Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

7 4 L C X December 2013 2 4 4 (cid:151) 74LCX244 L o Low Voltage Buffer/Line Driver with 5V Tolerant w V Inputs and Outputs o l t a g e Features General Description B u ■ 5V tolerant inputs and outputs The LCX244 contains eight non-inverting buffers with f f ■ 2.3V to 3.6V VCC specifications provided 3-STATE outputs. The device may be employed as a er ■ 6.5ns t max. (V = 3.3V), 10(cid:181)A I max. memory address driver, clock driver and bus-oriented /L PD CC CC transmitter/receiver. The LCX244 is designed for low in ■ Power down high impedance inputs and outputs voltage (2.5V or 3.3V) V applications with capability of e ■ Supports live insertion/withdrawal(1) interfacing to a 5V signaCl eCnvironment. D r ■ –24mA output drive (V = 3.0V) i CC The LCX244 is fabricated with an advanced CMOS tech- v ■ Implements proprietary noise/EMI reduction circuitry e nology to achieve high speed operation while maintain- r ■ Latch-up performance exceeds 500mA ing CMOS low power dissipation. w i ■ ESD performance: th (cid:150) Human body model > 2000V 5 V (cid:150) Machine model > 200V T ■ Leadless DQFN package o l e r a Note: n 1. To ensure the high-impedance state during power up t I or down, OE should be tied to V through a pull-up n CC p resistor: the minimum value or the resistor is u determined by the current-sourcing capability of the ts driver. a n d O Ordering Information u t p Package u t Order Number Number Package Description s 74LCX244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide 74LCX244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), 74LCX244BQX(2) MLP20B JEDEC MO-241, 2.5 x 4.5mm 74LCX244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide 74LCX244MTC 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, MTC20 4.4mm Wide Note: 2. DQFN package available in Tape and Reel only. Device also available in Tape and Reel. Specify by appending suffix letter (cid:147)X(cid:148) to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2

7 4 Connection Diagram Logic Diagram L C X Pin Assignments for SOIC, SOP, SSOP, and TSSOP 2 4 4 (cid:151) L o w V o l t a g e B u f f e r / L i n e D r i v e Pad Assignments for DQFN r w i t h 5 Truth Tables V T Inputs Outputs o l e OE1 In (Pins 12, 14, 16, 18) ra n L L L t I L H H n p H X Z u t s a Inputs Outputs n d OE I (Pins 3, 5, 7, 9) O 2 n u L L L t p u L H H t s H X Z (Top Through View) (Bottom View) H = HIGH Voltage Level L = LOW Voltage Level Pin Description X = Immaterial Pin Names Description Z = High Impedance OE , OE 3-STATE Output Enable Inputs 1 2 I (cid:150)I Inputs 0 7 O (cid:150)O Outputs 0 7 DAP No Connect Note: DAP (Die Attach Pad) '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 2

7 4 Absolute Maximum Ratings L C Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be X 2 operable above the recommended operating conditions and stressing the parts to these levels is not recommended. 4 In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. 4 The absolute maximum ratings are stress ratings only. (cid:151) L Symbol Parameter Rating o w V Supply Voltage (cid:150)0.5V to +7.0V CC V V DC Input Voltage (cid:150)0.5V to +7.0V o I l t V DC Output Voltage a O g Output in 3-STATE (cid:150)0.5V to +7.0V e B Output in HIGH or LOW State(3) (cid:150)0.5V to VCC + 0.5V u f IIK DC Input Diode Current, VI < GND (cid:150)50mA fe r IOK DC Output Diode Current /L i V < GND (cid:150)50mA n O e V > V +50mA D O CC r IO DC Output Source/Sink Current –50mA iv e I DC Supply Current per Supply Pin –100mA r CC w IGND DC Ground Current per Ground Pin –100mA it h TSTG Storage Temperature (cid:150)65(cid:176)C to +150(cid:176)C 5 V Note: T 3. I Absolute Maximum Rating must be observed. o O l e r a Recommended Operating Conditions(4) nt I The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended n p operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not u recommend exceeding them or designing to absolute maximum ratings. ts a Symbol Parameter Min. Max. Units n d V Supply Voltage CC O Operating 2.0 3.6 V u t p Data Retention 1.5 3.6 u t V Input Voltage 0 5.5 V s I V Output Voltage O 3-STATE 0 5.5 V HIGH or LOW State 0 V CC IOH / IOL Output Current V = 3.0V(cid:150)3.6V –24 mA CC V = 2.7V(cid:150)3.0V –12 CC V = 2.3V(cid:150)2.7V –8 CC T Free-Air Operating Temperature (cid:150)40 85 (cid:176)C A Δt / ΔV Input Edge Rate, VIN = 0.8V(cid:150)2.0V, VCC = 3.0V 0 10 ns / V Note: 4. Unused inputs must be held HIGH or LOW. They may not float. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 3

