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74LVX245MTC产品简介:
ICGOO电子元器件商城为您提供74LVX245MTC由Fairchild Semiconductor设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 74LVX245MTC价格参考¥2.64-¥2.64。Fairchild Semiconductor74LVX245MTC封装/规格:逻辑 - 缓冲器,驱动器,接收器,收发器, Transceiver, Non-Inverting 1 Element 8 Bit per Element 3-State Output 20-TSSOP。您可以下载74LVX245MTC参考资料、Datasheet数据手册功能说明书,资料中有74LVX245MTC 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
描述 | IC TRANSCVR 8BIT BI-DIR 20TSSOP总线收发器 Octal Bidir Trans |
产品分类 | |
品牌 | Fairchild Semiconductor |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 逻辑集成电路,总线收发器,Fairchild Semiconductor 74LVX245MTC74LVX |
数据手册 | |
产品型号 | 74LVX245MTC |
产品种类 | 总线收发器 |
传播延迟时间 | 14.2 ns |
低电平输出电流 | 4 mA |
供应商器件封装 | 20-TSSOP |
元件数 | 1 |
功能 | Transceiver |
包装 | 管件 |
单位重量 | 191 mg |
商标 | Fairchild Semiconductor |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Tube |
封装/外壳 | 20-TSSOP(0.173",4.40mm 宽) |
封装/箱体 | TSSOP-20 |
工作温度 | -40°C ~ 85°C |
工厂包装数量 | 73 |
最大功率耗散 | 180 mW |
最大工作温度 | + 85 C |
最小工作温度 | - 40 C |
极性 | Non-Inverting |
标准包装 | 73 |
每元件位数 | 8 |
每芯片的通道数量 | 8 |
电压-电源 | 2 V ~ 3.6 V |
电流-输出高,低 | 4mA,4mA |
电源电压-最大 | 3.6 V |
电源电压-最小 | 2 V |
电路数量 | 8 |
系列 | 74LVX245 |
输入电平 | CMOS |
输出电平 | CMOS |
输出类型 | 3-State |
逻辑类型 | CMOS |
逻辑系列 | 74LVX |
高电平输出电流 | - 4 mA |
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
7 4 April 1993 L Revised April 2005 V X 2 4 5 74LVX245 L o Low Voltage Octal Bidirectional Transceiver w V o General Description Features lt a g The LVX245 contains eight non-inverting bidirectional buff- (cid:1) Ideal for low power/low noise 3.3V applications e ers and is intended for bus-oriented applications. The (cid:1) Guaranteed simultaneous switching noise level and O Transmit/Receive (T/R) input determines the direction of dynamic threshold performance c data flow through the bidirectional transceiver. Transmit t a (active-HIGH) enables data from A ports to B ports; l Receive (active-LOW) enables data from B ports to A B ports. The Output Enable input, when HIGH, disables both id A and B ports by placing them in a high impedance condi- ir tion. e c t io Ordering Code n a l Order Number Package Number Package Description T r a 74LVX245M M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide n 74LVX245SJ M20D Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide s c 74LVX245MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide e i Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. v e Pb-Free package per JEDEC J-STD-020B. r Logic Symbols Connection Diagram Pin Descriptions Truth Table Pin Inputs Description Outputs Names OE T/R OE Output Enable Input L L Bus B Data to Bus A T/R Transmit/Receive Input L H Bus A Data to Bus B A0–A7 Side A Inputs or 3-STATE Outputs H X HIGH-Z State B0–B7 Side B Inputs or 3-STATE Outputs HL LHOIGWH V Vooltlataggee L Leevveell X Immaterial © 2005 Fairchild Semiconductor Corporation DS011597 www.fairchildsemi.com
5 4 Absolute Maximum Ratings Recommended Operating 2 (Note 1) X Conditions V Supply Voltage (VCC) (cid:16)0.5V to (cid:14)7.0V (Note 2) L 4 DC Input Diode Current (IIK) Supply Voltage (VCC) 2.0V to 3.6V 7 VI (cid:16)0.5V (cid:16)20 mA Input Voltage T/R, OE (VI) 0V to 5.5V DC Input Voltage T/R, OE (VI) (cid:16)0.5V to 7V Bus I/O Voltage (VI/O) 0V to VCC DC Diode Current (IOK) Operating Temperature (TA) (cid:16)40qC to (cid:14)85qC VO (cid:16)0.5V (cid:16)20 mA Input Rise and Fall Time (’t/’V) 0 ns/V to 100 ns/V VO VCC (cid:14) 0.5V (cid:14)20 mA DC Bus I/O Voltage (VI/O) (cid:16)0.5V to VCC (cid:14) 0.5V DC Output Source Note 1: The “Absolute Maximum Ratings” are those values beyond which or Sink Current (IO) r25 mA tohpee rsaatfeedty a ot f ththees ed elivmicites .c aTnhneo tp abrea mgueatrriacn vteaelude. sT