24AA08/24LC08B/24FC08 2 8K I C Serial EEPROM Device Selection Table Part Number VCC Range Max. Clock Frequency Temp. Ranges Available Packages 24AA08 1.7V-5.5V 400 kHz(1) I MC, MS, P, SN, MNY, ST, OT, SCP 24LC08B 2.5V-5.5V 400 kHz I, E MC, MS, P, SN, MNY, ST, OT 24FC08 1.7V-5.5V 1 MHz I, E MS, P, SN, ST, MUY, OT Note1: 100 kHz for VCC < 2.5V. Features Packages • Single Supply with Operation down to 1.7V for • 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP, 24AA08 and 24FC08 Devices, 2.5V for 24LC08B 8-Lead SOIC, 8-Lead TDFN, 8-Lead TSSOP, Devices 8-Lead UDFN, 5-Lead SOT-23 and 4-Ball CSP • Low-Power CMOS Technology: Description - Read current 1 mA, maximum - Standby current 1 μA, maximum (I-temp.) The Microchip Technology Inc. 24XX08(1) is an 8-Kbit • 2-Wire Serial Interface, I2C Compatible Electrically Erasable PROM. The device is organized • Schmitt Trigger Inputs for Noise Suppression as four blocks of 256 x 8-bit memory with a two-wire • Output Slope Control to Eliminate Ground Bounce serial interface. Its low-voltage design permits operation down to 1.7V with standby and active • 100 kHz, 400 kHz and 1 MHz Compatibility currents of only 1 μA and 1 mA, respectively. The • Page Write Time: 5 ms, Maximum 24XX08 also has a page write capability for up to • Self-Timed Erase/Write Cycle 16 bytes of data. • 16-Byte Page Write Buffer • Hardware Write-Protect Note1: 24XX08 is used in this document as a • ESD Protection >4,000V generic part number for the 24AA08/24LC08B/24FC08 devices. • More than 1 Million Erase/Write Cycles • Data Retention >200 Years • Factory Programming Available • RoHS Compliant • Temperature Ranges: - Industrial (I): -40°C to +85°C - Extended (E): -40°C to +125°C • Automotive AEC-Q100 Qualified Package Types 8-Lead DFN/TDFN/UDFN 8-Lead PDIP/MSOP 8-Lead SOIC/TSSOP 5-Lead SOT-23 4-Ball CSP (Top View) (Top View) (Top View) (Top View) (Top View) A0(1) 1 8 VCC A0(1) 11 88 VCC A0(1) 1 8 VCC SCL 1 5 WP A1(1) 2 7 WP A1(1) 22 77 WP A1(1) 2 7 WP VCC 1 2 VSS A2(1) 3 6 SCL A2(1) 33 66 SCL A2(1) 3 6 SCL VSS 2 VSS 4 5 SDA VSS 44 55 SDA VSS 4 5 SDA SDA 3 4 VCC SCL 3 4 SDA Note 1: Pins A0, A1 and A2 are not used by the 24XX08 (no internal connections).  2002-2019 Microchip Technology Inc. DS20001710L-page 1

24AA08/24LC08B/24FC08 Block Diagram WP HV Generator I/O Memory EEPROM Control Control XDEC Array Logic Logic Page Latches I/O SCL YDEC SDA VCC VSS Sense Amp. R/W Control  2002-2019 Microchip Technology Inc. DS20001710L-page 2

24AA08/24LC08B/24FC08 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS.........................................................................................................-0.3V to VCC +1.0V Storage temperature...............................................................................................................................-65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C ESD protection on all pins4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V DC CHARACTERISTICS Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC08B) Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC08) Param. Symbol Characteristic Min. Typical Max. Units Conditions No. D1 VIH High-Level Input Voltage 0.7 VCC — — V D2 VIL Low-Level Input Voltage — — 0.3 VCC V D3 VHYS Hysteresis of Schmitt 0.05 VCC — — V Note Trigger Inputs (SDA, SCL pins) D4 VOL Low-Level Output — — 0.40 V IOL = 3.0 mA, VCC = 2.5V Voltage D5 ILI Input Leakage Current — — ±1 μA VIN = VSS or VCC D6 ILO Output Leakage Current — — ±1 μA VOUT = VSS or VCC D7 CIN, Pin Capacitance — — 10 pF VCC = 5.0V (Note) COUT (all inputs/outputs) TA = 25°C, FCLK = 1 MHz D8 ICCWRITE Operating Current — — 3 mA VCC = 5.5V, SCL = 400 kHz D9 ICCREAD — — 1 mA VCC = 5.5V, SCL = 400 kHz D10 ICCS Standby Current — — 1 μA SDA = SCL = VCC WP = VSS, I-Temp. — — 3 μA SDA = SCL = VCC WP = VSS, E-Temp. (24FC08) — — 5 μA SDA = SCL = VCC WP = VSS, E-Temp. (24LC08B) Note: This parameter is periodically sampled and not 100% tested.  2002-2019 Microchip Technology Inc. DS20001710L-page 3

