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7 4 February 1994 L Revised May 2005 C X 1 6 2 74LCX16244 4 4 Low Voltage 16-Bit Buffer/Line Driver L o w with 5V Tolerant Inputs and Outputs V o l t General Description Features a g The LCX16244 contains sixteen non-inverting buffers with (cid:1) 5V tolerant inputs and outputs e 3-STATE outputs designed to be employed as a memory (cid:1) 2.3V to 3.6V VCC specifications provided 16 atenrd/r eacdedivreesr.s Tdhreiv edr,e vcilcoec ki sd rnivibebr,l eo rc obnutsr oollreiedn. tEeda cthra nnsibmbilte- (cid:1) 4.5 ns tPD max, 10 PA ICCQ max -B has separate 3-STATE control inputs which can be shorted (cid:1) Power down high impedance inputs and outputs it together for full 16-bit operation. (cid:1) Supports live insertion/withdrawal (Note 1) B u The LCX16244 is designed for low voltage (2.5 or 3.3V) (cid:1) r24 mA output drive (VCC 3.0V) ff VCC applications with capability of interfacing to a 5V signal (cid:1) Uses patented noise/EMI reduction circuitry er environment. / (cid:1) Latch-up performance exceeds 500 mA L Tnohleo gLyC Xto1 6a2ch4i4e vise f ahbigrihc astpeede wdi tohp aenr aatdiovna nwcheidle CmMaOinSta tiencinhg- (cid:1) ESD performance: ine CMOS low power dissipation. Human body model ! 2000V D Machine model ! 200V r i (cid:1) Also packaged in plastic Fine-Pitch Ball Grid Array ve (FBGA) r Note 1: To ensure the high-impedance state during power up or down, OE w should be tied to VCC through a pull-up resistor: the minimum value or the it resistor is determined by the current-sourcing capability of the driver. h 5 V T o Ordering Code: l e r a Order Number Package Number Package Description n 74LCX16244G BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide t I (Note 2)(Note 3) n p 74LCX16244MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide u (Note 3) t s 74LCX16244MTD MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide a (Note 3) n d Note 2: Ordering code “G” indicates Trays. O Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. u Logic Symbol tp u t s GTO¥ is a trademark of Fairchild Semiconductor Corporation. © 2005 Fairchild Semiconductor Corporation DS012000 www.fairchildsemi.com

4 4 Connection Diagrams Pin Descriptions 2 6 X1 Pin Assignment for SSOP and TSSOP Pin Names Description C OEn Output Enable Input (Active LOW) L 4 I0–I15 Inputs 7 O0–O15 Outputs NC No Connect FBGA Pin Assignments 1 2 3 4 5 6 A O0 NC OE1 OE2 NC I0 B O2 O1 NC NC I1 I2 C O4 O3 VCC VCC I3 I4 D O6 O5 GND GND I5 I6 E O8 O7 GND GND I7 I8 F O10 O9 GND GND I9 I10 G O12 O11 VCC VCC I11 I12 H O14 O13 NC NC I13 I14 J O15 NC OE4 OE3 NC I15 Truth Tables Inputs Outputs OE1 I0–I3 O0–O3 L L L L H H Pin Assignment for FBGA H X Z Inputs Outputs OE2 I4–I7 O4–O7 L L L L H H H X Z Inputs Outputs OE3 I8–I11 O8–O11 L L L L H H (Top Thru View) H X Z Inputs Outputs OE4 I12–I15 O12–O15 L L L L H H H X Z H HIGH Voltage Level L LOW Voltage Level X Immaterial Z High Impedance www.fairchildsemi.com 2

7 Functional Description 4 L The LCX16244 contains sixteen non-inverting buffers with puts are controlled by an Output Enable (OEn) input for CX 3-STATE standard outputs. The device is nibble (4 bits) each nibble. When OEn is LOW, the outputs are in 2-state 1 cpoenntdroelnlet do wf itthh ee aocthh enri.b bTlhee f ucnocntitornoiln gp inidse nctaicna llby,e b usht oinrdteed- mode. When OEn is HIGH, the outputs are in the high 62 impedance mode, but this does not interfere with entering 4 together to obtain full 16-bit operation. The 3-STATE out- new data into the inputs. 4 Logic Diagram 3 www.fairchildsemi.com

