24AA02/24LC02B/24FC02 2 2K I C Serial EEPROM Device Selection Table Part Number VCC Range Max. Clock Frequency Temp. Ranges Available Packages 24AA02 1.7V-5.5V 400 kHz(1) I P, SN, MS, ST, MC, LT, MNY, OT 24LC02B 2.5V-5.5V 400 kHz I, E P, SN, MS, ST, MC, LT, MNY, OT 24FC02 1.7V-5.5V 1 MHz I, E P, SN, MS, ST, MUY, OT Note1: 100 kHz for VCC < 2.5V Features Description • Single Supply with Operation down to 1.7V for The Microchip Technology Inc. 24XX02(1) is a 2-Kbit 24AA02 and 24FC02 Devices, 2.5V for 24LC02B Electrically Erasable PROM. The device is organized Devices as one block of 256 x 8-bit memory with a 2-wire serial • Low-Power CMOS Technology: interface. Its low-voltage design permits operation down to 1.7V with standby and active currents of only - Read current 1 mA, maximum 1 μA and 1 mA, respectively. The 24XX02 also has a - Standby current 1 μA, maximum (I-temp.) page write capability for up to 8 bytes of data. • 2-Wire Serial Interface, I2C Compatible • Schmitt Trigger Inputs for Noise Suppression • Output Slope Control to Eliminate Ground Bounce Note1: 24XX02 is used in this document as a generic part number for the • 100 kHz, 400 kHz and 1 MHz Compatibility 24AA02/24LC02B/24FC02 devices. • Page Write Time: 5 ms, Maximum • Self-Timed Erase/Write Cycle Package Types • 8-Byte Page Write Buffer • Hardware Write-Protect PDIP, MSOP DFN/TDFN/UDFN (Top View) • ESD Protection >4,000V (Top View) • More than 1 Million Erase/Write Cycles A0(1) 1 8 VCC A0(1) 1 8 VCC • Data Retention >200 Years A1(1) 2 7 WP A1(1) 2 7 WP • Factory Programming Available A2(1) 3 6 SCLA2(1) 3 6 SCL • RoHS Compliant VSS 4 5 SDA VSS 4 5 SDA • Temperature Ranges: - Industrial (I): -40°C to +85°C SOIC, TSSOP - Extended (E): -40°C to +125°C (Top View) SOT-23/SC-70 • Automotive AEC-Q100 Qualified (Top View) A0(1) 1 8 VCC SCL 1 5 WP Packages A1(1) 2 7 WP A2(1) 3 6 SCL Vss 2 • 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP, 8-Lead SOIC, 8-Lead TDFN, 8-Lead TSSOP, VSS 4 5 SDA SDA 3 4 Vcc 8-Lead UDFN, 5-Lead SOT-23 and 5-Lead SC-70 Note 1: Pins A0, A1 and A2 are not used by the 24XX02 (no internal connections).  2007-2019 Microchip Technology Inc. DS20001709L-page 1

24AA02/24LC02B/24FC02 Block Diagram WP HV Generator I/O Memory EEPROM Control Control XDEC Array Logic Logic Page Latches I/O SCL YDEC SDA VCC VSS Sense Amp. R/W Control  2007-2019 Microchip Technology Inc. DS20001709L-page 2

24AA02/24LC02B/24FC02 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS.........................................................................................................-0.3V to VCC +1.0V Storage temperature...............................................................................................................................-65°C to +150°C Ambient temperature with power applied................................................................................................-40°C to +125°C ESD protection on all pins4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V DC CHARACTERISTICS Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC02B) Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC02) Param. Symbol Characteristic Min. Typ. Max. Units Conditions No. D1 VIH High-Level Input Voltage 0.7 VCC — — V D2 VIL Low-Level Input Voltage — — 0.3 VCC V D3 VHYS Hysteresis of Schmitt 0.05 VCC — — V Note Trigger Inputs D4 VOL Low-Level Output — — 0.40 V IOL = 3.0 mA, VCC = 2.5V Voltage D5 ILI Input Leakage Current — — ±1 μA VIN = VSS or VCC D6 ILO Output Leakage Current — — ±1 μA VOUT = VSS or VCC D7 CIN, Pin Capacitance — — 10 pF VCC = 5.0V (Note) COUT (all inputs/outputs) TA = 25°C, FCLK = 1 MHz D8 ICCWRITE Operating Current — — 3 mA VCC = 5.5V, SCL = 400 kHz D9 ICCREAD — — 1 mA VCC = 5.5V, SCL = 400 kHz D10 ICCS Standby Current — — 1 μA SDA = SCL = VCC WP = VSS, I-Temp. — — 3 μA SDA = SCL = VCC WP = VSS, E-Temp. (24FC02) — — 5 μA SDA = SCL = VCC WP = VSS, E-Temp. (24LC02B) Note: This parameter is periodically sampled and not 100% tested.  2007-2019 Microchip Technology Inc. DS20001709L-page 3

