2SC6011 Audio Amplification Transistor Features and Benefits Description ▪ Small package (TO-3P) By adapting the Sanken unique wafer-thinner technique, these ▪ High power handling capacity, 160 W NPN power transistors achieve power-up by decreasing thermal ▪ Improved sound output by reduced on-chip impedance resistance, and provide higher voltage avalanche breakdown ▪ For professional audio (PA) applications, V = 200 V rating. The high power-handling capacity of the TO-3P package CEO versions available allows a smaller footprint on the circuit board design. This ▪ Complementary to 2SA2151 series of transistors is very well suited to not only multichannel ▪ Recommended output driver: 2SC4832 applications for AV (audio-visual) amplifiers and receivers, but also parallel connection applications for PA (professional audio system) amplifiers. Applications include the following: Package: 3-Lead TO-3P ▪ Single transistors for audio amplifiers ▪ Home audio amplifiers ▪ Professional audio amplifiers ▪ Automobile audio amplifiers ▪ Audio market ▪ Single transistors for general purpose Not to scale Equivalent Circuit E 3 B 1 2 C 38102, Rev. 1 SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/

2SC6011 Audio Amplification Transistor SELECTION GUIDE Part Number Type h Rating Packing FE Range O: 50 to 100 2SC6011* NPN Range P: 70 tp 140 30 pieces per tube Range Y: 90 to 180 *Specify h range when ordering. If no h range is specified, order will be fulfilled with either or both range O and range Y, FE FE depending upon availability. ABSOLUTE MAXIMUM RATINGS at T = 25°C A Characteristic Symbol Rating Unit Collector-Base Voltage V 200 V CBO Collector-Emitter Voltage V 200 V CEO Emitter-Base Voltage V 6 V EBO Collector Current I 15 A C Base Current I 4 A B Collector Power Dissipation P 160 W C Junction Temperature T 150 °C J Storage Temperature T –55 to150 °C stg ELECTRICAL CHARACTERISTICS at T = 25°C A Characteristic Symbol Test Conditions Min. Typ. Max. Unit Collector-Cutoff Current I V = 200 V – – 10 μA CBO CB Emitter Cutoff Current I V = 6 V – – 10 μA EBO EB Collector-Emitter Voltage V I = 50 mA 200 – – V (BR)CEO C DC Current Transfer Ratio* h V = 4 V, I = 3 A 50 – 180 – FE CE C Collector-Emitter Saturation Voltage V I = 5 A, I = 0.5 A – – 0.5 V CE(sat) C B Cutoff Frequency f V = 12 V, I = –0.5 A – 20 – MHz T CE E Output Capacitance C V = 10 V, I = 0 A, f = 1 MHz – 270 – pF OB CB E *h rating: 50 to 100 (O brand on package), 70 to 140 (P), 90 to 180 (Y). FE 38102, Rev. 1 2 SANKEN ELECTRIC CO., LTD.

2SC6011 Audio Amplification Transistor Performance Characteristics 15 3 1 A 500 mA 300 mA 200 mA 10 100 mA V) 2 IC vs. VCE I (A)C 50 mA VCE(sat) vs. IB V (CE(sat) 5 1 IB= 20 mA IC= 10 A I = 5 A C 0 0 0 1 2 3 4 0 0.5 1.0 1.5 2.0 VCE (V) IB (A) 15 1000 10 Typ. IVCC E v =s 4. VV CBoEn tinuous I (A) C5 125°C 25°C –30°C hVCFEE = v4s V. CICo ntinuohuFEs 11000 0 1 0 0.5 1.0 1.5 2.0 0.01 0.1 1 10 100 VBE (V) IC (A) 10.00 1000 125°C 1.00 hFE 100 25°C W) hVCFEE = v4s V. CICo ntinuous –30°C RθJA vs. t R(°C/θJA 10 0.10 1 0.01 0.01 0.1 1 10 100 1 10 100 1000 IC (A) t (ms) 38102, Rev. 1 3 SANKEN ELECTRIC CO., LTD.

2SC6011 Audio Amplification Transistor Performance Characteristics, continued Safe Operating Area TA= 25°C, single pulse, no heatsink, natural cooling 100.0 10 10.0 100 mmss DC (A)C1.0 I 0.1 0.01 1 10 100 1000 VCE (V) 40 200 30 Typ. 150 VfTC E v =s 1.2 I VE Continuousf (MHz)T 20 PC vs. TA P (W)C100 With Infin ite Heatsink 10 50 0 3.5 Without Heatsink 0.01 0.1 1 10 100 0 0 25 50 75 100 125 150 IE (A) TA (°C) 38102, Rev. 1 4 SANKEN ELECTRIC CO., LTD.