4 4 Absolute Maximum Ratings 2 (Note 4) 6 1 Symbol Parameter Value Conditions Units X C VCC Supply Voltage (cid:16)0.5 to (cid:14)7.0 V 4L VI DC Input Voltage (cid:16)0.5 to (cid:14)7.0 V 7 VO DC Output Voltage (cid:16)0.5 to (cid:14)7.0 Output in 3-STATE V (cid:16)0.5 to VCC (cid:14) 0.5 Output in HIGH or LOW State (Note 5) IIK DC Input Diode Current (cid:16)50 VI (cid:31) GND mA IOK DC Output Diode Current (cid:16)50 VO (cid:31) GND mA (cid:14)50 VO ! VCC IO DC Output Source/Sink Current r50 mA ICC DC Supply Current per Supply Pin r100 mA IGND DC Ground Current per Ground Pin r100 mA TSTG Storage Temperature (cid:16)65 to (cid:14)150 qC Recommended Operating Conditions (Note 6) Symbol Parameter Min Max Units VCC Supply Voltage Operating 2.0 3.6 V Data Retention 1.5 3.6 VI Input Voltage 0 5.5 V VO Output Voltage HIGH or LOW State 0 VCC V 3-STATE 0 5.5 IOH/IOL Output Current VCC 3.0V (cid:16) 3.6V r24 VCC 2.7V (cid:16) 3.0V r12 mA VCC 2.3V (cid:16) 2.7V r8 TA Free-Air Operating Temperature (cid:16)40 85 qC ’t/’V Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V 0 10 ns/V Note 4: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom- mended Operating Conditions” table will define the conditions for actual device operation. Note 5: IO Absolute Maximum Rating must be observed. Note 6: Unused inputs must be held HIGH or LOW. They may not float. DC Electrical Characteristics VCC TA (cid:16)40qC to (cid:14)85qC Symbol Parameter Conditions Units (V) Min Max VIH HIGH Level Input Voltage 2.3 (cid:16) 2.7 1.7 V 2.7 (cid:16) 3.6 2.0 VIL LOW Level Input Voltage 2.3 (cid:16) 2.7 0.7 V 2.7 (cid:16) 3.6 0.8 VOH HIGH Level Output Voltage IOH (cid:16)100 PA 2.3 (cid:16) 3.6 VCC (cid:16) 0.2 IOH (cid:16)8 mA 2.3 1.8 IOH (cid:16)12 mA 2.7 2.2 V IOH (cid:16)18 mA 3.0 2.4 IOH (cid:16)24 mA 3.0 2.2 VOL LOW Level Output Voltage IOL 100 PA 2.3 (cid:16) 3.6 0.2 IOL 8 mA 2.3 0.6 IOL 12 mA 2.7 0.4 V IOL 16 mA 3.0 0.4 IOL 24 mA 3.0 0.55 II Input Leakage Current 0 d VI d 5.5V 2.3 (cid:16) 3.6 r5.0 PA IOZ 3-STATE Output Leakage 0 d VO d 5.5V 2.3 (cid:16) 3.6 r5.0 PA VI VIH or VIL IOFF Power-Off Leakage Current VI or VO 5.5V 0 10 PA www.fairchildsemi.com 4