24AA02/24LC02B/24FC02 TABLE 1-2: AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V AC CHARACTERISTICS Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC02B) Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC02) Param. Symbol Characteristic Min. Typ. Max. Units Conditions No. 1 FCLK Clock Frequency — — 400 kHz 2.5V ≤ VCC ≤ 5.5V — — 100 kHz 1.7V ≤ VCC < 2.5V (24AA02) — — 1000 kHz 1.7V ≤ VCC ≤ 5.5V (24FC02) 2 THIGH Clock High Time 600 — — ns 2.5V ≤ VCC ≤ 5.5V 4000 — — ns 1.7V ≤ VCC < 2.5V (24AA02) 260 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 3 TLOW Clock Low Time 1300 — — ns 2.5V ≤ VCC ≤ 5.5V 4700 — — ns 1.7V ≤ VCC < 2.5V (24AA02) 500 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 4 TR SDA and SCL Rise Time — — 300 ns 2.5V ≤ VCC ≤ 5.5V (Note 1) — — 1000 ns 1.7V ≤ VCC < 2.5V (24AA02) (Note 1) — — 1000 ns 1.7V ≤ VCC ≤ 5.5V (24FC02) (Note 1) 5 TF SDA and SCL Fall Time — — 300 ns Note 1 6 THD:STA Start Condition Hold 600 — — ns 2.5V ≤ VCC ≤ 5.5V Time 4000 — — ns 1.7V ≤ VCC < 2.5V (24AA02) 250 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 7 TSU:STA Start Condition Setup 600 — — ns 2.5V ≤ VCC ≤ 5.5V Time 4700 — — ns 1.7V ≤ VCC < 2.5V (24AA02) 250 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 8 THD:DAT Data Input Hold Time 0 — — ns Note 2 9 TSU:DAT Data Input Setup Time 100 — — ns 2.5V ≤ VCC ≤ 5.5V 250 — — ns 1.7V ≤ VCC < 2.5V (24AA02) 50 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 10 TSU:STO Stop Condition Setup 600 — — ns 2.5V ≤ VCC ≤ 5.5V Time 4000 — — ns 1.7V ≤ VCC < 2.5V (24AA02) 250 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 11 TSU:WP WP Setup Time 0 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 12 THD:WP WP Hold Time 1000 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) 13 TAA Output Valid from Clock — — 900 ns 2.5V ≤ VCC ≤ 5.5V (Note 2) — — 3500 ns 1.7V ≤ VCC < 2.5V (24AA02) (Note 2) — — 450 ns 1.7V ≤ VCC ≤ 5.5V (24FC02) (Note 2) Note 1: Characterized but not 100% tested. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: CB = total capacitance of one bus line in pF. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s website at www.microchip.com.  2007-2019 Microchip Technology Inc. DS20001709L-page 4

24AA02/24LC02B/24FC02 TABLE 1-2: AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V AC CHARACTERISTICS (Continued) Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V (24LC02B) Extended (E): TA = -40°C to +125°C, VCC = +1.7V to +5.5V (24FC02) Param. Symbol Characteristic Min. Typ. Max. Units Conditions No. 14 TBUF Bus Free Time: The time 1300 — — ns 2.5V ≤ VCC ≤ 5.5V the bus must be free 4700 — — ns 1.7V ≤ VCC < 2.5V (24AA02) before a new transmis- 500 — — ns 1.7V ≤ VCC ≤ 5.5V (24FC02) sion can start 15 TOF Output Fall Time from VIH 20+0.1CB — 250 ns 2.5V ≤ VCC ≤ 5.5V (24LC02B) Minimum to VIL Maximum (Notes 1 and 3) — — 250 ns 1.7V ≤ VCC < 2.5V (24AA02) (Note 1) 16 TSP Input Filter Spike — — 50 ns Note 1 Suppression (SDA and SCL pins) 17 TWC Write Cycle Time — — 5 ms (byte or page) 18 Endurance 1,000,000 — — cycles 25°C, 5.5V, Page Mode (Note 4) Note 1: Characterized but not 100% tested. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: CB = total capacitance of one bus line in pF. 4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from Microchip’s website at www.microchip.com. FIGURE 1-1: BUS TIMING DATA 5 4 2 D3 SCL 7 3 8 9 10 SDA 6 IN 16 13 14 SDA OUT (protected) WP 11 12 (unprotected)  2007-2019 Microchip Technology Inc. DS20001709L-page 5

24AA02/24LC02B/24FC02 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Name DFN MSOP PDIP SC-70 SOIC SOT-23 TDFN(1) TSSOP UDFN(1) Description A0 1 1 1 — 1 — 1 1 1 Not Connected A1 2 2 2 — 2 — 2 2 2 Not Connected A2 3 3 3 — 3 — 3 3 3 Not Connected VSS 4 4 4 2 4 2 4 4 4 Ground SDA 5 5 5 3 5 3 5 5 5 Serial Address/Data I/O SCL 6 6 6 1 6 1 6 6 6 Serial Clock WP 7 7 7 5 7 5 7 7 7 Write-Protect Input VCC 8 8 8 4 8 4 8 8 8 Power Supply Note 1: The exposed pad on the TDFN/UDFN package can be connected to VSS or left floating. 2.1 A0, A1, A2 2.3 Serial Clock (SCL) The A0, A1 and A2 pins are not used by the 24XX02. The SCL input is used to synchronize the data transfer They may be left floating or tied to either VSS or VCC. to and from the device. 2.2 Serial Address/Data Input/Output 2.4 Write-Protect (WP) (SDA) This pin must be connected to either VSS or VCC. The SDA input is a bidirectional pin used to transfer If tied to VSS, normal memory operation is enabled addresses and data into and out of the device. Since (read/write the entire memory 00-FF). it is an open-drain terminal, the SDA bus requires a If tied to VCC, write operations are inhibited. The entire pull-up resistor to VCC (typical 10 kΩ for 100 kHz, memory will be write-protected. Read operations are 2 kΩ for 400 kHz and 1 MHz). not affected. For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating Start and Stop conditions.  2007-2019 Microchip Technology Inc. DS20001709L-page 6