2SC6011 Audio Amplification Transistor Package Outline Drawing, TO-3P 15.8 ±0.2 15.6 ±0.3 14.0 ±0.3 3 2 2 2 0. 0. 0. 0. 5.0 MAX Exposed 139..66 ±±00..22 1.8 ± 2.0 ± 5.0 ± 6.0 ± 2.1 MAX heatsink pad Branding 1 Area 0.3 ±0. XXXXXXXXXXXXXXXXXX 9.9 ± Ø3.2 1 +0.2 5 1.7–0.1 3. 2+–00..12 2+–00..12 0.6+–00..12 +0.2 3–0.1 N MI 1.0+–00..12 20.0 View A View B 5.45 ±0.1 Terminal dimension at lead tip 1 2 3 0.7 MAX 0.7 MAX View A View B Gate burr: 0.3 mm (max.), mold flash may appear at opposite side Branding codes (exact appearance at manufacturer discretion): Terminal core material: Cu 1st line, type: C6011 Terminal treatment: Ni plating and Pb-free solder dip 2nd line left, lot: YM Leadform: 100 Where: Y is the last digit of the year of manufacture Package: TO-3P (M100) M is the month (1 to 9, O, N, D) Approximate weight: 6 g 2nd line right, subtype: H Where: H is the h rating (O, P, or Y; for values see FE Dimensions in millimeters footnote, Electrical Characteristics table) Leadframe plating Pb-free. Device composition includes high-temperature solder (Pb >85%), which is exempted from the RoHS directive. 38102, Rev. 1 5 SANKEN ELECTRIC CO., LTD.

2SC6011 Audio Amplification Transistor Because reliability can be affected adversely by improper use a flat-head machine screw because of the stress to the storage environments and handling methods, please observe products. Self-tapping screws are not recommended. When the following cautions. using self-tapping screws, the screw may enter the hole Cautions for Storage diagonally, not vertically, depending on the conditions of hole • Ensure that storage conditions comply with the standard before threading or the work situation. That may stress the temperature (5°C to 35°C) and the standard relative products and may cause failures. humidity (around 40% to 75%); avoid storage locations • Recommended screw torque: 0.686 to 0.882 N●m (7 to 9 that experience extreme changes in temperature or kgf●cm). humidity. • Diameter of Heatsink Hole: < 4 mm. The defl ection of the press mold when making the hole may cause the case material to crack at the joint • Avoid locations where dust or harmful gases are present with the heatsink. Please pay special attention for this effect. and avoid direct sunlight. • For tightening screws, if a tightening tool (such as a driver) • Reinspect for rust on leads and solderability of the hits the products, the package may crack, and internal products that have been stored for a long time. stress fractures may occur, which shorten the lifetime of Cautions for Testing and Handling the electrical elements and can cause catastrophic failure. When tests are carried out during inspection testing and Tightening with an air driver makes a substantial impact. other standard test periods, protect the products from In addition, a screw torque higher than the set torque can power surges from the testing device, shorts between be applied and the package may be damaged. Therefore, an the product pins, and wrong connections. Ensure all test electric driver is recommended. parameters are within the ratings specified by Sanken for When the package is tightened at two or more places, first the products. pre-tighten with a lower torque at all places, then tighten Remarks About Using Silicone Grease with a Heatsink with the specified torque. When using a power driver, torque • When silicone grease is used in mounting the products on control is mandatory. a heatsink, it shall be applied evenly and thinly. If more Soldering silicone grease than required is applied, it may produce • When soldering the products, please be sure to minimize excess stress. the working time, within the following limits: • Volatile-type silicone greases may crack after long periods 260±5°C 10±1 s (Flow, 2 times) of time, resulting in reduced heat radiation effect. Silicone 350±5°C 3±0.5 s (Soldering iron, 1 time) greases with low consistency (hard grease) may cause • Soldering should be at a distance of at least 1.5 mm from cracks in the mold resin when screwing the products to a the body of the products. heatsink. Electrostatic Discharge Our recommended silicone greases for heat radiation • When handling the products, the operator must be purposes, which will not cause any adverse effect on the grounded. Grounded wrist straps worn should have at product life, are indicated below: least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the Type Suppliers operator. G746 Shin-Etsu Chemical Co., Ltd. • Workbenches where the products are handled should be YG6260 Momentive Performance Materials Inc. grounded and be provided with conductive table and floor SC102 Dow Corning Toray Co., Ltd. mats. • When using measuring equipment such as a curve tracer, Cautions for Mounting to a Heatsink the equipment should be grounded. • When the flatness around the screw hole is insufficient, such • When soldering the products, the head of soldering irons as when mounting the products to a heatsink that has an or the solder bath must be grounded in order to prevent extruded (burred) screw hole, the products can be damaged, leak voltages generated by them from being applied to the even with a lower than recommended screw torque. For products. mounting the products, the mounting surface flatness should • The products should always be stored and transported in be 0.05 mm or less. Sanken shipping containers or conductive containers, or • Please select suitable screws for the product shape. Do not be wrapped in aluminum foil. 38102, Rev. 1 6 SANKEN ELECTRIC CO., LTD.

2SC6011 Audio Amplification Transistor • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon- ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu- tion network. • The contents in this document must not be transcribed or copied without Sanken's written consent. 38102, Rev. 1 7 SANKEN ELECTRIC CO., LTD.