7 4 DC Electrical Characteristics L C X TA = (cid:150)40(cid:176)C to +85(cid:176)C 2 4 Symbol Parameter V (V) Conditions Min. Max. Units 4 CC (cid:151) V HIGH Level Input Voltage 2.3(cid:150)2.7 1.7 V IH L 2.7(cid:150)3.6 2.0 o w VIL LOW Level Input Voltage 2.3(cid:150)2.7 0.7 V V 2.7(cid:150)3.6 0.8 o l t a V HIGH Level Output Voltage 2.3(cid:150)3.6 I = (cid:150)100(cid:181)A V (cid:150) 0.2 V OH OH CC g e 2.3 IOH = (cid:150)8mA 1.8 B 2.7 I = (cid:150)12mA 2.2 u OH f f 3.0 I = (cid:150)18mA 2.4 e OH r / I = (cid:150)24mA 2.2 L OH i n VOL LOW Level Output Voltage 2.3(cid:150)3.6 IOL = 100(cid:181)A 0.2 V e 2.3 I = 8mA 0.6 D OL r i 2.7 I = 12mA 0.4 v OL e 3.0 IOL = 16mA 0.4 r w I = 24mA 0.55 i OL t h II Input Leakage Current 2.3(cid:150)3.6 0 ≤ VI ≤ 5.5V –5.0 (cid:181)A 5 V IOZ 3-STATE Output Leakage 2.3(cid:150)3.6 0 ≤ VO ≤ 5.5V, –5.0 (cid:181)A T VI = VIH or VIL o l e I Power-Off Leakage Current 0 V or V = 5.5V 10 (cid:181)A OFF I O r a I Quiescent Supply Current 2.3(cid:150)3.6 V = V or GND 10 (cid:181)A n CC I CC t 3.6V ≤ VI, VO ≤ 5.5V(5) –10 In p ΔICC Increase in ICC per Input 2.3(cid:150)3.6 VIH = VCC (cid:150) 0.6V 500 (cid:181)A u t s Note: a 5. Outputs disabled or 3-STATE only. n d O u AC Electrical Characteristics t p u T = (cid:150)40(cid:176)C to +85(cid:176)C, R = 500Ω t A L s V = 3.3V – 0.3V, V = 2.7V, V = 2.5V – 0.2V, CC CC CC C = 50pF C = 50pF C = 30pF L L L Symbol Parameter Min. Max. Min. Max. Min. Max. Units t , t Propagation Delay, 1.5 6.5 1.5 7.5 1.5 7.8 ns PHL PLH Data to Output t , t Output Enable Time 1.5 8.0 1.5 9.0 1.5 10.0 ns PZL PZH t , t Output Disable Time 1.5 7.0 1.5 8.0 1.5 8.4 ns PLZ PHZ t , t Output to Output Skew(6) 1.0 ns OSHL OSLH Note: 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to- LOW (t ) or LOW-to-HIGH (t ). OSHL OSLH '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 4

7 4 Dynamic Switching Characteristics L C X TA = 25(cid:176)C 2 4 Symbol Parameter V (V) Conditions Typical Unit 4 CC (cid:151) V Quiet Output Dynamic Peak V 3.3 C = 50pF, V = 3.3V, V = 0V 0.8 V OLP OL L IH IL L 2.5 C = 30pF, V = 2.5V, V = 0V 0.6 o L IH IL w VOLV Quiet Output Dynamic Valley VOL 3.3 CL = 50pF, VIH = 3.3V, VIL = 0V (cid:150)0.8 V V 2.5 C = 30pF, V = 2.5V, V = 0V (cid:150)0.6 o L IH IL l t a g e B Capacitance u f f e Symbol Parameter Conditions Typical Units r / L CIN Input Capacitance VCC = Open, VI = 0V or VCC 7.0 pF in e C Output Capacitance V = 3.3V, V = 0V or V 8.0 pF OUT CC I CC D C Power Dissipation Capacitance V = 3.3V, V = 0V or V , f = 10MHz 25.0 pF r PD CC I CC i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 5