24AA02/24LC02B/24FC02 3.0 FUNCTIONAL DESCRIPTION 4.4 Data Valid (D) The 24XX02 supports a bidirectional, 2-wire bus and The state of the data line represents valid data when, data transmission protocol. A device that sends data after a Start condition, the data line is stable for the onto the bus is defined as transmitter, while defining a duration of the high period of the clock signal. device receiving data as a receiver. The bus has to be The data on the line must be changed during the low controlled by a master device which generates the period of the clock signal. There is one clock pulse per Serial Clock (SCL), controls the bus access and bit of data. generates the Start and Stop conditions, while the Each data transfer is initiated with a Start condition and 24XX02 works as slave. Both master and slave can terminated with a Stop condition. The number of data operate as transmitter or receiver, but the master bytes transferred between the Start and Stop device determines which mode is activated. conditions is determined by the master device and is, theoretically, unlimited (although only the last eight will 4.0 BUS CHARACTERISTICS be stored when doing a write operation). When an overwrite does occur, it will replace data based on the The following bus protocol has been defined: first-in first-out (FIFO) principle. • Data transfer may be initiated only when the bus is not busy. 4.5 Acknowledge • During data transfer, the data line must remain stable whenever the clock line is high. Changes in Each receiving device, when addressed, is obliged to the data line while the clock line is high will be generate an acknowledge after the reception of each interpreted as a Start or Stop condition. byte. The master device must generate an extra clock pulse which is associated with this Acknowledge bit. Accordingly, the following bus conditions have been defined (Figure 4-1). Note: The 24XX02 does not generate any 4.1 Bus Not Busy (A) Acknowledge bits if an internal programming cycle is in progress. Both data and clock lines remain high. The device that acknowledges has to pull down the 4.2 Start Data Transfer (B) SDA line during the acknowledge clock pulse in such a A high-to-low transition of the SDA line while the clock way that the SDA line is stable-low during the high (SCL) is high determines a Start condition. All period of the acknowledge-related clock pulse. commands must be preceded by a Start condition. Moreover, setup and hold times must be taken into account. During reads, a master must signal an end of 4.3 Stop Data Transfer (C) data to the slave by not generating an Acknowledge bit on the last byte that has been clocked out of the slave. A low-to-high transition of the SDA line while the clock In this case, the slave (24XX02) will leave the data line (SCL) is high determines a Stop condition. All high to enable the master to generate the Stop operations must be ended with a Stop condition. condition. FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS (A) (B) (D) (D) (C) (A) SCL SDA Start Address or Data Stop Condition Acknowledge Allowed Condition Valid to Change  2007-2019 Microchip Technology Inc. DS20001709L-page 7

24AA02/24LC02B/24FC02 5.0 DEVICE ADDRESSING FIGURE 5-1: CONTROL BYTE ALLOCATION A control byte is the first byte received following the Start condition from the master device. The control byte Read/Write Bit consists of a four-bit control code. For the 24XX02, this is set as ‘1010’ binary for read and write operations. Block The next three bits of the control byte are “don’t cares” Select Control Code Bits for the 24XX02. The combination of the 4-bit control code and the next three bits are called the slave address. S 1 0 1 0 x x x R/W ACK The last bit of the control byte is the Read/Write (R/W) bit and it defines the operation to be performed. When Slave Address set to ‘1’, a read operation is selected. When set to ‘0’, a write operation is selected. Following the Start condition, the 24XX02 monitors the SDA bus, checking Start Bit Acknowledge Bit the device type identifier being transmitted. Upon receiving a valid slave address and the R/W bit, the x = “don’t care” slave device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24XX02 will select a read or write operation. The next byte received defines the address of the first data byte within the selected block (Figure 5-2). The word address byte uses all eight bits. Control Operation Block Select R/W Code Read 1010 Block Address 1 Write 1010 Block Address 0 FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS Control Byte Word Address Byte A A 1 0 1 0 x x x R/W 7 • • • • • • 0 Control Block Code Select bits x = “don’t care”  2007-2019 Microchip Technology Inc. DS20001709L-page 8

