Chip Beads (2512067007Y3) Part Number: 2512067007Y3 MULTI- LAYER CHIP BEAD           Fair- Rite offers a broad selection of cost effective multi- layer chip beads to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip Beads are available in standard, high and GHz signal speeds. Recommended Soldering Profile Packaging Options: - All multi- layer chip beads are supplied taped and reeled, if required bulk packed chip beads can be provided. The suggested land patterns are in accordance to the latest revision of IPC-7351. Weight: 0.03 (g) Package Size: 1206 (3216) Dim mm mm tol nominal inch inch misc. Reel Information A 1.1 ±0.20 0.043 _ Tape Width Pitch Parts 7" Parts 13" Parts 14" B 1.6 ±0.20 0.063 _ mm mm Reel Reel Reel C 3.2 ±0.20 0.126 _ 8 4 3000 10000 _ D 0.7 ±0.30 0.028 _ Land Patterns V W X Y Z 1.20 2.80 1.80 1.60 _ (0.047”) (0.110”) (0.071”) (0.063”)

Chart Legend + Test frequency Typical Impedance (Ω) 50 MHz 53 100 MHz+ 70 ±25% 500 MHz 102 1000 MHz+ - Electrical Properties Max DCR 0.04 (Ω) Max Current 3000 (mA) The impedance values listed are typical values. The nominal impedance with a +/- 25% tolerance is specified for the + marked 100 MHz. Chip beads are measured for impedance on the HP 4291A and fixture HP 16192A. Chip beads are 100% tested for impedance and dc resistance.

Fair- Rite Products Corp.   •   One Commercial Row, Wallkill, New York 12589-0288 888-324-7748   •   845-895-2055   •   Fax: 845-895-2629   •   ferrites@fair- rite.com   •   www.fair- rite.com