ICGOO在线商城 > 分立半导体产品 > 晶体管 - 双极 (BJT) - 单 > 2DB1694-7
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2DB1694-7产品简介:
ICGOO电子元器件商城为您提供2DB1694-7由Diodes Inc.设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 2DB1694-7价格参考¥0.19-¥0.69。Diodes Inc.2DB1694-7封装/规格:晶体管 - 双极 (BJT) - 单, 双极 (BJT) 晶体管 PNP 30V 1A 300MHz 300mW 表面贴装 SOT-323。您可以下载2DB1694-7参考资料、Datasheet数据手册功能说明书,资料中有2DB1694-7 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | TRANS BIPO PNP 30V 1A SOT-323两极晶体管 - BJT LOW VSAT PNP SMT 3K |
产品分类 | 晶体管(BJT) - 单路分离式半导体 |
品牌 | Diodes Incorporated |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 晶体管,两极晶体管 - BJT,Diodes Incorporated 2DB1694-7- |
数据手册 | |
产品型号 | 2DB1694-7 |
RoHS指令信息 | http://diodes.com/download/4349 |
不同 Ib、Ic时的 Vce饱和值(最大值) | 380mV @ 25mA,500mA |
不同 Ic、Vce 时的DC电流增益(hFE)(最小值) | 270 @ 100mA,2V |
产品目录页面 | |
产品种类 | 两极晶体管 - BJT |
供应商器件封装 | SOT-323 |
其它名称 | 2DB16947 |
其它图纸 | |
功率-最大值 | 300mW |
包装 | 带卷 (TR) |
发射极-基极电压VEBO | 6 V |
商标 | Diodes Incorporated |
增益带宽产品fT | 300 MHz |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | SC-70,SOT-323 |
封装/箱体 | SOT-323 |
工厂包装数量 | 3000 |
晶体管极性 | PNP |
晶体管类型 | PNP |
最大功率耗散 | 500 mW |
最大工作温度 | + 150 C |
最大直流电集电极电流 | 1 A |
最小工作温度 | - 55 C |
标准包装 | 3,000 |
电压-集射极击穿(最大值) | 30V |
电流-集电极(Ic)(最大值) | 1A |
电流-集电极截止(最大值) | - |
直流电流增益hFE最大值 | 270 at 100 mA at 2 V |
直流集电极/BaseGainhfeMin | 270 at 100 mA at 2 V |
系列 | 2DB1694 |
配置 | Single |
集电极—发射极最大电压VCEO | 30 V |
集电极—基极电压VCBO | 30 V |
频率-跃迁 | 300MHz |
2DB1694 LOW V PNP SURFACE MOUNT TRANSISTOR CE(SAT) Features Mechanical Data • Epitaxial Planar Die Construction • Case: SOT-323 • Low Collector-Emitter Saturation Voltage • Case Material: Molded Plastic, “Green” Molding Compound. • Ideal for Low Power Amplification and Switching UL Flammability Classification Rating 94V-0 • Complementary NPN Type Available (2DD2656) • Moisture Sensitivity: Level 1 per J-STD-020D T • Ultra-Small Surface Mount Package • Terminals: Finish − Matte Tin annealed over Alloy 42 leadframe. C • Lead Free By Design/RoHS Compliant (Note 1) Solderable per MIL-STD-202, Method 208 U • "Green Device" (Note 2) • Terminal Connections: See Diagram D • Marking Information: See Page 3 O • Ordering Information: See Page 3 R • Weight: 0.006 grams (approximate) P W C E N B E Top View Device Schematic Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Symbol Value Unit Collector-Base Voltage VCBO -30 V Collector-Emitter Voltage VCEO -30 V Emitter-Base Voltage VEBO -6 V Collector Current - Continuous IC -1 A Peak Pulse Collector Current ICM -2 A Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 3) @ TA = 25°C PD 300 mW Thermal Resistance, Junction to Ambient (Note 3) @ TA = 25°C RθJA 417 °C/W Power Dissipation (Note 4) @ TA = 25°C PD 500 mW Thermal Resistance, Junction to Ambient (Note 4) @ TA = 25°C RθJA 250 °C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Conditions OFF CHARACTERISTICS Collector-Base Breakdown Voltage V(BR)CBO -30 ⎯ ⎯ V IC = -10μA, IE = 0 Collector-Emitter Breakdown Voltage (Note 5) V(BR)CEO -30 ⎯ ⎯ V IC = -1mA, IB = 0 Emitter-Base Breakdown Voltage V(BR)EBO -6 ⎯ ⎯ V IE = -10μA, IC = 0 Collector Cut-Off Current ICBO ⎯ ⎯ -0.1 μA VCB = -30V, IE = 0 Emitter Cut-Off Current IEBO ⎯ ⎯ -0.1 μA VEB = -6V, IC = 0 ON CHARACTERISTICS (Note 5) Collector-Emitter Saturation Voltage VCE(SAT) ⎯ -180 -380 mV IC = -500mA, IB = -25mA DC Current Gain hFE 270 ⎯ 680 ⎯ VCE = -2V, IC = -100mA SMALL SIGNAL CHARACTERISTICS Output Capacitance Cobo ⎯ 16 ⎯ pF fV =C B1 M= H-1z0 V, IE = 0, Current Gain-Bandwidth Product fT ⎯ 300 ⎯ MHz fV =C E1 0=0 -M2VH,z I C = -100mA, Notes: 1. No purposefully added lead. 2. Diode’s Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 3. Device mounted on FR-4 PCB with minimum recommended pad layout. 