24AA02/24LC02B/24FC02 6.0 WRITE OPERATION 6.2 Page Write The write control byte, word address and first data byte 6.1 Byte Write are transmitted to the 24XX02 in the same way as in a byte write. However, instead of generating a Stop Following the Start condition from the master, the condition, the master transmits up to eight data bytes to device code (4 bits), the block address (3 bits, “don’t the 24XX02, which are temporarily stored in the cares”) and the R/W bit, which is a logic-low, is placed on-chip page buffer and will be written into the memory onto the bus by the master transmitter. This indicates to once the master has transmitted a Stop condition. the addressed slave receiver that a byte with a word Upon receipt of each word, the three lower-order address will follow after it has generated an Address Pointer bits, which form the byte counter, are Acknowledge bit during the ninth clock cycle. internally incremented by one. The higher-order five Therefore, the next byte transmitted by the master is bits of the word address remain constant. If the master the word address and will be written into the Address should transmit more than eight words prior to generat- Pointer of the 24XX02. After receiving another ing the Stop condition, the Address Pointer will roll over Acknowledge signal from the 24XX02, the master and the previously received data will be overwritten. As device will transmit the data word to be written into the with the byte write operation, once the Stop condition is addressed memory location. The 24XX02 received, an internal write cycle will begin (Figure 6-2). acknowledges again and the master generates a Stop condition. This initiates the internal write cycle, and, during this time, the 24XX02 will not generate Note: Page write operations are limited to writ- Acknowledge signals (Figure 6-1). ing bytes within a single physical page regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of page size – 1. If a page write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. 6.3 Write Protection The WP pin allows the user to write-protect the entire array (00-FF) when the pin is tied to VCC. If tied to VSS, the write protection is disabled. FIGURE 6-1: BYTE WRITE S S Bus Activity T Control Word T Master A Byte Address Data O R P T SDA Line S 1 0 1 0 x x x 0 P A A A Bus Activity Block C C C Select K K K x = “don’t care” Bits  2007-2019 Microchip Technology Inc. DS20001709L-page 9

24AA02/24LC02B/24FC02 FIGURE 6-2: PAGE WRITE S S Bus Activity T Control Word T Master AR Byte Address (n) Data (n) Data (n + 1) Data (n + 7) OP T SDA Line S 10 10 x xx0 P A A A A A Bus Activity Block C C C C C Select K K K K K x = “don’t care” Bits  2007-2019 Microchip Technology Inc. DS20001709L-page 10

24AA02/24LC02B/24FC02 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the master, the device initiates the internally-timed write cycle. ACK polling can then be initiated immediately. This involves the master sending a Start condition followed by the control byte for a write command (R/W = 0). If the device is still busy with the write cycle, no ACK will be returned. If the cycle is complete, the device will return the ACK and the master can then proceed with the next read or write operation. See Figure 7-1 for a flow diagram of this operation. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device No Acknowledge (ACK = 0)? Yes Next Operation  2007-2019 Microchip Technology Inc. DS20001709L-page 11

24AA02/24LC02B/24FC02 8.0 READ OPERATION 8.3 Sequential Read Read operations are initiated in the same way as write Sequential reads are initiated in the same way as a operations, with the exception that the R/W bit of the random read, except that once the 24XX02 transmits slave address is set to ‘1’. There are three basic types the first data byte, the master issues an acknowledge of read operations: current address read, random read (as opposed to a Stop condition in a random read). This and sequential read. directs the 24XX02 to transmit the next sequentially addressed 8-bit word (Figure 8-3). 8.1 Current Address Read To provide sequential reads the 24XX02 contains an internal Address Pointer which is incremented by one The 24XX02 contains an Address Pointer that at the completion of each operation. This Address maintains the address of the last word accessed, Pointer allows the entire memory contents to be serially internally incremented by one. Therefore, if the previ- read during one operation. ous access (either a read or write operation) was to address n, the next current address read operation 8.4 Noise Protection would access data from address n + 1. Upon receipt of the slave address with R/W bit set to ‘1’, the 24XX02 The SCL and SDA inputs have Schmitt Trigger and issues an acknowledge and transmits the 8-bit data filter circuits which suppress noise spikes to assure word. The master will not acknowledge the transfer, but proper device operation even on a noisy bus. does generate a Stop condition and the 24XX02 discontinues transmission (Figure 8-1). 8.2 Random Read Random read operations allow the master to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24XX02 as part of a write operation. Once the word address is sent, the master generates a Start condition following the acknowledge. This terminates the write operation, but not before the inter- nal Address Pointer is set. The master then issues the control byte again, but with the R/W bit set to a ‘1’. The 24XX02 will then issue an acknowledge and transmits the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition and the 24XX02 discontinues transmission (Figure 8-2). FIGURE 8-1: CURRENT ADDRESS READ S Bus Activity T Control S Master A Byte Data (n) T R O T P SDA Line S 1 0 1 0 x x x 1 P A N Bus Activity C o Block K Select A x = “don’t care” Bits C K  2007-2019 Microchip Technology Inc. DS20001709L-page 12

24AA02/24LC02B/24FC02 FIGURE 8-2: RANDOM READ S S Bus Activity T Control Word T Control S A A T Master R Byte Address (n) R Byte Data (n) O T T P S1010xxx0 S1010xxx 1 P SDA Line A A A N Block C C Block C o Select K K Select K Bus Activity Bits A Bits C x = “don’t care” K FIGURE 8-3: SEQUENTIAL READ S Bus Activity Control T Master Byte Data (n) Data (n + 1) Data (n + 2) Data (n + x) O P SDA Line 1 P A A A A N Bus Activity C C C C o K K K K A C K  2007-2019 Microchip Technology Inc. DS20001709L-page 13

24AA02/24LC02B/24FC02 9.0 PACKAGING INFORMATION 9.1 Package Marking Information* 8-Lead 2x3 DFN Example XXX 224 YWW 922 NN 13 8-Lead MSOP Example XXXXXX 4L2BI YWWNNN 92213F 8-Lead PDIP (300 mil) Example XXXXXXXX 24LC02B T/XXXNNN I/P e 3 13F YYWW 1922 5-Lead SC-70 Example XXNN B413 8-Lead SOIC (3.90 mm) Example XXXXXXXX 24LC02BI SN e 3 1922 XXXXYYWW NNN 13F  2007-2019 Microchip Technology Inc. DS20001709L-page 14