24AA08/24LC08B/24FC08 TABLE 1-1 AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V AC CHARACTERISTICS Extended (E):TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC08B) Extended (E):TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC08) Param. Symbol Characteristic Min. Max. Units Conditions No. 1 FCLK Clock Frequency — 400 kHz 2.5V ≤ VCC ≤ 5.5V — 100 kHz 1.7V ≤ VCC < 2.5V (24AA08) — 1000 kHz 1.7V ≤ VCC ≤ 5.5V (24FC08) 2 THIGH Clock High Time 600 — ns 2.5V ≤ VCC ≤ 5.5V 4000 — ns 1.7V ≤ VCC < 2.5V (24AA08) 260 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 3 TLOW Clock Low Time 1300 — ns 2.5V ≤ VCC ≤ 5.5V 4700 — ns 1.7V ≤ VCC < 2.5V (24AA08) 500 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 4 TR SDA and SCL Rise Time — 300 ns 2.5V ≤ VCC ≤ 5.5V (Note 1) — 1000 ns 1.7V ≤ VCC < 2.5V (24AA08) (Note 1) — 1000 ns 1.7V ≤ VCC ≤ 5.5V (24FC08) (Note 1) 5 TF SDA and SCL Fall Time — 300 ns Note 1 6 THD:STA Start Condition Hold Time 600 — ns 2.5V ≤ VCC ≤ 5.5V 4000 — ns 1.7V ≤ VCC < 2.5V (24AA08) 250 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 7 TSU:STA Start Condition Setup 600 — ns 2.5V ≤ VCC ≤ 5.5V Time 4700 — ns 1.7V ≤ VCC < 2.5V (24AA08) 250 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 8 THD:DAT Data Input Hold Time 0 — ns Note 2 9 TSU:DAT Data Input Setup Time 100 — ns 2.5V ≤ VCC ≤ 5.5V 250 — ns 1.7V ≤ VCC < 2.5V (24AA08) 50 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 10 TSU:STO Stop Condition Setup 600 — ns 2.5V ≤ VCC ≤ 5.5V Time 4000 — ns 1.7V ≤ VCC < 2.5V (24AA08) 250 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 11 TSU:WP WP Setup Time 600 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 12 THD:WP WP Hold Time 600 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) 13 TAA Output Valid from Clock — 900 ns 2.5V ≤ VCC ≤ 5.5V (Note 2) — 3500 ns 1.7V ≤ VCC < 2.5V (24AA08) (Note 2) — 450 ns 1.7V ≤ VCC ≤ 5.5V (24FC08) (Note 2) 14 TBUF Bus Free Time: The time 1300 — ns 2.5V ≤ VCC ≤ 5.5V the bus must be free 4700 — ns 1.7V ≤ VCC < 2.5V (24AA08) before a new transmis- 500 — ns 1.7V ≤ VCC ≤ 5.5V (24FC08) sion can start Note 1: Characterized but not 100% tested. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: CB = total capacitance of one bus line in pF. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s website at www.microchip.com.  2002-2019 Microchip Technology Inc. DS20001710L-page 4

24AA08/24LC08B/24FC08 TABLE 1-1 AC CHARACTERISTICS (CONTINUED) Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V AC CHARACTERISTICS (Continued) Extended (E):TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC08B) Extended (E):TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC08) Param. Symbol Characteristic Min. Max. Units Conditions No. 15 TOF Output Fall Time from VIH — 250 ns 2.5V ≤ VCC ≤ 5.5V Minimum to VIL Maximum (Notes 1, 3 and 4) — 250 ns 1.7V ≤ VCC < 2.5V (24AA08) (Notes 1, 3 and 4) 16 TSP Input Filter Spike — 50 ns Note 1 Suppression — 100 ns 1.7V ≤ VCC ≤ 5.5V (24FC08) (Note 1) (SDA and SCL pins) 17 TWC Write Cycle Time — 5 ms (byte or page) 18 Endurance 1,000,000 — cycles 25°C, 5.5V, Page Mode (Note 4) Note 1: Characterized but not 100% tested. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: CB = total capacitance of one bus line in pF. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s website at www.microchip.com. FIGURE 1-1: BUS TIMING DATA 5 4 2 D3 SCL 7 3 8 9 10 SDA 6 IN 16 13 14 SDA OUT (protected) WP 11 12 (unprotected)  2002-2019 Microchip Technology Inc. DS20001710L-page 5

24AA08/24LC08B/24FC08 FIGURE 1-2: BUS TIMING START/STOP D3 SCL 7 6 10 SDA Start Stop  2002-2019 Microchip Technology Inc. DS20001710L-page 6

24AA08/24LC08B/24FC08 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Name DFN(1) MSOP PDIP SOIC TDFN(1) TSSOP UDFN(1) SOT-23 CSP Description A0 1 1 1 1 1 1 1 — — Not Connected A1 2 2 2 2 2 2 2 — — Not Connected A2 3 3 3 3 3 3 3 — — Not Connected VSS 4 4 4 4 4 4 4 2 2 Ground SDA 5 5 5 5 5 5 5 3 4 Serial Address/Data I/O SCL 6 6 6 6 6 6 6 1 3 Serial Clock WP 7 7 7 7 7 7 7 5 — Write-Protect Input VCC 8 8 8 8 8 8 8 4 1 Power Supply Note 1: The exposed pad on the DFN/TDFN/UDFN package can be connected to VSS or left floating. 2.1 A0, A1, A2 2.3 Serial Clock (SCL) The A0, A1 and A2 pins are not used by the 24XX08. The SCL input is used to synchronize the data transfer They may be left floating or tied to either VSS or VCC. to and from the device. 2.2 Serial Address/Data Input/Output 2.4 Write-Protect (WP) (SDA) This pin must be connected to either VSS or VCC. The SDA input is a bidirectional pin used to transfer If tied to VSS, normal memory operation is enabled addresses and data into and out of the device. Since (read/write the entire memory 000-3FF). it is an open-drain terminal, the SDA bus requires a If tied to VCC, write operations are inhibited. The entire pull-up resistor to VCC (typical 10 kΩ for 100 kHz, memory will be write-protected. Read operations are 2 kΩ for 400 kHz and 1 MHz). not affected. For normal data transfer, SDA is allowed to change The Chip Scale package does not support the only during SCL low. Changes during SCL high are write-protect feature. reserved for indicating Start and Stop conditions.  2002-2019 Microchip Technology Inc. DS20001710L-page 7

