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304-86.6K-RC产品简介:
ICGOO电子元器件商城为您提供304-86.6K-RC由Xicon设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供304-86.6K-RC价格参考以及Xicon304-86.6K-RC封装/规格参数等产品信息。 你可以下载304-86.6K-RC参考资料、Datasheet数据手册功能说明书, 资料中有304-86.6K-RC详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
品牌 | Xicon |
产品目录 | 无源元件 |
描述 | 厚膜电阻器 - SMD 1/16WATT 86.6KOHMS |
产品分类 | |
产品手册 | |
产品图片 | |
rohs | RoHS 合规性豁免 |
产品系列 | 薄膜电阻器,厚膜电阻器 - SMD,Xicon 304-86.6K-RC |
产品型号 | 304-86.6K-RC |
产品 | Thick Film Resistors SMD |
产品种类 | 厚膜电阻器 - SMD |
功率额定值 | 62.5 mW (1/16 W) |
商标 | Xicon |
外壳代码-in | 0402 |
外壳代码-mm | 1005 |
外壳宽度 | 0.5 mm |
外壳长度 | 1 mm |
外壳高度 | 0.35 mm |
容差 | 1 % |
封装 | Reel |
封装/箱体 | 0402 (1005 metric) |
工作温度范围 | - 55 C to + 125 C |
工厂包装数量 | 10000 |
温度系数 | 200 PPM / C |
电压额定值 | 25 V |
电阻 | 86.6 kOhms |
系列 | CR1-RC |
1% Thick Film Chip Resistors (RoHS Compliant) CR1-RC Series FEATURES • Temperature Range: -55°C ~ +125°C • High purity alumina substrate • Wave or flow solderable • Excellent high frequency characteristics • Wrap around termination • Inner electrode protection DERATING CURVE REEL DIMENSIONS (mm) %) 13±.50 d ( a o L 50 ed min.178±2 at R 10±1 AmbientTemperature (°C) TAPING DIMENSIONS (mm) øD E F W %) B 13±.50 d ( a o LT A C G L 50 ed min.178±2 C at R A ± 0.2 B ± 0.2 C ± 0.05 øD ±W 0.1 E ± 0.1 F ± 0.05 G ± 0.1 W ± 0.2 T ± 0.1 T 2.00 3.60 2.0 1.5 1.75 3.5 4.0 8.0 0.81 10±1 D AmbientTemperature (°C) PART NUMBERING SYSTEM 2 9 0 1 0 K - R C Series Value Suffix (RoHS Compliant) SERIES, SIZE, WATTAGE, VOLTAGE, AND DIMENSIONS L C W T D Watts Voltage (V) (max.) Dimensions (mm) Series Case Size (W) W.V. O.V. L W C D T 290 1206 1/8 200 400 3.1 ± .15 1.55 ± .15 .45 ± .20 .45 ± .20 .55 ± .10 292 0805 1/10 150 300 2.0 ± .15 1.25 ± .15 .40 ± .20 .40 ± .20 .55 ± .10 302 0603 1/10 50 100 1.6 ± .10 .80 ± .15 .30 ± .20 .30 ± .20 .45± .10 304 0402 1/16 25 50 1.0 ± .10 .50 ± .05 .20 ± .10 .25 ± .10 .35 ± .05 XICON PASSIVE COMPONENTS • (800) 628-0544 XC-600037 Date Revised: 05/15/17 Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
1% Thick Film Chip Resistors (RoHS Compliant) CR1-RC Series STANDARD STOCKED VALUES (Ω) 10 16.9 28.7 48.7 82.5 140 237 392 665 1.13K 1.91K 3.16K 5.36K 9.09K 15.4K 26.1K 10.2 17.4 29.4 49.9 84.5 143 243 402 681 1.15K 1.96K 3.24K 5.49K 9.31K 15.8K 26.7K 10.5 17.8 30.1 51.1 86.6 147 249 412 698 1.18K 2.0K 3.32K 5.62K 9.53K 16.2K 27.4K 10.7 18.2 30.9 52.3 88.7 150 255 422 715 1.21K 2.05K 3.4K 5.76K 9.76K 16.5K 28K 11 18.7 31.6 53.6 90.9 154 261 432 732 1.24K 2.1K 3.48K 5.9K 10K 16.9K 28.7K 11.3 19.1 32.4 54.9 93.1 158 267 442 750 1.27K 2.15K 3.57K 6.04K 10.2K 17.4K 29.4K 11.5 19.6 33.2 56.2 95.3 162 274 453 768 1.3K 2.21K 3.65K 6.19K 10.5K 17.8K 30K 11.8 20 34 57.6 97.6 165 280 464 787 1.33K 2.26K 3.74K 6.34K 10.7K 18.2K 30.1K 12.1 20.5 34.8 59 100 169 287 475 806 1.37K 2.32K 3.83K 6.49K 11.K 18.7K 12.4 21 35.7 60.4 102 174 294 487 825 1.40K 2.37K 3.92K 6.65K 11.3K 19.1K 12.7 21.5 36.5 61.9 105 178 300 499 845 1.43K 2.43K 4.02K 6.81K 11.5K 19.6K 13 22.1 37.4 63.4 107 182 301 511 866 1.47K 2.49K 4.12K 6.98K 11.8K 20K 13.3 22.6 38.3 64.9 110 187 309 523 887 1.5K 2.55K 4.22K 7.15K 12.1K 20.5K 13.7 23.2 39.2 66.5 113 191 316 536 909 1.54K 2.61K 4.32K 7.32K 12.4K 21.K 14 23.7 40.2 68.1 115 196 324 549 931 1.58K 2.67K 4.42K 7.5K 12.7K 21.5K 14.3 24.3 41.2 69.8 118 200 332 562 