24AA02/24LC02B/24FC02 5-Lead SOT-23 (1-Line Marking) Example XXNN M213 5-Lead SOT-23 (2-Line Marking) Example XXXXYY AAEV19 WWNNN 2213F 8-Lead 2x3 TDFN Example XXX A24 YWW 922 NN 13 8-Lead TSSOP Example XXXX 4L02 TYWW I922 NNN 13F 8-Lead 2x3 UDFN Example XXX ADN YWW 922 NN 13  2007-2019 Microchip Technology Inc. DS20001709L-page 15

24AA02/24LC02B/24FC02 er 1st Line Marking Codes b m u SOT-23 DFN TDFN SC-70 N art TSSOP MSOP UDFN I-Temp. E-Temp. I-Temp. E-Temp. I-Temp. E-Temp. I-Temp. E-Temp. P 24AA02 4A02 4A02T(1) — B2NN(2,3) — 221 — A21 — B5NN(2) — 24LC02B 4L02 4L2BT(1) — M2NN(2,3) N2NN(2,3) 224 225 A24 A25 B4NN(2) B6NN(2) 24FC02 AADQ 24FC02 ADN AAEVYY(4) AAEVYY(4) — — — — — — Note1: T = Temperature grade (I, E) 2: NN = Alphanumeric traceability code 3: These parts use the 1-line SOT-23 marking format 4: These parts use the 2-line SOT-23 marking format Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) e3 JEDEC® designator for Matte Tin (Sn) * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. Note: For very small packages with no room for the JEDEC® designator e 3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2007-2019 Microchip Technology Inc. DS20001709L-page 16

24AA02/24LC02B/24FC02 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:8)(cid:17)(cid:10)(cid:6)(cid:12)(cid:18)(cid:8)(cid:19)(cid:20)(cid:8)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:6)(cid:14)(cid:21)(cid:6)(cid:22)(cid:5)(cid:8)(cid:23)(cid:24)(cid:25)(cid:26)(cid:8)(cid:27)(cid:8)(cid:28)(cid:29)(cid:30)(cid:29)(cid:31) !(cid:8)""(cid:8)#(cid:20)(cid:7)$(cid:8)%(cid:15)(cid:17)(cid:19)& (cid:19)(cid:20)(cid:12)(cid:5)’ 2(cid:21)(cid:20)(cid:14)%(cid:22)(cid:13)(cid:14)&(cid:21) %(cid:14)(cid:19)!(cid:20)(cid:20)(cid:13)(cid:24)%(cid:14)(cid:10)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:13)(cid:14)"(cid:20)(cid:11))(cid:18)(cid:24)(cid:12) ’(cid:14)(cid:10)(cid:25)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)%(cid:22)(cid:13)(cid:14)(cid:17)(cid:18)(cid:19)(cid:20)(cid:21)(cid:19)(cid:22)(cid:18)(cid:10)(cid:14)(cid:30)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:18)(cid:24)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:19)(cid:18)$(cid:18)(cid:19)(cid:11)%(cid:18)(cid:21)(cid:24)(cid:14)(cid:25)(cid:21)(cid:19)(cid:11)%(cid:13)"(cid:14)(cid:11)%(cid:14) (cid:22)%%(cid:10)133)))(cid:28)&(cid:18)(cid:19)(cid:20)(cid:21)(cid:19)(cid:22)(cid:18)(cid:10)(cid:28)(cid:19)(cid:21)&3(cid:10)(cid:11)(cid:19)*(cid:11)(cid:12)(cid:18)(cid:24)(cid:12) D e b N N L K E E2 EXPOSEDPAD NOTE1 NOTE1 1 2 2 1 D2 TOPVIEW BOTTOMVIEW A NOTE2 A3 A1 4(cid:24)(cid:18)% (cid:17)(cid:27)55(cid:27)(cid:17),(cid:23),(cid:8)(cid:3) (cid:2)(cid:18)&(cid:13)(cid:24) (cid:18)(cid:21)(cid:24)(cid:14)5(cid:18)&(cid:18)% (cid:17)(cid:27)6 67(cid:17) (cid:17)(cid:7)8 6!&((cid:13)(cid:20)(cid:14)(cid:21)$(cid:14)(cid:30)(cid:18)(cid:24) 6 9 (cid:30)(cid:18)%(cid:19)(cid:22) (cid:13) (cid:4)(cid:28).(cid:4)(cid:14)/(cid:3)0 7(cid:31)(cid:13)(cid:20)(cid:11)(cid:25)(cid:25)(cid:14):(cid:13)(cid:18)(cid:12)(cid:22)% (cid:7) (cid:4)(cid:28)9(cid:4) (cid:4)(cid:28)(cid:6)(cid:4) (cid:29)(cid:28)(cid:4)(cid:4) (cid:3)%(cid:11)(cid:24)"(cid:21)$$(cid:14) (cid:7)(cid:29) (cid:4)(cid:28)(cid:4)(cid:4) (cid:4)(cid:28)(cid:4)(cid:15) (cid:4)(cid:28)(cid:4). 0(cid:21)(cid:24)%(cid:11)(cid:19)%(cid:14)(cid:23)(cid:22)(cid:18)(cid:19)*(cid:24)(cid:13) (cid:7)+ (cid:4)(cid:28)(cid:15)(cid:4)(cid:14)(cid:8),2 7(cid:31)(cid:13)(cid:20)(cid:11)(cid:25)(cid:25)(cid:14)5(cid:13)(cid:24)(cid:12)%(cid:22) (cid:2) (cid:15)(cid:28)(cid:4)(cid:4)(cid:14)/(cid:3)0 7(cid:31)(cid:13)(cid:20)(cid:11)(cid:25)(cid:25)(cid:14);(cid:18)"%(cid:22) , +(cid:28)(cid:4)(cid:4)(cid:14)/(cid:3)0 ,#(cid:10)(cid:21) (cid:13)"(cid:14)(cid:30)(cid:11)"(cid:14)5(cid:13)(cid:24)(cid:12)%(cid:22) (cid:2)(cid:15) (cid:29)(cid:28)+(cid:4) < (cid:29)(cid:28).. ,#(cid:10)(cid:21) (cid:13)"(cid:14)(cid:30)(cid:11)"(cid:14);(cid:18)"%(cid:22) ,(cid:15) (cid:29)(cid:28).(cid:4) < (cid:29)(cid:28)(cid:16). 0(cid:21)(cid:24)%(cid:11)(cid:19)%(cid:14);(cid:18)"%(cid:22) ( (cid:4)(cid:28)(cid:15)(cid:4) (cid:4)(cid:28)(cid:15). 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DS20001709L-page 17

