Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

R 7 March 1999 es 4L Revised June 2005 i V s T to 1 r 6 s 2 74LVT162244 (cid:127) 74LVTH162244 i 2 n 4 Low Voltage 16-Bit Buffer/Line Driver th 4 • e 7 with 3-STATE Outputs O 4 and 25(cid:1) Series Resistors in the Outputs utp LVT u H ts 1 General Description Features 6 2 The LVT162244 and LVTH162244 contain sixteen non- (cid:1) Input and output interface capability to systems at 24 inverting buffers with 3-STATE outputs designed to be 5V VCC 4 employed as a memory and address driver, clock driver, or (cid:1) Bushold data inputs eliminate the need for external pull- L bus oriented transmitter/receiver. The device is nibble con- o up resistors to hold unused inputs (74LVTH162244), w trolled. Individual 3-STATE control inputs can be shorted together for 8-bit or 16-bit operation. also available without bushold feature (74LVT162244). V (cid:1) Live insertion/extraction permitted o Teqhuei vaLlVeTn1t 62252:4 4s earineds rLeVsTisHta1n6c2e2 4in4 baorteh tdhees igHnIGedH wanitdh (cid:1) Power Up/Power Down high impedance provides glitch- lta LOW states of the output. This design reduces line noise in free bus loading g aeprsp, liacnadti obnuss struacnhs caesi vmeresm/troarnys maditdtererss.s drivers, clock driv- (cid:1) Omuatkpeu tse xitnecrlnuadle teerqmuiinvaalteionnt sreersiiessto rres siusntanneccee sosfa 2ry5 :a ntdo e 16 The LVTH162244 data inputs include bushold, eliminating reduce overshoot and undershoot -B the need for external pull-up resistors to hold unused (cid:1) Functionally compatible with the 74 series 162244 it inputs. (cid:1) Latch-up performance exceeds 500 mA B These buffers and line drivers are designed for low-voltage (cid:1) ESD performance: u (3.3V) VCC applications, but with the capability to provide a Human-body model ! 2000V ffe TLVTTLH in1t6e2r2fa4c4e atore a fa5bVr iceantveidro nwmithe nat.n T haedv LaVnTce1d6 2B2i4C4M aOnSd Machine model ! 200V r/L technology to achieve high speed operation similar to 5V Charged-device ! 1000V in ABT while maintaining a low power dissipation. (cid:1) Also packaged in plastic Fine-Pitch Ball Grid Array e (FBGA) D r i v e Ordering Code: r w Order Number PNaucmkabgeer Package Description ith 3 74LVT162244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide - (Note 1)(Note 2) S T 74LVT162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide A (Note 2) T E 74LVT162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide (Note 2) O u 74LVTH162244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide t (Note 1)(Note 2) p u 74LVTH162244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide t s [Tube] a 74LVTH162244MEX MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide n [Tape and Reel] d 74LVTH162244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 2 5 [Tube] (cid:1) 74LVTH162244MTX MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide S [Tape and Reel] e r Note 1: Ordering code “G” indicates Trays. ie Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. s © 2005 Fairchild Semiconductor Corporation DS012445 www.fairchildsemi.com

4 4 Logic Symbol Pin Descriptions 2 2 6 Pin Names Description 1 H T OEn Output Enable Inputs (Active LOW) LV I0–I15 Inputs 4 O0–O15 Outputs 7 NC No Connect (cid:127) 4 4 FBGA Pin Assignments 2 Connection Diagrams 2 6 1 2 3 4 5 6 1 Pin Assignment for SSOP and TSSOP VT A O0 NC OE1 OE2 NC I0 L B O2 O1 NC NC I1 I2 4 7 C O4 O3 VCC VCC I3 I4 D O6 O5 GND GND I5 I6 E O8 O7 GND GND I7 I8 F O10 O9 GND GND I9 I10 G O12 O11 VCC VCC I11 I12 H O14 O13 NC NC I13 I14 J O15 NC OE4 OE3 NC I15 Truth Table Inputs Outputs OE1 I0–I3 O0–O3 L L L L H H H X Z OE2 I4–I7 O4–O7 L L L L H H H X Z OE3 I8–I11 O8–O11 L L L Pin Assignment for FBGA L H H H X Z OE4 I12–I15 O12–O15 L L L L H H H X Z H HIGH Voltage Level L LOW Voltage Level Z High Impedance X Immaterial (Top Thru View) www.fairchildsemi.com 2