4. Device mounted on FR-4 PCB with 1 inch2 copper pad layout. 5. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%. 2DB1694 1 of 4 December 2008 Document number: DS31640 Rev. 2 - 2 www.diodes.com © Diodes Incorporated
2DB1694 0.6 1.0 0.9 IB = -5mA 0.5 W) A) 0.8 N ( NT ( 0.7 IB = -4mA O 0.4 E ATI RR 0.6 IB = -3mA P U CT DISSI 0.3 (Note 4) OR C 0.5 IB = -2mA DU WER 0.2 (Note 3) LECT 0.4 RO P, POD , COLC00..23 IB = -1mA P 0.1 -I 0.1 W E 0 0 N 0 25 50 75 100 125 150 175 200 0 1 2 3 4 5 T , AMBIENT TEMPERATURE (°C) -V , COLLECTOR-EMITTER VOLTAGE (V) A CE Fig. 1 Power Dissipation vs. Ambient Temperature Fig. 2 Typical Collector Current vs. Collector-Emitter Voltage 1,000 1 TA = 150°C VCE = -2V IC/IB = 20 TA = 85°C TA = 25°C ER AIN MITTE (V) NT G TA = -55°C OR-ELTAG E TO RR100 ECVN 0.1 TA = 150°C C CU COLLATIO TA = 85°C h, DFE , CE(SAT)SATUR TA = -T5A5 °=C 25°C V - 10 0.01 0.1 1 10 100 1,000 10,000 0.1 1 10 100 1,000 -IC, COLLECTOR CURRENT (mA) -IC, COLLECTOR CURRENT (mA) Fig. 3 Typical DC Current Gain vs. Collector Current Fig. 4 Typical Collector-Emitter Saturation Voltage vs. Collector Current V) 1.2 V) 1.2 GE ( VCE = -2V GE ( IC/IB = 20 TA 1.0 TA 1.0 L L O O V V ON 0.8 ON 0.8 URN- TA = -55°C URATI TA = -55°C R T 0.6 AT 0.6 E S MITT 0.4 TA = 25°C TER 0.4 TA = 25°C E-E TA = 85°C MIT TA = 85°C S E A E- , BN) 0.2 TA = 150°C BAS 0.2 TA = 150°C VBE(O 0 , SAT) 0 - 0.1 1 10 100 1,000 E( 0.1 1 10 100 1,000 B -IC, COLLECTOR CURRENT (mA) -V -IC, COLLECTOR CURRENT (mA) Fig. 5 Typical Base-Emitter Turn-On Voltage Fig. 6 Typical Base-Emitter Saturation Voltage vs. Collector Current vs. Collector Current 2DB1694 2 of 4 December 2008 Document number: DS31640 Rev. 2 - 2 www.diodes.com © Diodes Incorporated
2DB1694 1,000 f = 1MHz F) 100 p CE ( Cibo T N A C T CI U A D AP 10 Cobo C O R P W E 1 N 0.1 1 10 100 V , REVERSE VOLTAGE (V) R Fig. 7 Typical Capacitance Characteristics Ordering Information (Note 6) Part Number Case Packaging 2DB1694-7 SOT-323 3000/Tape & Reel Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information RP1 = Product Type Marking Code RP1 M YM = Date Code Marking Y Y = Year (ex: V = 2008) M = Month (ex: 9 = September) Date Code Key Year 2008 2009 2010 2011 2012 2013 2014 2015 Code V W X Y Z A B C Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N D Package Outline Dimensions A SOT-323 Dim Min Max Typ A 0.25 0.40 0.30 B C B 1.15 1.35 1.30 C 2.00 2.20 2.10 D - - 0.65 G G 1.20 1.40 1.30 H H 1.80 2.20 2.15 J 0.0 0.10 0.05 K M K 0.90 1.00 1.00 L 0.25 0.40 0.30 J M 0.10 0.18 0.11 D L α 0° 8° - All Dimensions in mm 2DB1694 3 of 4 December 2008 Document number: DS31640 Rev. 2 - 2 www.diodes.com © Diodes Incorporated
2DB1694 Suggested Pad Layout Y Dimensions Value (in mm) Z C Z 2.8 T X 0.7 C Y 0.9 U C 1.9 D E 1.0 O R X E P W IMPORTANT NOTICE E Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes N without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. 2DB1694 4 of 4 December 2008 Document number: DS31640 Rev. 2 - 2 www.diodes.com © Diodes Incorporated
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