24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc. DS20001709L-page 18

24AA02/24LC02B/24FC02 Note: For the mostcurrent package drawings,please seetheMicrochip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc. DS20001709L-page 19

24AA02/24LC02B/24FC02 Note: For the mostcurrent package drawings,please seetheMicrochip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc. DS20001709L-page 20

24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc. DS20001709L-page 21

24AA02/24LC02B/24FC02 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A A2 PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 22

24AA02/24LC02B/24FC02 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e e 2 2 e e Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A - - .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 - - Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB - - .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 23

24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A e e B 3 1 E1 E 2X 0.15 C 4 N NOTE 1 5X TIPS 0.30 C 2X 0.15 C 5X b 0.10 C A B TOP VIEW c C A A2 SEATING PLANE A1 L SIDE VIEW END VIEW Microchip Technology Drawing C04-061D Sheet 1 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 24

24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 5 Pitch e 0.65 BSC Overall Height A 0.80 - 1.10 Standoff A1 0.00 - 0.10 Molded Package Thickness A2 0.80 - 1.00 Overall Length D 2.00 BSC Exposed Pad Length D2 2.50 2.60 2.70 Overall Width E 2.10 BSC Exposed Pad Width E1 1.25 BSC Terminal Width b 0.15 - 0.40 Terminal Length L 0.10 0.20 0.46 Lead Thickness c 0.08 - 0.26 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-061D Sheet 2 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 25

24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (LT) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E Gx SILK SCREEN 3 2 1 C G 4 5 Y X RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.65 BSC Contact Pad Spacing C 2.20 Contact Pad Width X 0.45 Contact Pad Length Y 0.95 Distance Between Pads G 1.25 Distance Between Pads Gx 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2061B  2007-2019 Microchip Technology Inc. DS20001709L-page 26

24AA02/24LC02B/24FC02 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 1 2 e NX b B 0.25 C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X 0.10 C A1 SIDE VIEW h R0.13 h R0.13 H 0.23 L SEE VIEW C (L1) VIEW A–A VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 27

24AA02/24LC02B/24FC02 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 1.27 BSC Overall Height A - - 1.75 Molded Package Thickness A2 1.25 - - Standoff § A1 0.10 - 0.25 Overall Width E 6.00 BSC Molded Package Width E1 3.90 BSC Overall Length D 4.90 BSC Chamfer (Optional) h 0.25 - 0.50 Foot Length L 0.40 - 1.27 Footprint L1 1.04 REF Foot Angle 0° - 8° Lead Thickness c 0.17 - 0.25 Lead Width b 0.31 - 0.51 Mold Draft Angle Top 5° - 15° Mold Draft Angle Bottom 5° - 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 28

24AA02/24LC02B/24FC02 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 1.27 BSC Contact Pad Spacing C 5.40 Contact Pad Width (X8) X1 0.60 Contact Pad Length (X8) Y1 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B  2007-2019 Microchip Technology Inc. DS20001709L-page 29

24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A2 A 0.20 C SEATING PLANE A SEE SHEET 2 C A1 SIDE VIEW Microchip Technology Drawing C04-028D [OT] Sheet 1 of(cid:3)(cid:21)  2007-2019 Microchip Technology Inc. DS20001709L-page 30

24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c (cid:84) L L1 VIEW A-A SHEET 1 Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 6 Pitch e 0.95 BSC Outside lead pitch e1 1.90 BSC Overall Height A 0.90 - 1.45 Molded Package Thickness A2 0.89 - 1.30 Standoff A1 - - 0.15 Overall Width E 2.80 BSC Molded Package Width E1 1.60 BSC Overall Length D 2.90 BSC Foot Length L 0.30 - 0.60 Footprint L1 0.60 REF Foot Angle (cid:73) 0° - 10° Lead Thickness c 0.08 - 0.26 Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-091D [OT] Sheet 2 of(cid:3)(cid:21)  2007-2019 Microchip Technology Inc. DS20001709L-page 31