7 Functional Description 4 L V The LVT162244 and LVTH162244 contain sixteen non-inverting buffers with 3-STATE outputs. The device is nibble (4 bits) T controlled with each nibble functioning identically, but independent of the other. The control pins can be shorted together to 1 obtain full 16-bit operation. 6 2 2 Logic Diagram 4 4 (cid:127) 7 4 L V T H 1 6 2 2 4 4 3 www.fairchildsemi.com

4 4 Absolute Maximum Ratings 2 (Note 3) 2 6 Symbol Parameter Value Conditions Units 1 H VCC Supply Voltage (cid:16)0.5 to (cid:14)4.6 V VT VI DC Input Voltage (cid:16)0.5 to (cid:14)7.0 V 4L VO Output Voltage (cid:16)0.5 to (cid:14)7.0 Output in 3-STATE V 7 (cid:16)0.5 to (cid:14)7.0 Output in HIGH or LOW State (Note 4) (cid:127) IIK DC Input Diode Current (cid:16)50 VI (cid:31) GND mA 4 4 IOK DC Output Diode Current (cid:16)50 VO (cid:31) GND mA 22 IO DC Output Current 64 VO ! VCC Output at HIGH State mA 16 128 VO ! VCC Output at LOW State VT ICC DC Supply Current per Supply Pin r64 mA L IGND DC Ground Current per Ground Pin r128 mA 74 TSTG Storage Temperature (cid:16)65 to (cid:14)150 qC Recommended Operating Conditions Symbol Parameter Min Max Units VCC Supply Voltage 2.7 3.6 V VI Input Voltage 0 5.5 V IOH HIGH-Level Output Current (cid:16)12 mA IOL LOW-Level Output Current 12 mA TA Free Air Operating Temperature (cid:16)40 (cid:14)85 qC ’t/’V Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V 0 10 ns/V Note 3: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied. Note 4: IO Absolute Maximum Rating must be observed. DC Electrical Characteristics VCC TA (cid:16)40qC to (cid:14)85qC Symbol Parameter Units Conditions (V) Min Max VIK Input Clamp Diode Voltage 2.7 (cid:16)1.2 V II (cid:16)18 mA VIH Input HIGH Voltage 2.7–3.6 2.0 V VO d 0.1V or VIL Input LOW Voltage 2.7–3.6 0.8 V VO t VCC (cid:16) 0.1V VOH Output HIGH Voltage 2.7–3.6 VCC(cid:16)0.2 V IOH (cid:16)100 PA 3.0 2.0 IOH (cid:16)12 mA VOL Output LOW Voltage 2.7 0.2 V IOL 100 PA 3.0 0.8 IOL 12 mA II(HOLD) Bushold Input Minimum Drive 3.0 75 PA VI 0.8V (Note 5) (cid:16)75 VI 2.0V II(OD) Bushold Input Over-Drive 3.0 500 PA (Note 6) (Note 5) Current to Change State (cid:16)500 (Note 7) II Input Current 3.6 10 VI 5.5V Control Pins 3.6 r1 PA VI 0V or VCC Data Pins 3.6 (cid:16)5 VI 0V 1 VI VCC IOFF Power Off Leakage Current 0 r100 PA 0V d VI or VO d 5.5V IPU/PD Power Up/Down 0–1.5V r100 PA VO 0.5V to 3.0V 3-STATE Current VI GND or VCC IOZL 3-STATE Output Leakage Current 3.6 (cid:16)5 PA VO 0.5V IOZH 3-STATE Output Leakage Current 3.6 5 PA VO 3.0V IOZH(cid:14) 3-STATE Output Leakage Current 3.6 10 PA VCC (cid:31) VO d 5.5V ICCH Power Supply Current 3.6 0.19 mA Outputs HIGH ICCL Power Supply Current 3.6 5 mA Outputs LOW ICCZ Power Supply Current 3.6 0.19 mA Outputs Disabled www.fairchildsemi.com 4