7 DC Electrical Characteristics 4 (Continued) L C X VCC TA (cid:16)40qC to (cid:14)85qC 1 Symbol Parameter Conditions Units 6 (V) Min Max 2 ICC Quiescent Supply Current VI VCC or GND 2.3 (cid:16) 3.6 20 PA 44 3.6V d VI, VO d 5.5V (Note 7) 2.3 (cid:16) 3.6 r20 ’ICC Increase in ICC per Input VIH VCC (cid:16)0.6V 2.3 (cid:16) 3.6 500 PA Note 7: Outputs disabled or 3-STATE only. AC Electrical Characteristics TA (cid:16)40qC to (cid:14)85qC, RL 500 : VCC 3.3V r 0.3V VCC 2.7V VCC 2.5 r 0.2V Symbol Parameter Units CL 50 pF CL 50 pF CL 30 pF Min Max Min Max Min Max tPHL Propagation Delay 1.0 4.5 1.0 5.2 1.0 5.4 ns tPLH Data to Output 1.0 4.5 1.0 5.2 1.0 5.4 tPZL Output Enable Time 1.0 5.5 1.0 6.3 1.0 7.2 ns tPZH 1.0 5.5 1.0 6.3 1.0 7.2 tPLZ Output Disable Time 1.0 5.4 1.0 5.7 1.0 6.5 ns tPHZ 1.0 5.4 1.0 5.7 1.0 6.5 tOSHL Output to Output Skew (Note 8) 1.0 ns tOSLH 1.0 Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Dynamic Switching Characteristics VCC TA 25qC Symbol Parameter Conditions Unit (V) Typical VOLP Quiet Output Dynamic Peak VOL CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 V CL 30pF, VIH 2.5V, VIL 0V 2.5 0.6 VOLV Quiet Output Dynamic Valley VOL CL 50 pF, VIH 3.3V, VIL 0V 3.3 (cid:16)0.8 V CL 30pF, VIH 2.5V, VIL 0V 2.5 (cid:16)0.6 Capacitance Symbol Parameter Conditions Typical Units CIN Input Capacitance VCC Open, VI 0V or VCC 7 pF COUT Output Capacitance VCC 3.3V, VI 0V or VCC 8 pF CPD Power Dissipation Capacitance VCC 3.3V, VI 0V or VCC, f 10 MHz 20 pF 5 www.fairchildsemi.com

4 4 AC LOADING and WAVEFORMS 2 Generic for LCX Family 6 1 X C L 4 7 FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Test Switch tPLH, tPHL Open tPZL, tPLZ 6V at VCC 3.3 r 0.3V VCC x 2 at VCC 2.5 r 0.2V tPZH,tPHZ GND Waveform for Inverting and Non-Inverting Functions 3-STATE Output High Enable and Disable Times for Logic Propagation Delay. Pulse Width and trec Waveforms Setup Time, Hold Time and Recovery Time for Logic 3-STATE Output Low Enable and trise and tfall Disable Times for Logic FIGURE 2. Waveforms (Input Characteristics; f =1MHz, tR = tF = 3ns) VCC Symbol 3.3V r 0.3V 2.7V 2.5V r 0.2V Vmi 1.5V 1.5V VCC/2 Vmo 1.5V 1.5V VCC/2 Vx VOL (cid:14) 0.3V VOL (cid:14) 0.3V VOL (cid:14) 0.15V Vy VOH (cid:16) 0.3V VOH (cid:16) 0.3V VOH (cid:16) 0.15V www.fairchildsemi.com 6

7 Schematic Diagram 4 Generic for LCX Family L C X 1 6 2 4 4 7 www.fairchildsemi.com

4 4 Physical Dimensions 2 inches (millimeters) unless otherwise noted 6 1 X C L 4 7 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A www.fairchildsemi.com 8

7 Physical Dimensions 4 inches (millimeters) unless otherwise noted (Continued) L C X 1 6 2 4 4 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide Package Number MS48A 9 www.fairchildsemi.com

s ut Physical Dimensions inches (millimeters) unless otherwise noted (Continued) p t u O d n a s t u p n I t n a r e l o T V 5 h t i w r e v i r D e n i L r/ e f f u B t i B - 6 1 e g a t l o V w o L 4 4 2 6 1 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide X Package Number MTD48 C L 4 7 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support which, (a) are intended for surgical implant into the device or system whose failure to perform can be rea- body, or (b) support or sustain life, and (c) whose failure sonably expected to cause the failure of the life support to perform when properly used in accordance with device or system, or to affect its safety or effectiveness. instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the www.fairchildsemi.com user. www.fairchildsemi.com 10

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative © Semiconductor Components Industries, LLC www.onsemi.com www.onsemi.com 1

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: 74LCX16244MTD 74LCX16244MTDX 74LCX16244MEA 74LCX16244MEAX