24AA08/24LC08B/24FC08 3.0 FUNCTIONAL DESCRIPTION 4.4 Data Valid (D) The 24XX08 supports a bidirectional, two-wire bus and The state of the data line represents valid data when, data transmission protocol. A device that sends data after a Start condition, the data line is stable for the onto the bus is defined as transmitter, while defining a duration of the high period of the clock signal. device receiving data as a receiver. The bus has to be The data on the line must be changed during the low controlled by a master device which generates the period of the clock signal. There is one clock pulse per Serial Clock (SCL), controls the bus access and bit of data. generates the Start and Stop conditions, while the Each data transfer is initiated with a Start condition and 24XX08 works as slave. Both master and slave can terminated with a Stop condition. The number of data operate as transmitter or receiver, but the master bytes transferred between the Start and Stop device determines which mode is activated. conditions is determined by the master device and is, theoretically, unlimited (although only the last sixteen 4.0 BUS CHARACTERISTICS will be stored when doing a write operation). When an overwrite does occur, it will replace data based on the The following bus protocol has been defined: first-in first-out (FIFO) principle. • Data transfer may be initiated only when the bus is not busy. 4.5 Acknowledge • During data transfer, the data line must remain stable whenever the clock line is high. Changes in Each receiving device, when addressed, is obliged to the data line while the clock line is high will be generate an Acknowledge after the reception of each interpreted as a Start or Stop condition. byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Accordingly, the following bus conditions have been defined (Figure 4-1). Note: The 24XX08 does not generate any 4.1 Bus Not Busy (A) Acknowledge bits if an internal programming cycle is in progress. Both data and clock lines remain high. The device that acknowledges has to pull down the 4.2 Start Data Transfer (B) SDA line during the Acknowledge clock pulse in such a A high-to-low transition of the SDA line while the clock way that the SDA line is stable-low during the high (SCL) is high determines a Start condition. All period of the Acknowledge-related clock pulse. commands must be preceded by a Start condition. Moreover, setup and hold times must be taken into account. During reads, a master must signal an end of 4.3 Stop Data Transfer (C) data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. A low-to-high transition of the SDA line while the clock In this case, the slave (24XX08) will leave the data line (SCL) is high determines a Stop condition. All high to enable the master to generate the Stop operations must be ended with a Stop condition. condition. FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS (A) (B) (D) (D) (C) (A) SCL SDA Start Address or Data Stop Condition Acknowledge Allowed Condition Valid to Change  2002-2019 Microchip Technology Inc. DS20001710L-page 8

24AA08/24LC08B/24FC08 5.0 DEVICE ADDRESSING FIGURE 5-1: CONTROL BYTE ALLOCATION A control byte is the first byte received following the Start condition from the master device. The control byte Read/Write Bit consists of a four-bit control code. For the 24XX08, this is set as ‘1010’ binary for read and write operations. Block The next bit of the control byte is a “don’t care” for the Select Control Code Bits 24XX08. The last two bits, B1 and B0, are used by the master device to select which of the four 256-word blocks of memory are to be accessed. These bits, in S 1 0 1 0 x B1 B0 R/W ACK effect, are the Most Significant bits of the word address. The combination of the 4-bit control code and the next Slave Address three bits are called the slave address. The last bit of the control byte is the Read/Write (R/W) bit and it defines the operation to be performed. When Start Bit Acknowledge Bit set to ‘1’, a read operation is selected. When set to ‘0’, a write operation is selected. Following the Start x = “don’t care” condition, the 24XX08 monitors the SDA bus, checking the device type identifier being transmitted. Upon receiving a valid slave address and the R/W bit, the slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX08 will select a read or write operation. The next byte received defines the address of the first data byte within the selected block (Figure 5-2). The word address byte uses all eight bits. Control Operation Block Select R/W Code Read 1010 Block Address 1 Write 1010 Block Address 0 FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS Control Byte Word Address Byte 1 0 1 0 x B1 B0 R/W A7 • • • • • • A0 Control Block Code Select Bits x = “don’t care”  2002-2019 Microchip Technology Inc. DS20001710L-page 9

24AA08/24LC08B/24FC08 6.0 WRITE OPERATION 6.2 Page Write The write control byte, word address and first data byte 6.1 Byte Write are transmitted to the 24XX08 in the same way as in a byte write. However, instead of generating a Stop Following the Start condition from the master, the condition, the master transmits up to 16 data bytes to device code (4 bits), the block address (1 bit is a “don't the 24XX08, which are temporarily stored in the care”, plus B1 and B0 bits) and the R/W bit, which is a on-chip page buffer and will be written into the memory logic-low, is placed onto the bus by the master once the master has transmitted a Stop condition. transmitter. This indicates to the addressed slave Upon receipt of each word, the four lower-order receiver that a byte with a word address will follow after Address Pointer bits, which form the byte counter, are it has generated an Acknowledge bit during the ninth internally incremented by one. The higher-order clock cycle. Therefore, the next byte transmitted by the four bits of the word address and bits B1 and B0 remain master is the word address and will be written into the constant. If the master should transmit more than 16 Address Pointer of the 24XX08. After receiving another words prior to generating the Stop condition, the Acknowledge signal from the 24XX08, the master Address Pointer will roll over and the previously device will transmit the data word to be written into the received data will be overwritten. As with the byte write addressed memory location. The 24XX08 operation, once the Stop condition is received, an acknowledges again and the master generates a Stop internal write cycle will begin (Figure 6-2). condition. This initiates the internal write cycle, and, during this time, the 24XX08 will not generate Acknowledge signals (Figure 6-1). Note: Page write operations are limited to writ- ing bytes within a single physical page regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of page size – 1. If a page write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. 6.3 Write Protection The WP pin allows the user to write-protect the entire array (000-3FF) when the pin is tied to VCC. If tied to VSS, the write protection is disabled. The Chip Scale package does not support the write-protect feature. FIGURE 6-1: BYTE WRITE S S Bus Activity T Control Word T Master A Byte Address Data O R P T SDA Line S 1 0 1 0 x B1 B0 0 P A A A Bus Activity Block C C C Select K K K x = “don’t care” Bits  2002-2019 Microchip Technology Inc. DS20001710L-page 10