7 DC Electrical Characteristics 4 (Continued) L V T Symbol Parameter VCC TA (cid:16)40qC to (cid:14)85qC Units Conditions 16 (V) Min Max 2 2 ICCZ(cid:14) Power Supply Current 3.6 0.19 mA VCC d VO d 5.5V, 4 Outputs Disabled 4 ’ICC Increase in Power Supply Current 3.6 0.2 mA One Input at VCC (cid:16) 0.6V (cid:127) 7 (Note 8) Other Inputs at VCC or GND 4 L Note 5: Applies to bushold versions only (74LVTH162244). V Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH. T Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW. H Note 8: This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND. 16 2 Dynamic Switching Characteristics (Note 9) 2 4 4 VCC TA 25qC Conditions Symbol Parameter Units (V) Min Typ Max CL 50 pF, RL 500: VOLP Quiet Output Maximum Dynamic VOL 3.3 0.8 V (Note 10) VOLV Quiet Output Minimum Dynamic VOL 3.3 (cid:16)0.8 V (Note 10) Note 9: Characterized in SSOP package. Guaranteed parameter, but not tested. Note 10: Max number of outputs defined as (n). n(cid:16)1 data inputs are driven 0V to 3V. Output under test held LOW. AC Electrical Characteristics TA (cid:16)40qC to (cid:14)85qC, CL 50 pF, RL 500: Symbol Parameter VCC 3.3V r 0.3V VCC 2.7V Units Min Max Min Max tPLH Propagation Delay Data to Output 1.4 4.0 1.4 4.8 ns tPHL 1.2 3.7 1.2 4.1 tPZH Output Enable Time 1.2 5.1 1.2 6.5 ns tPZL 1.4 5.4 1.4 6.9 tPHZ Output Disable Time 2.0 5.0 2.0 5.4 ns tPLZ 1.5 5.0 1.5 5.4 tOSHL Output to Output Skew 1.0 1.0 ns tOSLH (Note 11) Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Capacitance (Note 12) Symbol Parameter Conditions Typical Units CIN Input Capacitance VCC 0V, VI 0V or VCC 4 pF COUT Output Capacitance VCC 3.0V, VO 0V or VCC 8 pF Note 12: Capacitance is measured at frequency f 1 MHz, per MIL-STD-883, Method 3012. 5 www.fairchildsemi.com

4 4 Physical Dimensions 2 inches (millimeters) unless otherwise noted 2 6 1 H T V L 4 7 (cid:127) 4 4 2 2 6 1 T V L 4 7 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A www.fairchildsemi.com 6

7 Physical Dimensions 4 inches (millimeters) unless otherwise noted (Continued) L V T 1 6 2 2 4 4 (cid:127) 7 4 L V T H 1 6 2 2 4 4 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS48A 7 www.fairchildsemi.com

s s rie put Physical Dimensions inches (millimeters) unless otherwise noted (Continued) e S ut (cid:1) O 5 e 2 h d t n n a i s s r t o u t p s ut si O e R E T A T S - 3 h t i w r e v i r D e n i L / r e f f u B t i B - 6 1 e g a t l o V w o L 4 4 2 2 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 6 Package Number MTD48 1 H T V L Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and 4 7 Fairchild reserves the right at any time without notice to change said circuitry and specifications. (cid:127) LIFE SUPPORT POLICY 4 4 2 FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT 2 DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD 6 1 SEMICONDUCTOR CORPORATION. As used herein: T 1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support V L which, (a) are intended for surgical implant into the device or system whose failure to perform can be rea- 4 body, or (b) support or sustain life, and (c) whose failure sonably expected to cause the failure of the life support 7 to perform when properly used in accordance with device or system, or to affect its safety or effectiveness. instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the www.fairchildsemi.com user. www.fairchildsemi.com 8

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: 74LVTH162244MTD 74LVTH162244MTX 74LVTH162244MEA 74LVTH162244MEX