins Specify number of pins 04-72 NE N O .110 .088 .130 RoHS - 2 XX=Plating Code Electrical,F More chanical RC .061 DIA. 2011/65/EU See Below & EnSveireo pmaegnet 2a6l 4Data, TE .043 DIA. .080 N I T.0h3ro6u gDhIA-.Hole .100 ® .100 SSlPeEeCvIeF (YP iPnL)ATING CODE XX= 200 µ9” 3Sn/Pb 24003 µ” Sn 24007 µ” Sn 3 | FIG. 2 6 Contact (Clip) 30 µ” Au 30 µ” Au Au Flash E G A P Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com