24AA08/24LC08B/24FC08 FIGURE 6-2: PAGE WRITE S S Bus Activity T Control Word T Master AR Byte Address (n) Data (n) Data (n + 1) Data (n + 15) OP T SDA Line S 10 10 xB1B00 P A A A A A Bus Activity Block C C C C C Select K K K K K x = “don’t care” Bits  2002-2019 Microchip Technology Inc. DS20001710L-page 11

24AA08/24LC08B/24FC08 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a write command (R/W = 0). If the device is still busy with the write cycle, no ACK will be returned. If the cycle is complete, the device will return the ACK and the master can then proceed with the next read or write operation. See Figure 7-1 for a flow diagram of this operation. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device No Acknowledge (ACK = 0)? Yes Next Operation  2002-2019 Microchip Technology Inc. DS20001710L-page 12

24AA08/24LC08B/24FC08 8.0 READ OPERATION 8.3 Sequential Read Read operations are initiated in the same way as write Sequential reads are initiated in the same way as a operations, with the exception that the R/W bit of the random read or current read, except that once the slave address is set to ‘1’. There are three basic types 24XX08 transmits the first data byte, the master issues of read operations: current address read, random read an Acknowledge (as opposed to a Stop condition in a and sequential read. random read). This directs the 24XX08 to transmit the next sequentially addressed 8-bit word (Figure 8-3). 8.1 Current Address Read To provide sequential reads the 24XX08 contains an internal Address Pointer which is incremented by one The 24XX08 contains an Address Pointer that at the completion of each operation. This Address maintains the address of the last word accessed, Pointer allows the entire memory contents to be serially internally incremented by one. Therefore, if the previ- read during one operation. ous access (either a read or write operation) was to address n, the next current address read operation 8.4 Noise Protection would access data from address n + 1. Upon receipt of the slave address with R/W bit set to ‘1’, the 24XX08 The SCL and SDA inputs have Schmitt Trigger and issues an Acknowledge and transmits the 8-bit data filter circuits which suppress noise spikes to assure word. The master will not acknowledge the transfer, but proper device operation even on a noisy bus. does generate a Stop condition and the 24XX08 discontinues transmission (Figure 8-1). 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX08 as part of a write operation. Once the word address is sent, the master generates a Start condition following the Acknowledge. This terminates the write operation, but not before the inter- nal Address Pointer is set. The master then issues the control byte again, but with the R/W bit set to a ‘1’. The 24XX08 will then issue an Acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX08 discontinues transmission (Figure 8-2). FIGURE 8-1: CURRENT ADDRESS READ S Bus Activity T Control S Master A Byte Data (n) T R O T P SDA Line S 1 0 1 0 x B1B0 1 P A N Bus Activity C o Block K Select A x = “don’t care” Bits C K  2002-2019 Microchip Technology Inc. DS20001710L-page 13

24AA08/24LC08B/24FC08 FIGURE 8-2: RANDOM READ S S Bus Activity T Control Word T Control S A A T Master R Byte Address (n) R Byte Data (n) O T T P S1010xB1B00 S1010xB1B01 P SDA Line A A A N Block C C Block C o Select K K Select K Bus Activity Bits A Bits C x = “don’t care” K FIGURE 8-3: SEQUENTIAL READ S Bus Activity Control T Master Byte Data (n) Data (n + 1) Data (n + 2) Data (n + x) O P SDA Line 1 P A A A A N Bus Activity C C C C o K K K K A C K  2002-2019 Microchip Technology Inc. DS20001710L-page 14

24AA08/24LC08B/24FC08 9.0 PACKAGING INFORMATION 9.1 Package Marking Information* 8-Lead 2x3 DFN Example XXX 244 YWW 918 NN 13 8-Lead MSOP Example XXXXXX 4L8BI YWWNNN 91813F 8-Lead PDIP (300 mil) Example XXXXXXXX 24LC08B XXXXXNNN I/P e 3 13F YYWW 1918 8-Lead SOIC (3.90 mm) Example XXXXXXXX 24LC08BI SN e 3 1918 XXXXYYWW NNN 13F 8-Lead 2x3 TDFN Example XXX A34 YWW 918 NN 13  2002-2019 Microchip Technology Inc. DS20001710L-page 15

24AA08/24LC08B/24FC08 8-Lead TSSOP Example XXXX 4L04 XYWW I918 NNN 13F 8-Lead 2x3 UDFN Example XXX ADS YWW 918 NN 13 5-Lead SOT-23 (1-Line Marking) Example XXNN M413 5-Lead SOT-23 (2-Line Marking) Example XXXXYY AAFB19 WWNNN 1813F 4-Ball CSP Example XN 43  2002-2019 Microchip Technology Inc. DS20001710L-page 16

24AA08/24LC08B/24FC08 er 1st Line Marking Codes b m u DFN TDFN SOT-23 N art I-Temp. E-Temp. MSOP SOIC I-Temp. E-Temp. TSSOP UDFN I-Temp. E-Temp. CSP P 24AA08 241 — 4A08T(1) 24AA08T(1) A41 — 4A08 — B4NN(2,3) — 4N 24LC08B 244 245 4L8BT(1) 24LC08BT(1) A44 A45 4L08 — M4NN(2,3) N4NN(2,3) — 24FC08 — — 24FC08 24FC08 — — AADY ADS AAFBYY(4) AAFBYY(4) — Note1: T = Temperature grade (I, E) 2: NN = Alphanumeric traceability code 3: These parts use the 1-line SOT-23 marking format 4: These parts use the 2-line SOT-23 marking format Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) e3 JEDEC® designator for Matte Tin (Sn) * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. Note: For very small packages with no room for the JEDEC® designator e 3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2002-2019 Microchip Technology Inc. DS20001710L-page 17

