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1PS70SB14 Dual Schottky barrier diode 17 December 2012 Product data sheet 1. General description Dual Planar Schottky barrier diode in series configuration with an integrated guard ring for stress protection, encapsulated in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Low forward voltage • Low capacitance • AEC-Q101 qualified 3. Applications • Ultra high-speed switching • Line termination • Voltage clamping • Reverse polarity protection 4. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode I forward current - - 200 mA F V reverse voltage - - 30 V R Per diode V forward voltage I = 10 mA; T = 25 °C - - 400 mV F F amb Scan or click this QR code to view the latest information for this product

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 A1 anode (diode1) 3 K1, A2 2 K2 cathode (diode2) A1 K2 3 K1, A2 cathode (diode1) and anode aaa-004973 (diode2) 1 2 SC-70 (SOT323) 6. Ordering information Table 3. Ordering information Type number Package Name Description Version 1PS70SB14 SC-70 plastic surface-mounted package; 3 leads SOT323 7. Marking Table 4. Marking codes Type number Marking code [1] 1PS70SB14 7%4 [1] % = placeholder for manufacturing site code 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode V reverse voltage - 30 V R I forward current - 200 mA F I repetitive peak forward current t ≤ 1 s; δ ≤ 0.5 - 300 mA FRM p I non-repetitive peak forward t < 10 ms; T = 25 °C - 600 mA FSM p j(init) current P total power dissipation T < 25 °C - 200 mW tot amb T junction temperature - 150 °C j T ambient temperature -55 150 °C amb 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 2 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode Symbol Parameter Conditions Min Max Unit T storage temperature -65 150 °C stg 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per device Rth(j-a) thermal resistance in free air [1] - - 625 K/W from junction to ambient [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 10. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit Per diode V forward voltage I = 0.1 mA; T = 25 °C - - 240 mV F F amb I = 1 mA; T = 25 °C - - 320 mV F amb I = 10 mA; T = 25 °C - - 400 mV F amb I = 30 mA; T = 25 °C - - 500 mV F amb I = 100 mA; T = 25 °C - - 800 mV F amb I reverse current V = 25 V; pulsed; t = 300 µs; - - 2 µA R R p δ = 0.02 ; T = 25 °C amb C diode capacitance V = 1 V; f = 1 MHz; T = 25 °C - - 10 pF d R amb 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 3 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode 103 006aac829 103 aaa-004515 IF (3) IR (1) (mA) (1) (µA) (2) 102 102 (2) 10 10 (1) (2) (3) 1 1 (3) 10-1 10-1 0.0 0.4 0.8 1.2 0 10 20 30 VF (V) VR (V) (1) T = 125 °C (1) T = 125 °C amb amb (2) T = 85 °C (2) T = 85 °C amb amb (3) T = 25 °C (3) T = 25 °C amb amb Fig. 1. Forward current as a function of forward Fig. 2. Reverse current as a function of reverse voltage; typical values voltage; typical values 006aac891 10 Cd (pF) 8 6 4 2 0 0 10 20 30 VR (V) T = 25 °C; f = 1 MHz amb Fig. 3. Diode capacitance as a function of reverse voltage; typical values 11. Test information 11.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 4 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode 12. Package outline 2.2 1.1 1.8 0.8 3 0.45 0.15 2.2 1.35 2.0 1.15 1 2 0.4 0.25 0.3 0.10 1.3 Dimensionsinmm 04-11-04 Fig. 4. Package outline SC-70 (SOT323) 13. Soldering 2.65 1.85 1.325 solderlands 2 solderresist 2.35 0.6 3 1.3 solderpaste (3×) 0.5 occupiedarea 1 (3×) Dimensionsinmm 0.55 (3×) sot323_fr Fig. 5. Reflow soldering footprint for SC-70 (SOT323) 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 5 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode 4.6 2.575 1.425 (3×) solderlands solderresist occupiedarea 3.65 2.1 1.8 Dimensionsinmm preferredtransport 09 directionduringsoldering (2×) sot323_fw Fig. 6. Wave soldering footprint for SC-70 (SOT323) 14. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes 1PS70SB14 v.2 20121217 Product data sheet - 1PS70SB10_14_15_16 v.1 Modifications: • The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Sections 1 to 3 updated • Section 4 "Quick reference data" added • Section 6 "Ordering information" added • Section 7 "Marking" updated • Table 5 "Limiting values": ambient temperature T and junction temperature T updated amb j • Figues 1, 2 and 3 updated • Section 11 "Test information" added • Figure 4: superseded by minimized package outline drawing • Section 13 "Soldering" added • Section 14 "Legal information" updated 1PS70SB10_14_15_16 19990426 Product data sheet - - v.1 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 6 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - 15. Legal information lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 15.