Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink TO-220 and TO-218 Standard Height Above Footprint P/N PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams) 634-10ABP(cid:1) 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48) 634-15ABP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21) 634-20ABP(cid:1) 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95) Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications cally mounting TO-220 and TO-218 components. Models are available with or without wave- where quick assembly is needed and space is at a premium. MECHANICAL DIMENSIONS 634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Notes: 1. Thermal compound is assumed between device and heat sink. 2.Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) 637 SERIES High-Efficiency Heat Sinks For Vertical Board Mounting TO-220 Height Above Thermal Performance at Typical Load Standard PC Board “A” Maximum Footprint Natural Forced Weight P/N in. (mm) in. (mm) Convection Convection lbs. (grams) 637-10ABP(cid:1) 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 76°C @ 6W 5.8°C/W @ 200 LFM 0.023 (10.43) 637-15ABP(cid:1) 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 65°C @ 6w 5.5°C/W @ 200 LFM 0.035 (15.88) 637-20ABP(cid:1) 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 55°C @ 6W 4.7°C/W @ 200 LFM 0.050 (22.68) 637-25ABP(cid:1) 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.062 (28.12) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. and board space occupied must be minimized. Refer to the Accessory products section for Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight thermal interface materials, thermal compounds, and other accessories products. MECHANICAL DIMENSIONS 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 44 (cid:1)Normally stocked