hdee fidneevdic ien sthhoeu Eldl encotrti cbael DC VCC or Ground Current Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will define the conditions (ICC or IGND) r75 mA for actual device operation. Storage Temperature (TSTG) (cid:16)65qC to (cid:14)150qC Note 2: Unused inputs must be held HIGH or LOW. They may not float. Power Dissipation 180 mW DC Electrical Characteristics Symbol Parameter VCC TA (cid:14)25qC TA (cid:16)40qC to (cid:14)85qC Units Conditions Min Typ Max Min Max VIH HIGH Level 2.0 1.5 1.5 Input 3.0 2.0 2.0 V Voltage 3.6 2.4 2.4 VIL LOW Level 2.0 0.5 0.5 Input 3.0 0.8 0.8 V Voltage 3.6 0.8 0.8 VOH HIGH Level 2.0 1.9 2.0 1.9 VIN VIH or VIL IOH (cid:16)50 PA Output 3.0 2.9 3.0 2.9 V IOH (cid:16)50 PA Voltage 3.0 2.58 2.48 IOH (cid:16)4 mA VOL LOW Level 2.0 0.0 0.1 0.1 VIN VIH or VIL IOL 50 PA Output 3.0 0.0 0.1 0.1 V IOL 50 PA Voltage 3.0 0.36 0.44 IOL 4 mA IOZ 3-STATE 3.6 r0.25 r2.5 PA VIN VIH or VIL Output VOUT VCC or GND Off-State Current IIN Input Leakage Current 3.6 r0.1 r1.0 PA VIN 5.5V or GND ICC Quiescent Supply Current 3.6 4.0 40.0 PA VIN VCC or GND Noise Characteristics (Note 3) VCC TA 25qC Conditions Symbol Parameter Units (V) Typ Limit CL (pF) VOLP Quiet Output Maximum Dynamic VOL 3.3 0.5 0.8 V 50 VOLV Quiet Output Minimum Dynamic VOL 3.3 (cid:16)0.5 (cid:16)0.8 V 50 VIHD Minimum HIGH Level Dynamic Input Voltage 3.3 2.0 V 50 VILD Maximum LOW Level Dynamic Input Voltage 3.3 0.8 V 50 Note 3: Input tr tf 3 ns www.fairchildsemi.com 2
7 AC Electrical Characteristics 4 L V VCC TA (cid:14)25qC TA (cid:16)40qC to (cid:14)85qC X Symbol Parameter Units Conditions 2 (V) Min Typ Max Min Max 4 tPLH Propagation Delay Time 2.7 6.1 10.7 1.0 13.5 CL 15 pF 5 tPHL 8.6 14.2 1.0 17.0 ns CL 50 pF 3.3 r 0.3 4.7 6.8 1.0 8.0 CL 15 pF 7.2 10.1 1.0 11.5 CL 50 pF tPZL 3-STATE Output 2.7 9.0 16.9 1.0 20.5 CL 15 pF, RL 1 k: tPZH Enable Time 11.5 20.4 1.0 24.0 ns CL 50 pF, RL 1 k: 3.3 r 0.3 7.1 11.0 1.0 13.0 CL 15 pF, RL 1 k: 9.6 14.5 1.0 16.5 CL 50 pF, RL 1 k: tPLZ 3-STATE Output 2.7 11.5 18.0 1.0 21.0 ns CL 50 pF, RL 1 k: tPHZ Disable Time 3.3 r 0.3 9.6 12.8 1.0 14.5 CL 50 pF, RL 1 k: tOSLH Output to Output Skew 2.7 1.5 1.5 ns CL 50 pF (Note 4) tOSHL (Note 4) 3.3 1.5 1.5 Note 4: Parameter guaranteed by design. tOSLH |tPLHm (cid:16) tPLHn|, tOSHL |tPHLm (cid:16) tPHLn| Capacitance TA (cid:14)25qC TA (cid:16)40qC to (cid:14)85qC Symbol Parameter Units Min Typ Max Min Max CIN Input Capacitance T/R, OE 4 10 10 pF CI/O Output Capacitance An, Bn 8 pF CPD Power Dissipation Capacitance (Note 5) 21 pF Note 5: CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. 3 www.fairchildsemi.com
5 4 Physical Dimensions 2 inches (millimeters) unless otherwise noted X V L 4 7 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package Number M20B www.fairchildsemi.com 4
7 Physical Dimensions 4 inches (millimeters) unless otherwise noted (Continued) L V X 2 4 5 Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 5 www.fairchildsemi.com
r e Physical Dimensions v inches (millimeters) unless otherwise noted (Continued) i e c s n a r T l a n o ti c e r i d i B l a t c O e g a t l o V w o L 5 4 2 X V L 4 7 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC20 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support which, (a) are intended for surgical implant into the device or system whose failure to perform can be rea- body, or (b) support or sustain life, and (c) whose failure sonably expected to cause the failure of the life support to perform when properly used in accordance with device or system, or to affect its safety or effectiveness. instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the www.fairchildsemi.com user. www.fairchildsemi.com 6
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