24AA08/24LC08B/24FC08 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:8)(cid:17)(cid:10)(cid:6)(cid:12)(cid:18)(cid:8)(cid:19)(cid:20)(cid:8)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:6)(cid:14)(cid:21)(cid:6)(cid:22)(cid:5)(cid:8)(cid:23)(cid:24)(cid:25)(cid:26)(cid:8)(cid:27)(cid:8)(cid:28)(cid:29)(cid:30)(cid:29)(cid:31) !(cid:8)""(cid:8)#(cid:20)(cid:7)$(cid:8)%(cid:15)(cid:17)(cid:19)& (cid:19)(cid:20)(cid:12)(cid:5)’ 2(cid:21)(cid:20)(cid:14)%(cid:22)(cid:13)(cid:14)&(cid:21) %(cid:14)(cid:19)!(cid:20)(cid:20)(cid:13)(cid:24)%(cid:14)(cid:10)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:13)(cid:14)"(cid:20)(cid:11))(cid:18)(cid:24)(cid:12) ’(cid:14)(cid:10)(cid:25)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)%(cid:22)(cid:13)(cid:14)(cid:17)(cid:18)(cid:19)(cid:20)(cid:21)(cid:19)(cid:22)(cid:18)(cid:10)(cid:14)(cid:30)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:18)(cid:24)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:19)(cid:18)$(cid:18)(cid:19)(cid:11)%(cid:18)(cid:21)(cid:24)(cid:14)(cid:25)(cid:21)(cid:19)(cid:11)%(cid:13)"(cid:14)(cid:11)%(cid:14) (cid:22)%%(cid:10)133)))(cid:28)&(cid:18)(cid:19)(cid:20)(cid:21)(cid:19)(cid:22)(cid:18)(cid:10)(cid:28)(cid:19)(cid:21)&3(cid:10)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:18)(cid:24)(cid:12) D e b N N L K E E2 EXPOSEDPAD NOTE1 NOTE1 1 2 2 1 D2 TOPVIEW BOTTOMVIEW A NOTE2 A3 A1 4(cid:24)(cid:18)% (cid:17)(cid:27)55(cid:27)(cid:17),(cid:23),(cid:8)(cid:3) (cid:2)(cid:18)&(cid:13)(cid:24) (cid:18)(cid:21)(cid:24)(cid:14)5(cid:18)&(cid:18)% (cid:17)(cid:27)6 67(cid:17) (cid:17)(cid:7)8 6!&((cid:13)(cid:20)(cid:14)(cid:21)$(cid:14)(cid:30)(cid:18)(cid:24) 6 9 (cid:30)(cid:18)%(cid:19)(cid:22) (cid:13) (cid:4)(cid:28).(cid:4)(cid:14)/(cid:3)0 7(cid:31)(cid:13)(cid:20)(cid:11)(cid:25)(cid:25)(cid:14):(cid:13)(cid:18)(cid:12)(cid:22)% (cid:7) (cid:4)(cid:28)9(cid:4) (cid:4)(cid:28)(cid:6)(cid:4) (cid:29)(cid:28)(cid:4)(cid:4) (cid:3)%(cid:11)(cid:24)"(cid:21)$$(cid:14) (cid:7)(cid:29) (cid:4)(cid:28)(cid:4)(cid:4) (cid:4)(cid:28)(cid:4)(cid:15) (cid:4)(cid:28)(cid:4). 0(cid:21)(cid:24)%(cid:11)(cid:19)%(cid:14)(cid:23)(cid:22)(cid:18)(cid:19)*(cid:24)(cid:13) (cid:7)+ (cid:4)(cid:28)(cid:15)(cid:4)(cid:14)(cid:8),2 7(cid:31)(cid:13)(cid:20)(cid:11)(cid:25)(cid:25)(cid:14)5(cid:13)(cid:24)(cid:12)%(cid:22) (cid:2) (cid:15)(cid:28)(cid:4)(cid:4)(cid:14)/(cid:3)0 7(cid:31)(cid:13)(cid:20)(cid:11)(cid:25)(cid:25)(cid:14);(cid:18)"%(cid:22) , +(cid:28)(cid:4)(cid:4)(cid:14)/(cid:3)0 ,#(cid:10)(cid:21) (cid:13)"(cid:14)(cid:30)(cid:11)"(cid:14)5(cid:13)(cid:24)(cid:12)%(cid:22) (cid:2)(cid:15) (cid:29)(cid:28)+(cid:4) < (cid:29)(cid:28).. ,#(cid:10)(cid:21) (cid:13)"(cid:14)(cid:30)(cid:11)"(cid:14);(cid:18)"%(cid:22) ,(cid:15) (cid:29)(cid:28).(cid:4) < (cid:29)(cid:28)(cid:16). 