ICGOO在线商城 > 分立半导体产品 > 二极管 - 整流器 - 单 > 1PS74SB23,125
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1PS74SB23,125产品简介:
ICGOO电子元器件商城为您提供1PS74SB23,125由NXP Semiconductors设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 1PS74SB23,125价格参考¥1.07-¥3.46。NXP Semiconductors1PS74SB23,125封装/规格:二极管 - 整流器 - 单, 肖特基 表面贴装 二极管 25V 1A(DC) 6-TSOP。您可以下载1PS74SB23,125参考资料、Datasheet数据手册功能说明书,资料中有1PS74SB23,125 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | DIODE SCHOTTKY 25V 1A 6TSOP |
产品分类 | 单二极管/整流器 |
品牌 | NXP Semiconductors |
数据手册 | |
产品图片 | |
产品型号 | 1PS74SB23,125 |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | - |
不同If时的电压-正向(Vf) | 450mV @ 1A |
不同 Vr、F时的电容 | 100pF @ 4V,1MHz |
不同 Vr时的电流-反向漏电流 | 1mA @ 25V |
二极管类型 | |
供应商器件封装 | 6-TSOP |
其它名称 | 1PS74SB23 T/R |
包装 | 带卷 (TR) |
反向恢复时间(trr) | - |
安装类型 | 表面贴装 |
封装/外壳 | SC-74,SOT-457 |
工作温度-结 | 125°C (最大) |
标准包装 | 3,000 |
热阻 | * |
电压-DC反向(Vr)(最大值) | 25V |
电流-平均整流(Io) | 1A(DC) |
速度 | 快速恢复 =< 500 ns,> 200mA(Io) |
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D302 1PS74SB23 Schottky barrier diode Product specification 2003 Aug 04 Supersedes data of 2001 Aug 27
Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 FEATURES PINNING • Ultra fast switching speed PIN DESCRIPTION • Low forward voltage 1 anode • Fast recovery time 2 cathode • Guard ring protected 3 anode • Small plastic SMD package 4 anode • Capability of absorbing very high surge current. 5 cathode 6 anode APPLICATIONS • Rectification • Circuit protection • Polarity protection handbook, halfpage6 5 4 • Switched-mode power supplies. 1, 3, 2, 5 4, 6 DESCRIPTION 1 2 3 Planar Schottky barrier diode encapsulated in an SC-74 (SOT457) small plastic SMD package. Top view MAM421 Marking code: P1. Fig.1 Simplified outline SC-74 (SOT457) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V continuous reverse voltage - 25 V R I continuous forward current - 1 A F I non-repetitive peak forward current t =8.3ms; halfsinewave; - 25 A FSM p JEDECmethod; note1 I non-repetitive peak reverse current t =100m s - 0.5 A RSM p T storage temperature - 65 +150 (cid:176) C stg T junction temperature - 125 (cid:176) C j Note 1. Pins 1, 3, 4 and 6 are connected in parallel; pins 2 and 5 are connected in parallel. 2003Aug04 2
Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 ELECTRICAL CHARACTERISTICS T =25(cid:176) C unless otherwise specified. amb SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT V forward voltage I =100mA 260 300 mV F F I =1A 400 450 mV F I reverse current V =20V; note1; seeFig.3 80 500 m A R R V =25V; note1; seeFig.3 - 1 mA R C diode capacitance f=1MHz; V =4V; seeFig.4 100 - pF d R Note 1. Pulse test: t =300m s;d =0.02. p THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT R thermal resistance from junction to ambient note1 250 K/W thj-a Note 1. Refer to SC-74 (SOT457) standard mounting conditions. 2003Aug04 3
Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 GRAPHICAL DATA handbook1, 0h4alfpage MBL886 105 MHB970 handbook, halfpage IR (1) IF (m A) (mA) 104 (2) 103 (3) (1) 103 (2) 102 (3) (4) (4) 102 10 10 1 1 0 10 20 30 0 200 400 600 800 VR (V) (1) Tamb=125(cid:176)C. VF (mV) (1) Tamb=125(cid:176)C. (2) Tamb=100(cid:176)C. (2) Tamb=100(cid:176)C. (3) Tamb=75(cid:176)C. (3) Tamb=75(cid:176)C. (4) Tamb=25(cid:176)C. (4) Tamb=25(cid:176)C. Fig.2 Forward current as a function of forward Fig.3 Reverse current as a function of reverse voltage; typical values. voltage; typical values. 103 MBK571 handbook, halfpage Cd (pF) 102 10 0 10 20 VR (V) 30 f=1MHz; Tamb=25(cid:176)C. Fig.4 Diodecapacitanceasafunctionofreverse voltage; typical values. 2003Aug04 4
Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 PACKAGE OUTLINE Plastic surface mounted package; 6 leads SOT457 D B E A X y HE v M A 6 5 4 Q pin 1 index A A1 c 1 2 3 Lp e bp w M B detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp c D E e HE Lp Q v w y 1.1 0.1 0.40 0.26 3.1 1.7 3.0 0.6 0.33 mm 0.95 0.2 0.2 0.1 0.9 0.013 0.25 0.10 2.7 1.3 2.5 0.2 0.23 OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION 97-02-28 SOT457 SC-74 01-05-04 2003Aug04 5
Philips Semiconductors Product specification Schottky barrier diode 1PS74SB23 DATA SHEET STATUS DATA SHEET PRODUCT LEVEL DEFINITION STATUS(1) STATUS(2)(3) I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminarydata Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. Fordatasheetsdescribingmultipletypenumbers,thehighest-levelproductstatusdeterminesthedatasheetstatus. DEFINITIONS DISCLAIMERS Short-form specification(cid:190) The data in a short-form Life support applications(cid:190) These products are not specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or same type number and title. For detailed information see systems where malfunction of these products can the relevant data sheet or data handbook. reasonablybeexpectedtoresultinpersonalinjury.Philips Semiconductorscustomersusingorsellingtheseproducts Limitingvaluesdefinition(cid:190) Limitingvaluesgivenarein for use in such applications do so at their own risk and accordance with the Absolute Maximum Rating System agree to fully indemnify Philips Semiconductors for any (IEC60134). Stress above one or more of the limiting damages resulting from such application. values may cause permanent damage to the device. These are stress ratings only and operation of the device Right to make changes(cid:190) Philips Semiconductors attheseoratanyotherconditionsabovethosegiveninthe reserves the right to make changes in the products - Characteristicssectionsofthespecificationisnotimplied. including circuits, standard cells, and/or software - Exposure to limiting values for extended periods may described or contained herein in order to improve design affect device reliability. and/orperformance.Whentheproductisinfullproduction (status ‘Production’), relevant changes will be Application information(cid:190) Applications that are communicated via a Customer Product/Process Change described herein for any of these products are for Notification(CPCN).PhilipsSemiconductorsassumesno illustrative purposes only. Philips Semiconductors make responsibility or liability for the use of any of these norepresentationorwarrantythatsuchapplicationswillbe products, conveys no licence or title under any patent, suitable for the specified use without further testing or copyright, or mask work right to these products, and modification. makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003Aug04 6
Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax:+31402724825 For sales offices addresses send e-mail to:sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. Theinformationpresentedinthisdocumentdoesnotformpartofanyquotationorcontract,isbelievedtobeaccurateandreliableandmaybechanged without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613514/03/pp7 Date of release:2003Aug04 Document order number: 939775011055