INTEGRATED CIRCUITS 74ABT541 Octal buffer/line driver (3-State) Product specification 1998 Jan 16 Supersedes data of 1996 Sep 10 IC23 Data Handbook (cid:1)(cid:6)(cid:7)(cid:8)(cid:7)(cid:12)(cid:14) (cid:2)(cid:5)(cid:9)(cid:7)(cid:3)(cid:11)(cid:10)(cid:4)(cid:16)(cid:3)(cid:15)(cid:11)(cid:13)(cid:14)

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 FEATURES • ESD protection exceeds 2000 V per MIL STD 883 Method 3015 • Octal bus interface and 200 V per Machine Model • • Functions similar to the ’ABT241 Live insertion/extraction permitted • Provides ideal interface and increases fan-out of MOS DESCRIPTION Microprocessors • The 74ABT541 high-performance BiCMOS device combines low Efficient pinout to facilitate PC board layout static and dynamic power dissipation with high speed and high • 3-State buffer outputs sink 64mA and source 32mA output drive. •Power-up 3-State The 74ABT541 device is an octal buffer that is ideal for driving bus • lines. The outputs are all capable of sinking 64mA and sourcing Latch-up protection exceeds 500mA per Jedec JC40.2 Std 17 32mA. The device features input and outputs on opposite sides of the package to facilitate printed circuit board layout. QUICK REFERENCE DATA CONDITIONS SYMBOL PARAMETER Tamb = 25°C; GND = 0V TYPICAL UNIT ttPPLHHL PArno tpoa Ygantion delay CL = 50pF; VCC = 5V 2.9 ns CIN Input capacitance VI = 0V or VCC 4 pF COUT Output capacitance Outputs disabled; VO = 0V or VCC 7 pF ICCZ Total supply current Outputs disabled; VCC = 5.5V 500 nA ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 20-Pin Plastic DIP –40°C to +85°C 74ABT541 N 74ABT541 N SOT146-1 20-Pin plastic SO –40°C to +85°C 74ABT541 D 74ABT541 D SOT163-1 20-Pin Plastic SSOP Type II –40°C to +85°C 74ABT541 DB 74ABT541 DB SOT339-1 20-Pin PlasticTSSOP Type I –40°C to +85°C 74ABT541 PW 74ABT541PW DH SOT360-1 PIN CONFIGURATION LOGIC SYMBOL 1 OE0 19 OE1 OE0 1 20 VCC 2 18 A0 Y0 A0 2 19 OE1 3 17 A1 3 18 Y0 A1 Y1 A2 4 17 Y1 4 16 A2 Y2 A3 5 16 Y2 5 15 A3 Y3 A4 6 15 Y3 6 14 A5 7 14 Y4 A4 Y4 A6 8 13 Y5 7 13 A5 Y5 A7 9 12 Y6 8 12 GND 10 11 Y7 A6 Y6 9 11 A7 Y7 SA00202 SA00203 1998 Jan 16 2 853-1458 18864

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 LOGIC SYMBOL (IEEE/IEC) PIN DESCRIPTION PIN NUMBER SYMBOL NAME AND FUNCTION 2, 3, 4, 5, 1 & 6, 7, 8, 9 A0 – A7 Data inputs EN 19 18, 17, 16, 15, Y0 – Y7 Data outputs 14, 13, 12, 11 1, 19 OE0, OE1 Output enables 2 18 3 17 10 GND Ground (0V) 4 16 20 VCC Positive supply voltage 5 15 6 14 FUNCTION TABLE 7 13 8 12 INPUTS OUTPUTS 9 11 OE0 OE1 An Yn L L L L SA00204 L L H H X H X Z H X X Z H =High voltage level L =Low voltage level X =Don’t care Z =High impedance ”off” state ABSOLUTE MAXIMUM RATINGS1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT VCC DC supply voltage –0.5 to +7.0 V IIK DC input diode current VI < 0 –18 mA VI DC input voltage3 –1.2 to +7.0 V IOK DC output diode current VO < 0 –50 mA VOUT DC output voltage3 output in Off or High state –0.5 to +5.5 V IOUT DC output current output in Low state 128 mA Tstg Storage temperature range –65 to 150 °C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C. 3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 1998 Jan 16 3