0(cid:21)(cid:24)%(cid:11)(cid:19)%(cid:14);(cid:18)"%(cid:22) ( (cid:4)(cid:28)(cid:15)(cid:4) (cid:4)(cid:28)(cid:15). (cid:4)(cid:28)+(cid:4) 0(cid:21)(cid:24)%(cid:11)(cid:19)%(cid:14)5(cid:13)(cid:24)(cid:12)%(cid:22) 5 (cid:4)(cid:28)+(cid:4) (cid:4)(cid:28)(cid:5)(cid:4) (cid:4)(cid:28).(cid:4) 0(cid:21)(cid:24)%(cid:11)(cid:19)%(cid:9)%(cid:21)(cid:9),#(cid:10)(cid:21) (cid:13)"(cid:14)(cid:30)(cid:11)" = (cid:4)(cid:28)(cid:15)(cid:4) < < (cid:19)(cid:20)(cid:12)(cid:5)(cid:11)’ (cid:29)(cid:28) (cid:30)(cid:18)(cid:24)(cid:14)(cid:29)(cid:14)(cid:31)(cid:18) !(cid:11)(cid:25)(cid:14)(cid:18)(cid:24)"(cid:13)#(cid:14)$(cid:13)(cid:11)%!(cid:20)(cid:13)(cid:14)&(cid:11)(cid:26)(cid:14)(cid:31)(cid:11)(cid:20)(cid:26)’(cid:14)(!%(cid:14)&! %(cid:14)((cid:13)(cid:14)(cid:25)(cid:21)(cid:19)(cid:11)%(cid:13)"(cid:14))(cid:18)%(cid:22)(cid:18)(cid:24)(cid:14)%(cid:22)(cid:13)(cid:14)(cid:22)(cid:11)%(cid:19)(cid:22)(cid:13)"(cid:14)(cid:11)(cid:20)(cid:13)(cid:11)(cid:28) (cid:15)(cid:28) (cid:30)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:13)(cid:14)&(cid:11)(cid:26)(cid:14)(cid:22)(cid:11)(cid:31)(cid:13)(cid:14)(cid:21)(cid:24)(cid:13)(cid:14)(cid:21)(cid:20)(cid:14)&(cid:21)(cid:20)(cid:13)(cid:14)(cid:13)#(cid:10)(cid:21) (cid:13)"(cid:14)%(cid:18)(cid:13)(cid:14)((cid:11)(cid:20) (cid:14)(cid:11)%(cid:14)(cid:13)(cid:24)" (cid:28) +(cid:28) (cid:30)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:13)(cid:14)(cid:18) (cid:14) (cid:11))(cid:14) (cid:18)(cid:24)(cid:12)!(cid:25)(cid:11)%(cid:13)"(cid:28) (cid:5)(cid:28) (cid:2)(cid:18)&(cid:13)(cid:24) (cid:18)(cid:21)(cid:24)(cid:18)(cid:24)(cid:12)(cid:14)(cid:11)(cid:24)"(cid:14)%(cid:21)(cid:25)(cid:13)(cid:20)(cid:11)(cid:24)(cid:19)(cid:18)(cid:24)(cid:12)(cid:14)(cid:10)(cid:13)(cid:20)(cid:14)(cid:7)(cid:3)(cid:17),(cid:14)-(cid:29)(cid:5)(cid:28).(cid:17)(cid:28) /(cid:3)01/(cid:11) (cid:18)(cid:19)(cid:14)(cid:2)(cid:18)&(cid:13)(cid:24) (cid:18)(cid:21)(cid:24)(cid:28)(cid:14)(cid:23)(cid:22)(cid:13)(cid:21)(cid:20)(cid:13)%(cid:18)(cid:19)(cid:11)(cid:25)(cid:25)(cid:26)(cid:14)(cid:13)#(cid:11)(cid:19)%(cid:14)(cid:31)(cid:11)(cid:25)!(cid:13)(cid:14) (cid:22)(cid:21))(cid:24)(cid:14))(cid:18)%(cid:22)(cid:21)!%(cid:14)%(cid:21)(cid:25)(cid:13)(cid:20)(cid:11)(cid:24)(cid:19)(cid:13) (cid:28) (cid:8),21 (cid:8)(cid:13)$(cid:13)(cid:20)(cid:13)(cid:24)(cid:19)(cid:13)(cid:14)(cid:2)(cid:18)&(cid:13)(cid:24) (cid:18)(cid:21)(cid:24)’(cid:14)! !(cid:11)(cid:25)(cid:25)(cid:26)(cid:14))(cid:18)%(cid:22)(cid:21)!%(cid:14)%(cid:21)(cid:25)(cid:13)(cid:20)(cid:11)(cid:24)(cid:19)(cid:13)’(cid:14)$(cid:21)(cid:20)(cid:14)(cid:18)(cid:24)$(cid:21)(cid:20)&(cid:11)%(cid:18)(cid:21)(cid:24)(cid:14)(cid:10)!(cid:20)(cid:10)(cid:21) (cid:13) (cid:14)(cid:21)(cid:24)(cid:25)(cid:26)(cid:28) (cid:17)(cid:18)(cid:19)(cid:20)(cid:21)(cid:19)(cid:22)(cid:18)(cid:10)(cid:23)(cid:13)(cid:19)(cid:22)(cid:24)(cid:21)(cid:25)(cid:21)(cid:12)(cid:26)(cid:2)(cid:20)(cid:11))(cid:18)(cid:24)(cid:12)0(cid:4)(cid:5)(cid:9)(cid:29)(cid:15)+0  2002-2019 Microchip Technology Inc. DS20001710L-page 18