24AA02/24LC02B/24FC02 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.95 BSC Contact Pad Spacing C 2.80 Contact Pad Width (X5) X 0.60 Contact Pad Length (X5) Y 1.10 Distance Between Pads G 1.70 Distance Between Pads GX 0.35 Overall Width Z 3.90 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2091A [OT]  2007-2019 Microchip Technology Inc. DS20001709L-page 32

24AA02/24LC02B/24FC02 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C (A3) C A SEATING PLANE 8X A1 0.08 C SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 C A B 0.05 C BOTTOM VIEW Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 1 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 33

24AA02/24LC02B/24FC02 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.50 BSC Overall Height A 0.70 0.75 0.80 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 2.00 BSC Overall Width E 3.00 BSC Exposed Pad Length D2 1.35 1.40 1.45 Exposed Pad Width E2 1.25 1.30 1.35 Contact Width b 0.20 0.25 0.30 Contact Length L 0.25 0.30 0.45 Contact-to-Exposed Pad K 0.20 - - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 2 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 34

24AA02/24LC02B/24FC02 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 8 ØV C Y2 EV Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width X2 1.60 Optional Center Pad Length Y2 1.50 Contact Pad Spacing C 2.90 Contact Pad Width (X8) X1 0.25 Contact Pad Length (X8) Y1 0.85 Thermal Via Diameter V 0.30 Thermal Via Pitch EV 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing No. C04-129-MNY Rev. B  2007-2019 Microchip Technology Inc. DS20001709L-page 35

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DS20001709L-page 36

24AA02/24LC02B/24FC02 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2007-2019 Microchip Technology Inc. DS20001709L-page 37

24AA02/24LC02B/24FC02 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) E (DATUM B) NOTE 1 2X 0.10 C 1 2 2X 0.10 C TOP VIEW 0.10 C A1 C A SEATING PLANE 8X (A3) 0.08 C SIDE VIEW 0.10 C A B D2 e 2 1 2 0.10 C A B E2 K N L 8X b e 0.10 C A B 0.05 C BOTTOM VIEW Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 38

24AA02/24LC02B/24FC02 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Terminals N 8 Pitch e 0.50 BSC Overall Height A 0.50 0.55 0.60 Standoff A1 0.00 0.02 0.05 Terminal Thickness A3 0.152 REF Overall Length D 2.00 BSC Exposed Pad Length D2 1.40 1.50 1.60 Overall Width E 3.00 BSC Exposed Pad Width E2 1.20 1.30 1.40 Terminal Width b 0.18 0.25 0.30 Terminal Length L 0.35 0.40 0.45 Terminal-to-Exposed-Pad K 0.20 - - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2  2007-2019 Microchip Technology Inc. DS20001709L-page 39

24AA02/24LC02B/24FC02 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV G2 8 ØV C Y2 G1 Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units MILLIMETERS Dimension Limits MIN NOM MAX Contact Pitch E 0.50 BSC Optional Center Pad Width X2 1.60 Optional Center Pad Length Y2 1.40 Contact Pad Spacing C 2.90 Contact Pad Width (X8) X1 0.30 Contact Pad Length (X8) Y1 0.85 Contact Pad to Center Pad (X8) G1 0.20 Contact Pad to Contact Pad (X6) G2 0.33 Thermal Via Diameter V 0.30 Thermal Via Pitch EV 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-21355-Q4B Rev A  2007-2019 Microchip Technology Inc. DS20001709L-page 40

24AA02/24LC02B/24FC02 APPENDIX A: REVISION HISTORY Revision L (05/2019) Corrected Part Marking for UDFN package. Added note about exposed pad on the TDFN and UDFN packages. Revision K (11/2018) Added the 24FC02 device. Revision J (02/2009) Added TDFN Package; Updated Package Drawings. Revision H (08/2008) Added SC-70 Package; Updated Package Drawings. Revision G (03/2007) Replaced Package Drawings (Rev. AM). Revision F (01/2007) Revised Features section; Changed 1.8V to 1.7V in Tables and text; Revised Ambient Temperature, Section 1.0; Replaced Package Drawings; Revised Product ID section. Revision E Revised Figure 3-2 Control Byte Allocation; Figure 4-1 Byte Write; Figure 4-2 Page Write; Section 6.0 Write Protection; Figure 7-1 Current Address Read; Figure 7-2 Random Read; Figure 7-3 Sequential Read. Revision D Added DFN package. Revision C Corrections to Section 1.0, Electrical Characteristics.  2007-2019 Microchip Technology Inc. DS20001709L-page 41

24AA02/24LC02B/24FC02 NOTES:  2007-2019 Microchip Technology Inc. DS20001709L-page 42