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS UNIT Min Max VCC DC supply voltage 4.5 5.5 V VI Input voltage 0 VCC V VIH High-level input voltage 2.0 V VIL Low-level Input voltage 0.8 V IOH High-level output current –32 mA IOL Low-level output current 64 mA D t/D v Input transition rise or fall rate 0 5 ns/V Tamb Operating free-air temperature range –40 +85 °C DC ELECTRICAL CHARACTERISTICS LIMITS SYMBOL PARAMETER TEST CONDITIONS Tamb = +25°C Tamtob +=8 –54°C0°C UNIT Min Typ Max Min Max VIK Input clamp voltage VCC = 4.5V; IIK = –18mA –0.9 –1.2 –1.2 V VCC = 4.5V; IOH = –3mA; VI = VIL or VIH 2.5 2.9 2.5 V VOH High-level output voltage VCC = 5.0V; IOH = –3mA; VI = VIL or VIH 3.0 3.4 3.0 V VCC = 4.5V; IOH = –32mA; VI = VIL or VIH 2.0 2.4 2.0 V VOL Low-level output voltage VCC = 4.5V; IOL = 64mA; VI = VIL or VIH 0.42 0.55 0.55 V II Input leakage current VCC = 5.5V; VI = GND or 5.5V ±0.01 ±1.0 ±1.0 m A IOFF Power-off leakage current VCC = 0.0V; VI or VO ≤ 4.5V ±5.0 ±100 ±100 m A IPU/IPD Pouotwpeurt -cuupr/rdeonwt3n 3-state VVCOCE == D2.o0nV’;t VcaOr e= 0.5V; VI = GND or VCC; ±5.0 ±50 ±50 m A IOZH 3-State output High current VCC = 5.5V; VO = 2.7V; VI = VIL or VIH 5.0 50 50 m A IOZL 3-State output Low current VCC = 5.5V; VO = 0.5V; VI = VIL or VIH –5.0 –50 –50 m A ICEX Output High leakage current VCC = 5.5V; VO = 5.5V; VI = GND or VCC 5.0 50 50 m A IO Output current1 VCC = 5.5V; VO = 2.5V –40 –100 –180 –40 –180 mA ICCH VCC = 5.5V; Outputs High, VI = GND or VCC 0.5 250 250 m A ICCL Quiescent supply current VCC = 5.5V; Outputs Low, VI = GND or VCC 24 30 30 mA ICCZ VVCI =C G= N5.D5 Vo;r OVuCtCputs 3-State; 0.5 250 250 m A Outputs enabled, one input at 3.4V, other 0.5 1.5 1.5 mA inputs at VCC or GND; VCC = 5.5V D ICC Aindpduitt ipoinna2l supply current per Ootuhtepru itnsp 3u-tSs taatt eV,C oCn eo rd GatNaD in; pVuCt Ca t= 3 5.4.5VV, 0.5 50 50 m A Outputs 3-State, one enable input at 3.4V, 0.5 1.5 1.5 mA other inputs at VCC or GND; VCC = 5.5V NOTES: 1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. 2. This is the increase in supply current for each input at 3.4V. 3. This parameter is valid for any VCC between 0V and 2.1V with a transition time of up to 10msec. For VCC = 2.1V to VCC = 5V (cid:1) 10%, a transition time of up to 100m sec is permitted. 1998 Jan 16 4

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 AC CHARACTERISTICS GND = 0V; tR = tF = 2.5ns; CL = 50pF, RL = 500W LIMITS SYMBOL PARAMETER WAVEFORM TVaCmCb == ++52.50°VC TaVmCb C= =– 4+05°.0CV t o± 0+.855V°C UNIT Min Typ Max Min Max tPLH Propagation delay 1 1.0 2.6 4.1 1.0 4.6 ns tPHL An to Yn 1.0 2.9 4.2 1.0 4.6 tPZH Output enable time 2 1.1 3.1 4.8 1.1 5.3 ns tPZL to High and Low level 2.1 4.4 5.9 2.1 6.4 tPHZ Output disable time 2 2.1 5.1 6.6 2.1 7.1 ns tPLZ from High and Low level 1.7 4.7 6.2 1.7 6.7 AC WAVEFORMS VM = 1.5V, VIN = GND to 3.0V 3 V OEn VM VM 1.5V 1.5V INPUT INPUT 0 V tPZL tPLZ 3.5V tPLH tPHL Yn VM VOH OUTPUT VOL + 0.3V tPZH tPHZ VOL 1.5V 1.5V VOH OUTPUT Yn VOH – 0.3V VOL OUTPUT VM SA00028 0V SA00206 Waveform 1. Waveforms Showing the Input (An) to Output (Yn) Waveform 2. Waveforms Showing the 3-State Output Enable Propagation Delays and Disable Times TEST CIRCUIT AND WAVEFORMS 7 V 500 W S1 From Output Open Under Test GND CL = 50 pF 500 W Load Circuit TEST S1 tpd open tPLZ/tPZL 7 V tPHZ/tPZH open DEFINITIONS CL = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. SA00012 1998 Jan 16 5

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 1998 Jan 16 6

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 1998 Jan 16 7

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 1998 Jan 16 8

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 1998 Jan 16 9

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 NOTES 1998 Jan 16 10

Philips Semiconductors Product specification Octal buffer/line driver (3-State) 74ABT541 Data sheet status Data sheet Product Definition [1] status status Objective Development This data sheet contains the design target or goal specifications for product development. specification Specification may change in any manner without notice. Preliminary Qualification This data sheet contains preliminary data, and supplementary data will be published at a later date. specification Philips Semiconductors reserves the right to make chages at any time without notice in order to improve design and supply the best possible product. Product Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make specification changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued datasheet before initiating or completing a design. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors  Copyright Philips Electronics North America Corporation 1998 811 East Arques Avenue All rights reserved. Printed in U.S.A. P.O. Box 3409 Sunnyvale, California 94088–3409 print code Date of release: 05-96 Telephone 800-234-7381 Document order number: 9397-750-03614 (cid:1)(cid:6)(cid:7)(cid:8)(cid:7)(cid:12)(cid:14) (cid:2)(cid:5)(cid:9)(cid:7)(cid:3)(cid:11)(cid:10)(cid:4)(cid:16)(cid:3)(cid:15)(cid:11)(cid:13)(cid:14) yyyy mmm dd 11