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance Document Product Definition with the Terms and conditions of commercial sale of NXP Semiconductors. status [1][2] status [3] Objective Development This document contains data from Right to make changes — NXP Semiconductors reserves the right to [short] data the objective specification for product make changes to information published in this document, including without sheet development. limitation specifications and product descriptions, at any time and without Preliminary Qualification This document contains data from the notice. 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NXP Semiconductors and its suppliers accept no liability for [3] The product status of device(s) described in this document may have inclusion and/or use of NXP Semiconductors products in such equipment or changed since this document was published and may differ in case of applications and therefore such inclusion and/or use is at the customer's own multiple devices. The latest product status information is available on risk. the Internet at URL http://www.nxp.com. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 15.2 Definitions Applications — Applications that are described herein for any of these Preview — The document is a preview version only. The document is still products are for illustrative purposes only. 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NXP does not accept any liability in this respect. data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and Limiting values — Stress above one or more limiting values (as defined in customer have explicitly agreed otherwise in writing. In no event however, the Absolute Maximum Ratings System of IEC 60134) will cause permanent shall an agreement be valid in which the NXP Semiconductors product damage to the device. Limiting values are stress ratings only and (proper) is deemed to offer functions and qualities beyond those described in the operation of the device at these or any other conditions above those Product data sheet. given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 15.3 Disclaimers Terms and conditions of commercial sale — NXP Semiconductors Limited warranty and liability — Information in this document is believed products are sold subject to the general terms and conditions of commercial to be accurate and reliable. However, NXP Semiconductors does not give sale, as published at http://www.nxp.com/profile/terms, unless otherwise any representations or warranties, expressed or implied, as to the accuracy agreed in a valid written individual agreement. In case an individual or completeness of such information and shall have no liability for the agreement is concluded only the terms and conditions of the respective consequences of use of such information. NXP Semiconductors takes no agreement shall apply. NXP Semiconductors hereby expressly objects to responsibility for the content in this document if provided by an information applying the customer’s general terms and conditions with regard to the source outside of NXP Semiconductors. purchase of NXP Semiconductors products by customer. 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 7 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 8 / 9

NXP Semiconductors 1PS70SB14 Dual Schottky barrier diode 16. Contents 1 General description ...............................................1 2 Features and benefits ............................................1 3 Applications ...........................................................1 4 Quick reference data .............................................1 5 Pinning information ...............................................2 6 Ordering information .............................................2 7 Marking ...................................................................2 8 Limiting values .......................................................2 9 Thermal characteristics .........................................3 10 Characteristics .......................................................3 11 Test information .....................................................4 11.1 Quality information ......................................... 12 Package outline .....................................................5 13 Soldering ................................................................5 14 Revision history .....................................................6 15 Legal information ...................................................7 15.1 Data sheet status .................................................7 15.2 Definitions .............................................................7 15.3 Disclaimers ...........................................................7 15.4 Trademarks ..........................................................8 © NXP B.V. 2012. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 17 December 2012 1PS70SB14 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved Product data sheet 17 December 2012 9 / 9

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