953 1.62K 2.74K 4.53K 7.68K 13K 22.1K 14.7 24.9 42.2 71.5 121 205 340 576 976 1.65K 2.8K 4.64K 7.87K 13.3K 22.6K 15 25.5 43.2 73.2 124 210 348 590 1.0K 1.69K 2.87K 4.75K 8.06K 13.7K 23.2K 15.4 26.1 44.2 75 127 215 357 604 1.02K 1.74K 2.94K 4.87K 8.25K 14.K 23.7K 15.8 26.7 45.3 76.8 130 221 365 619 1.05K 1.78K 3.0K 4.99K 8.45K 14.3K 24.3K 16.2 27.4 46.4 78.7 133 226 374 634 1.07K 1.82K 3.01K 5.11K 8.66K 14.7K 24.9K 16.5 28 47.5 80.6 137 232 383 649 1.1K 1.87K 3.09K 5.23K 8.87K 15K 25.5K 1M NOTE: RoHS Compliant by Exemption CONSTRUCTION 1 No. Part Name 1 Protective coating: Epoxy 2 Al2O3 high purity alumina substrate: Al 96fi 3 Resistive element: metal film 4 Termination (Inner): Ag/Pd 5 Termination (Between): Ni plating film 4 6 Termination (Outer): Sn plating film 2 3 4 5 CHARACTERISTICS Characteristics Limits Test Methods ( JIS C 5201-1 ) 5.2 Natural resistance change per temp. degree centigrade. Temperature 1Ω ~ 10Ω ≤ ±400 PPM / °C R2-R1 coefficient 11Ω ~ 10MΩ ≤ ±200 PPM / °C x106 (PPM/°C) R1(t2-t1) R1: Resistance value at room temperature (t1) R2: Resistance value at room temp.plus 100°C (t2) Short time Resistance change rate is 5.5 Permanent resistance change after the overload ± (2.0 % + 0.1Ω) Max. application of a potential of 2.5 times RCWV for 5 seconds. Insulation 1,000M Ω or more 5.6 Apply 500V DC between protective coating resistance and termination for 1 minute Dielectric No evidence of flashover 5.7 Apply 500V AC between protective coating withstanding mechanical damage,arcing or and termination for 1 minute voltage insulation break down. Terminal bending ±(1.0% +0.05Ω) Max. 6.1.4 Twist of Test Board: Y/X=5/90mm for 10 seconds XICON PASSIVE COMPONENTS • (800) 628-0544 XC-600037 Date Revised: 05/15/17 Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
1% Thick Film Chip Resistors (RoHS Compliant) CR1-RC Series CHARACTERISTICS (Cont.) Characteristics Limits Test Methods ( JIS C 5201-1 ) 7.4 Resistance change after continuous 5 cycles for duty shown below: Temperature ± (1.0% + 0.05Ω) Max. S tep Temperature Time cycling 1 -55°C ±3°C 30 mins 2 Room temp. 10~15 mins 3 +155°C ±2°C 30 mins 4 Room temp. 10~15 mins 7.9 Resistance change after 1,000 hours Load life in Resistance change rate is (1.5 hours "on", 0.5 hour "off") at RCWV humidity ± (3.0% + 0.1Ω) Max. in a humidity chamber controlled at 40°C ± 2°C and 90 to 95 % relative humidity Load life Resistance change rate is 7.10 Permanent resistance change after 1,000 hours ± (3.0% + 0.1Ω) Max. operating at RCWV, with duty cycle of ( 1.5 hours "on", 0.5 hour "off" ) at 70°C ± 2°C ambient Soldering Heat Electrical characteristics shall be satisfied. Solder bath method Without distinct deformation in Pre-Heat: 100 ro 105°C, 30 ±5 sec. appearance. Temperature: 265 ± 3°C, 5 +1/-0 sec Reflow soldering method Peak: 250 +5/-0°C 230°C or higher, 30 ±10Sec. Solder iron method Bit temperature: 350° ±10°C Application time of soldering iron: 3 +1/-0 seconds Solderability 95% Coverage min. 6.5 Test temperature of solder: 245° ±3°C Dipping them solder: 2~3 seconds XICON PASSIVE COMPONENTS • (800) 628-0544 XC-600037 Date Revised: 05/15/17 Specifications are subject to change without notice. No liability or warranty implied by this information. Environmental compliance based on producer documentation.
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