24AA08/24LC08B/24FC08 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 19

24AA08/24LC08B/24FC08 Note: For the mostcurrent package drawings,please seetheMicrochip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 20

24AA08/24LC08B/24FC08 Note: For the mostcurrent package drawings,please seetheMicrochip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 21

24AA08/24LC08B/24FC08 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 22

24AA08/24LC08B/24FC08 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A A2 PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 23

24AA08/24LC08B/24FC08 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e e 2 2 e e Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB - - .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 24

24AA08/24LC08B/24FC08 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 1 2 e NX b B 0.25 C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X 0.10 C A1 SIDE VIEW h R0.13 h R0.13 H 0.23 L SEE VIEW C (L1) VIEW A–A VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 25

24AA08/24LC08B/24FC08 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 1.27 BSC Overall Height A - - 1.75 Molded Package Thickness A2 1.25 - - Standoff § A1 0.10 - 0.25 Overall Width E 6.00 BSC Molded Package Width E1 3.90 BSC Overall Length D 4.90 BSC Chamfer (Optional) h 0.25 - 0.50 Foot Length L 0.40 - 1.27 Footprint L1 1.04 REF Foot Angle 0° - 8° Lead Thickness c 0.17 - 0.25 Lead Width b 0.31 - 0.51 Mold Draft Angle Top 5° - 15° Mold Draft Angle Bottom 5° - 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 26

24AA08/24LC08B/24FC08 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 1.27 BSC Contact Pad Spacing C 5.40 Contact Pad Width (X8) X1 0.60 Contact Pad Length (X8) Y1 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B  2002-2019 Microchip Technology Inc. DS20001710L-page 27

24AA08/24LC08B/24FC08 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C (A3) C A SEATING PLANE 8X A1 0.08 C SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 C A B 0.05 C BOTTOM VIEW Microchip Technology Drawing No. C04-129-MN Rev E Sheet 1 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 28

24AA08/24LC08B/24FC08 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.50 BSC Overall Height A 0.70 0.75 0.80 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Overall Width E 3.00 BSC Exposed Pad Length D2 1.35 1.40 1.45 Exposed Pad Width E2 1.25 1.30 1.35 Contact Width b 0.20 0.25 0.30 Contact Length L 0.25 0.30 0.45 Contact-to-Exposed Pad K 0.20 - - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04-129-MN Rev E Sheet 2 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 29

24AA08/24LC08B/24FC08 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 8 ØV C Y2 EV Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width X2 1.60 Optional Center Pad Length Y2 1.50 Contact Pad Spacing C 2.90 Contact Pad Width (X8) X1 0.25 Contact Pad Length (X8) Y1 0.85 Thermal Via Diameter V 0.30 Thermal Via Pitch EV 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing No. C04-129-MN Rev. B  2002-2019 Microchip Technology Inc. DS20001710L-page 30

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DS20001710L-page 31

24AA08/24LC08B/24FC08 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 32

24AA08/24LC08B/24FC08 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) E (DATUM B) NOTE 1 2X 0.10 C 1 2 2X 0.10 C TOP VIEW 0.10 C A1 C A SEATING PLANE 8X (A3) 0.08 C SIDE VIEW 0.10 C A B D2 e 2 1 2 0.10 C A B E2 K N L 8X b e 0.10 C A B 0.05 C BOTTOM VIEW Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 33

24AA08/24LC08B/24FC08 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Terminals N 8 Pitch e 0.50 BSC Overall Height A 0.50 0.55 0.60 Standoff A1 0.00 0.02 0.05 Terminal Thickness A3 0.152 REF Overall Length D 2.00 BSC Exposed Pad Length D2 1.40 1.50 1.60 Overall Width E 3.00 BSC Exposed Pad Width E2 1.20 1.30 1.40 Terminal Width b 0.18 0.25 0.30 Terminal Length L 0.35 0.40 0.45 Terminal-to-Exposed-Pad K 0.20 - - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 34

24AA08/24LC08B/24FC08 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV G2 8 ØV C Y2 G1 Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width X2 1.60 Optional Center Pad Length Y2 1.40 Contact Pad Spacing C 2.90 Contact Pad Width (X8) X1 0.30 Contact Pad Length (X8) Y1 0.85 Contact Pad to Center Pad (X8) G1 0.20 Contact Pad to Contact Pad (X6) G2 0.33 Thermal Via Diameter V 0.30 Thermal Via Pitch EV 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-21355-Q4B Rev A  2002-2019 Microchip Technology Inc. DS20001710L-page 35

24AA08/24LC08B/24FC08 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A2 A 0.20 C SEATING PLANE A SEE SHEET 2 A1 C SIDE VIEW Microchip Technology Drawing C04-091-OT Rev F Sheet 1 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 36

24AA08/24LC08B/24FC08 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c (cid:84) L L1 VIEW A-A SHEET 1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 5 Pitch e 0.95 BSC Outside lead pitch e1 1.90 BSC Overall Height A 0.90 - 1.45 Molded Package Thickness A2 0.89 - 1.30 Standoff A1 - - 0.15 Overall Width E 2.80 BSC Molded Package Width E1 1.60 BSC Overall Length D 2.90 BSC Foot Length L 0.30 - 0.60 Footprint L1 0.60 REF Foot Angle (cid:73) 0° - 10° Lead Thickness c 0.08 - 0.26 Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2  2002-2019 Microchip Technology Inc. DS20001710L-page 37

24AA08/24LC08B/24FC08 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.95 BSC Contact Pad Spacing C 2.80 Contact Pad Width (X5) X 0.60 Contact Pad Length (X5) Y 1.10 Distance Between Pads G 1.70 Distance Between Pads GX 0.35 Overall Width Z 3.90 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2091-OT Rev F  2002-2019 Microchip Technology Inc. DS20001710L-page 38

24AA08/24LC08B/24FC08 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 39

24AA08/24LC08B/24FC08 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 40

24AA08/24LC08B/24FC08 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2019 Microchip Technology Inc. DS20001710L-page 41