24AA02/24LC02B/24FC02 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at Users of Microchip products can receive assistance www.microchip.com. This website is used as a means through several channels: to make files and information easily available to • Distributor or Representative customers. Accessible by using your favorite Internet • Local Sales Office browser, the website contains the following information: • Field Application Engineer (FAE) • Product Support – Data sheets and errata, appli- • Technical Support cation notes and sample programs, design resources, user’s guides and hardware support Customers should contact their distributor, representa- documents, latest software releases and archived tive or Field Application Engineer (FAE) for support. software Local sales offices are also available to help custom- • General Technical Support – Frequently Asked ers. A listing of sales offices and locations is included in Questions (FAQ), technical support requests, the back of this document. online discussion groups, Microchip consultant Technical support is available through the website program member listing at: http://microchip.com/support • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Micro- chip sales offices, distributors and factory repre- sentatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a spec- ified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Cus- tomer Change Notification” and follow the registra- tion instructions.  2007-2019 Microchip Technology Inc. DS20001709L-page 43

24AA02/24LC02B/24FC02 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) –X /XX Examples: Device Tape and Reel Temperature Package a) 24LC02BT-I/MC: Tape and Reel, Industrial Option Range Temperature, 2.5V, DFN package. b) 24LC02BT-I/MS: Tape and Reel, Industrial Device: 24AA02: = 1.7V, 2-Kbit I2C Serial EEPROM Temperature, 2.5V, MSOP package. 24LC02B: = 2.5V, 2-Kbit I2C Serial EEPROM c) 24AA02-I/P: Industrial Temperature, 1.7V, 24FC02: = 1.7V, High Speed, 2-Kbit I2C Serial EEPROM PDIP package. d) 24LC02BT-I/LT: Tape and Reel, Industrial Tape and Blank = Standard packaging (tube or tray) Temperature, 2.5V, SC-70 package. Reel Option: T = Tape and Reel(1) e) 24AA02-I/SN: Industrial Temperature, 1.7V, SOIC package. f) 24AA02T-I/OT: Tape and Reel, Industrial Temperature I = -40°C to +85°C (Industrial) Temperature, 1.7V, SOT-23 package. Range: E = -40°C to +125°C (Extended) g) 24AA02T-I/MNY: Tape and Reel, Industrial Temperature, 1.7V, TDFN package. Package: MC = Plastic Dual Flat, No Lead Package – h) 24AA02T-I/ST: Tape and Reel, Industrial 2x3x0.9 mm Body, 8-lead (DFN) Temperature, 1.7V, TSSOP package. MS = Plastic Micro Small Outline Package, 8-lead (MSOP) i) 24FC02-I/P: Industrial Temperature, 1.7V, P = Plastic Dual In-Line – 300 mil Body, 8-lead (PDIP) PDIP package. LT = Plastic Small Outline Transistor, 5-lead (SC-70) (Tape and Reel only) j) 24FC02T-I/MUY: Tape and Reel, Industrial SN = Plastic Small Outline - Narrow, 3.90 mm Body, 8-lead Temperature, 1.7V, UDFN package. (SOIC) OT = Plastic Small Outline Transistor, 5-lead (SOT-23) Note 1: Tape and Reel identifier only (Tape and Reel only) appears in the catalog part number MNY = Plastic Dual Flat, No Lead Package - 2x3x0.8 mm description. This identifier is used Body, 8-lead (TDFN) for ordering purposes and is not ST = Plastic Thin Shrink Small Outline – 4.4 mm, 8-lead printed on the device package. (TSSOP) Check with your Microchip Sales MUY = Plastic Dual Flat, No Lead Package - 2x3x0.6 mm Office for package availability with Body, 8-lead (UDFN) the Tape and Reel option. 2: Contact Microchip for Automotive grade ordering part numbers.  2007-2019 Microchip Technology Inc. DS20001709L-page 44

24AA02/24LC02B/24FC02 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, AnyRate, AVR, and may be superseded by updates. It is your responsibility to AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, ensure that your application meets with your specifications. CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, MICROCHIP MAKES NO REPRESENTATIONS OR JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, WARRANTIES OF ANY KIND WHETHER EXPRESS OR maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, IMPLIED, WRITTEN OR ORAL, STATUTORY OR OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip OTHERWISE, RELATED TO THE INFORMATION, Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, INCLUDING BUT NOT LIMITED TO ITS CONDITION, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered QUALITY, PERFORMANCE, MERCHANTABILITY OR trademarks of Microchip Technology Incorporated in the U.S.A. FITNESS FOR PURPOSE. Microchip disclaims all liability and other countries. arising from this information and its use. Use of Microchip ClockWorks, The Embedded Control Solutions Company, devices in life support and/or safety applications is entirely at EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, the buyer’s risk, and the buyer agrees to defend, indemnify and mTouch, Precision Edge, and Quiet-Wire are registered hold harmless Microchip from any and all damages, claims, trademarks of Microchip Technology Incorporated in the U.S.A. suits, or expenses resulting from such use. No licenses are Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any conveyed, implicitly or otherwise, under any Microchip Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, intellectual property rights unless otherwise stated. CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Microchip received ISO/TS-16949:2009 certification for its worldwide SQTP is a service mark of Microchip Technology Incorporated in headquarters, design and wafer fabrication facilities in Chandler and the U.S.A. Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures Silicon Storage Technology is a registered trademark of Microchip are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping Technology Inc. in other countries. devices, Serial EEPROMs, microperipherals, nonvolatile memory and GestIC is a registered trademark of Microchip Technology analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-4476-3  2007-2019 Microchip Technology Inc. DS20001709L-page 45

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