7 4 AC Loading and Waveforms (Generic for LCX Family) LC X 2 Test Switch 4 4 t , t Open (cid:151) PLH PHL tPZL, tPLZ 6V at VCC = 3.3 – 0.3V L V x 2 at V = 2.5 – 0.2V o CC CC w tPZH, tPHZ GND V o l t a g Figure 1. AC Test Circuit (CL includes probe and jig capacitance) e B u f f e r / L i n e D r i v e r Waveform for Inverting and Non-Inverting Functions 3-STATE Output High Enable and w Disable Times for Logic i t h 5 V T o l e r a n t I n p u t s a Propagation Delay. Pulse Width and t Waveforms Setup Time, Hold Time and Recovery Time for Logic n rec d O u t p u t s 3-STATE Output Low Enable and t and t rise fall Disable Times for Logic V CC Symbol 3.3V – 0.3V 2.7V 2.5V – 0.2V Vmi 1.5V 1.5V VCC / 2 Vmo 1.5V 1.5V VCC / 2 V V + 0.3V V + 0.3V V + 0.15V x OL OL OL V V (cid:150) 0.3V V (cid:150) 0.3V V (cid:150) 0.15V y OH OH OH Figure 2. Waveforms (Input Characteristics; f = 1MHz, t = t = 3ns) r f '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 6

7 4 Schematic Diagram (Generic for LCX Family) LC X 2 4 4 (cid:151) L o w V o l t a g e B u f f e r / L i n e D r i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 7

7 4 Tape and Reel Specification L C X Tape Format for DQFN 2 4 Package Designator Tape Section Number of Cavities Cavity Status Cover Tape Status 4 (cid:151) BQX Leader (Start End) 125 (typ.) Empty Sealed L Carrier 3000 Filled Sealed o w Trailer (Hub End) 75 (typ.) Empty Sealed V o l t a Tape Dimension inches (millimeters) g e B u f f e r / L i n e D r i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s Reel Dimensions inches (millimeters) Tape Size A B C D N W1 W2 12mm 13.0 (330.0) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 2.165 (55.00) 0.488 (12.4) 0.724 (18.4) '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 8

7 4 Physical Dimensions L C X 2 4 4 (cid:151) L o 13.00 w 12.60 A V o 11.43 l t a 20 11 g B e B u f f e 9.50 r / 10.65 7.60 L 10.00 7.40 in e 2.25 D r i v e r w PIN ONE 1 0.51 1.27 10 1.27 0.65 ith 0.35 INDICATOR 5 0.25 M C B A V LAND PATTERN RECOMMENDATION T o l e 2.65 MAX r SEE DETAIL A a n t I 0.33 n C 0.20 p u t 0.30 0.10 C s 0.75 0.10 SEATING PLANE a X 45° n 0.25 d NOTES: UNLESS OTHERWISE SPECIFIED O (R0.10) u A) THIS PACKAGE CONFORMS TO JEDEC t GAGE PLANE p (R0.10) MS-013, VARIATION AC, ISSUE E u 0.25 B) ALL DIMENSIONS ARE IN MILLIMETERS. ts 8° 0° C) DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS. 1.27 D) CONFORMS TO ASME Y14.5M-1994 0.40 SEATING PLANE E) LANDPATTERN STANDARD: SOIC127P1030X265-20L (1.40) DETAIL A F) DRAWING FILENAME: MKT-M20BREV3 SCALE: 2:1 Figure 3. 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild(cid:146)s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor(cid:146)s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 9

7 4 Physical Dimensions (Continued) LC X 2 4 4 (cid:151) L o w V o l t a g e B u f f e r / L i n e D r i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s Figure 4. 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild(cid:146)s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor(cid:146)s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 10