24AA08/24LC08B/24FC08 APPENDIX A: REVISION HISTORY Revision L (12/2019) Added the 24FC08 device; Updated Package Drawings; Updated formating throughout for clarifica- tion. Revision K (03/2012) Added Chip Scale package; Revised Table 1-1, Table 2-1; Product Identification System. Revision J (02/2009) Moved Pin Descriptions to Section 2.0, renumbered remaining sections. Added Figure 5-2. Revision H (03/2008) Added TDFN package. Revision G (02/2007) Replaced Package Drawings. Revision F (02/2007) Updated Device Selection Table; Features section; Changed 1.8V to 1.7V throughout document; Revised Electrical Characteristics Ambient Temperature; Replaced Package Drawings; Revised Product ID System. Revision E (09/2005) Revised Figure 3-1: Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 Current Address Read; Figure 7-2 Random Read; Figure 7-3 Sequential Read; 8.3 Write-Protect (000-3FF). Revision D (02/2005) Added DFN package. Revision C (12/2003) Corrections to Section 1.0, Electrical Characteristics. Section 9.1, 24LC08B standard marking code.  2002-2019 Microchip Technology Inc. DS20001710L-page 42

24AA08/24LC08B/24FC08 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at Users of Microchip products can receive assistance www.microchip.com. This website is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the website contains the following information: • Field Application Engineer (FAE) • Product Support – Data sheets and errata, appli- • Technical Support cation notes and sample programs, design resources, user’s guides and hardware support Customers should contact their distributor, representa- documents, latest software releases and archived tive or Field Application Engineer (FAE) for support. software Local sales offices are also available to help custom- • General Technical Support – Frequently Asked ers. A listing of sales offices and locations is included in Questions (FAQ), technical support requests, the back of this document. online discussion groups, Microchip consultant Technical support is available through the website program member listing at: http://microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Micro- chip sales offices, distributors and factory repre- sentatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a spec- ified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Cus- tomer Change Notification” and follow the registra- tion instructions.  2002-2019 Microchip Technology Inc. DS20001710L-page 43

24AA08/24LC08B/24FC08 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. (1) PART NO. [X] -X /XX Examples: Device Tape and Reel Temperature Package a) 24AA08-I/P: Industrial Temperature, 1.7V, Option Range PDIP package. b) 24AA08-I/SN: Industrial Temperature, 1.7V, Device: 24AA08: = 1.7V, 8-Kbit I2C Serial EEPROM SOIC package. 24LC08B: = 2.5V, 8-Kbit I2C Serial EEPROM c) 24AA08T-I/OT: Tape and Reel, Industrial 24FC08: = 1.7V, High Speed, 8-Kbit I2C Serial EEPROM Temperature, 1.7V, SOT-23 package. d) 24AA08T-I/CS16K: Tape and Reel, Industrial Tape and Blank = Standard packaging (tube or tray) Temperature, 1.7V, Chip Scale package. Reel Option: T = Tape and Reel(1) e) 24LC08B-I/P: Industrial Temperature, 2.5V, PDIP package. f) 24LC08B-E/SN: Extended Temperature, Temperature I = -40°C to +85°C (Industrial) 2.5V, SOIC package. Range: E = -40°C to +125°C (Extended) g) 24LC08BT-I/OT: Tape and Reel, Industrial Temperature, 2.5V, SOT-23 package. Package: MC = Plastic Dual Flat, No Lead Package – 2x3x0.9 mm h) 24AA08T-I/MNY: Tape and Reel, Industrial Body, 8-lead (DFN) Temperature, 1.7V, TDFN package. MS = Plastic Micro Small Outline Package, 8-lead i) 24FC08-I/SN: Industrial Temperature, 1.7V, (MSOP) SOIC package. P = Plastic Dual In-Line – 300 mil Body, 8-lead (PDIP) SN = Plastic Small Outline - Narrow, 3.90 mm Body, j) 24FC08-E/ST: Extended Temperature, 1.7V, 8-lead (SOIC) TSSOP package. OT = Plastic Small Outline Transistor, 5-lead (SOT-23) k) 24FC08T-I/MUY: Tape and Reel, Industrial (Tape and Reel only) Temperature, 1.7V, UDFN package. MNY = Plastic Dual Flat, No Lead Package - 2x3x0.8 mm Body, 8-lead (TDFN) ST = Plastic Thin Shrink Small Outline – 4.4 mm, 8-lead (TSSOP) Note 1: Tape and Reel identifier only MUY = Plastic Dual Flat, No Lead Package - 2x3x0.6 mm appears in the catalog part number Body, 8-lead (UDFN) description. This identifier is used CS16K(2)= Chip Scale, 4-lead (CSP) for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2: 16K indicates 160K technology. 3: Contact Microchip for Automotive grade ordering part numbers.  2002-2019 Microchip Technology Inc. DS20001710L-page 44

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, Adaptec, and may be superseded by updates. It is your responsibility to AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, ensure that your application meets with your specifications. chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, MICROCHIP MAKES NO REPRESENTATIONS OR LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, WARRANTIES OF ANY KIND WHETHER EXPRESS OR Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, IMPLIED, WRITTEN OR ORAL, STATUTORY OR PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, OTHERWISE, RELATED TO THE INFORMATION, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, INCLUDING BUT NOT LIMITED TO ITS CONDITION, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA QUALITY, PERFORMANCE, MERCHANTABILITY OR are registered trademarks of Microchip Technology Incorporated in FITNESS FOR PURPOSE. Microchip disclaims all liability the U.S.A. and other countries. arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at APT, ClockWorks, The Embedded Control Solutions Company, the buyer’s risk, and the buyer agrees to defend, indemnify and EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision hold harmless Microchip from any and all damages, claims, Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, suits, or expenses resulting from such use. No licenses are SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, conveyed, implicitly or otherwise, under any Microchip TimePictra, TimeProvider, Vite, WinPath, and ZL are registered intellectual property rights unless otherwise stated. trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2019, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. ISBN: 978-1-5224-5393-2  2002-2019 Microchip Technology Inc. DS20001710L-page 45

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