7 4 Physical Dimensions (Continued) LC X 2 4 4 (cid:151) L o w V o l t a g e B u f f e r / L i n e D r i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s Figure 5. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild(cid:146)s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor(cid:146)s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 11

7 4 Physical Dimensions (Continued) LC X 2 4 4 (cid:151) L o w V o l t a g e B u f f e r / L i n e D r i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s Figure 6. 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild(cid:146)s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor(cid:146)s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 12

7 4 Physical Dimensions (Continued) LC X 2 4 4 (cid:151) L o w V o l t a g e B u f f e r / L i n e D r i v e r w i t h 5 V T o l e r a n t I n p u t s a n d O u t p u t s Figure 7. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild(cid:146)s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor(cid:146)s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. '1994 Fairchild Semiconductor Corporation www.fairchildsemi.com 74LCX244 Rev. 1.12.2 13

TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. AccuPower(cid:2) F-PFS(cid:2) Sync-Lock™ AX-CAP®* FRFET® ® BitSiC(cid:2) Global Power ResourceSM PowerTrench® ®* Build it Now(cid:2) GreenBridge(cid:2) PowerXS™ TinyBoost® CorePLUS(cid:2) Green FPS(cid:2) Programmable Active Droop(cid:2) TinyBuck® CorePOWER(cid:2) Green FPS(cid:2) e-Series(cid:2) QFET® TinyCalc(cid:2) CROSSVOLT(cid:2) Gmax(cid:2) QS(cid:2) TinyLogic® CTL(cid:2) GTO(cid:2) Quiet Series(cid:2) TINYOPTO(cid:2) Current Transfer Logic(cid:2) IntelliMAX(cid:2) RapidConfigure(cid:2) TinyPower(cid:2) DEUXPEED® ISOPLANAR(cid:2) (cid:2) TinyPWM(cid:2) Dual Cool™ Making Small Speakers Sound Louder TinyWire(cid:2) EcoSPARK® and Better™ Saving our world, 1mW/W/kWat a time™ TranSiC(cid:2) EfficientMax(cid:2) MegaBuck(cid:2) SignalWise(cid:2) TriFault Detect(cid:2) ESBC(cid:2) MICROCOUPLER(cid:2) SmartMax(cid:2) TRUECURRENT®* ® MicroFET(cid:2) SMART START(cid:2) (cid:3)SerDes(cid:2) MicroPak(cid:2) Solutions for Your Success(cid:2) FFFFFFFFaAPAAEaasiiCSCSTrrtccB(cid:2)TvTThhC®e® iiQll noddcur ®eShi e(cid:2)(cid:2)et m Siecroiensd(cid:2)uc tor® MMMmOOOPpPWioilclttTTeroiSoorOOHDnaPPLiMvrTaOieLvk(cid:2)arAe2G®x (cid:2)N(cid:2) (cid:2)ICA ®R ® SSSSSSSSuTuuPuuypnppppEMecereeAe®rFrrrSL FMSSEOTEOOTOHTT(cid:2)TTS(cid:2)(cid:2)®(cid:2)(cid:2) ® - 3--68 UUUVVVXCioSHlnstrli™XuCtFaaa(cid:2)E ®g Fl MTe R(cid:2)PaFlx uE(cid:2) sT(cid:2) (cid:2) * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are 2. A critical component in any component of a life support, device, or intended for surgical implant into the body or (b) support or sustain system whose failure to perform can be reasonably expected to life, and (c) whose failure to perform when properly used in cause the failure of the life support device or system, or to affect its accordance with instructions for use provided in the labeling, can be safety or effectiveness. reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Datasheet contains the design specifications for product development. Specifications may change Advance Information Formative / In Design in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Preliminary First Production Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make No Identification Needed Full Production changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. Obsolete Not In Production The datasheet is for reference information only. Rev. I66 © Fairchild Semiconductor Corporation www.fairchildsemi.com

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative © Semiconductor Components Industries, LLC www.onsemi.com www.onsemi.com 1

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: 74LCX244MTC 74LCX244BQX 74LCX244MTCX 74LCX244SJ 74LCX244SJX 74LCX244WM 74LCX244WMX 74LCX244MSA 74LCX244MSAX