ICGOO在线商城 > 连接器,互连器件 > FFC,FPC(扁平柔性)连接器 > 0541324562
数量阶梯 | 香港交货 | 国内含税 |
+xxxx | $xxxx | ¥xxxx |
查看当月历史价格
查看今年历史价格
0541324562产品简介:
ICGOO电子元器件商城为您提供0541324562由Molex设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 0541324562价格参考。Molex0541324562封装/规格:FFC,FPC(扁平柔性)连接器, 45 位置 FFC,FPC 连接器 触点,底部 0.020"(0.50mm) 表面贴装,直角。您可以下载0541324562参考资料、Datasheet数据手册功能说明书,资料中有0541324562 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
3D型号 | http://www.molex.com/pdm_docs/stp/54132-4562_stp.zip |
产品目录 | |
描述 | CONN FPC/FPC .5MM 45POS R/A SMD |
产品分类 | |
FFC,FCB厚度 | 0.30mm |
品牌 | Molex Connector Corporation |
数据手册 | |
产品图片 | |
产品型号 | 0541324562 |
rohs | 无铅 / 符合限制有害物质指令(RoHS)规范要求 |
RoHS指令信息 | |
产品系列 | 54132 |
其它名称 | WM8850CT |
包装 | 剪切带 (CT) |
外壳材料 | 聚酰胺(PA46),尼龙 4/6,玻璃纤维增强型 |
安装类型 | 表面贴装,直角 |
工作温度 | -20°C ~ 85°C |
扁平柔性类型 | FFC, FPC |
材料可燃性等级 | UL94 V-0 |
板上高度 | 0.079"(2.00mm) |
标准包装 | 1 |
特性 | 固定焊尾,零插入力(ZIF) |
电缆端类型 | 直形, 锥形 |
端接 | |
致动器材料 | 聚苯硫醚(PPS), 玻璃纤维增强型 |
触头材料 | 磷青铜 |
触头镀层 | 金 |
连接器/触头类型 | 触点, 底部 |
针脚数 | 45 |
锁定功能 | 滑锁 |
间距 | 0.020"(0.50mm) |
额定电压 | 50V |
额定电流 | 0.5A |
10 9 8 7 6 5 4 3 2 1 F F E E D D SCALE 8:1 C C 30.5 29.3 25.65 24.5 54132-5062 50 28.0 26.8 23.15 22.0 54132-4562 45 27.0 25.8 22.15 21.0 54132-4362 43 25.5 24.3 20.65 19.5 54132-4062 40 24.5 23.3 19.65 18.5 54132-3862 38 23.5 22.3 18.65 17.5 54132-3662 36 23.0 21.8 18.15 17.0 54132-3562 35 5 22.5 21.3 17.65 16.5 54132-3462 34 22.0 20.8 17.15 16.0 54132-3362 33 21.5 20.3 16.65 15.5 54132-3262 32 B B 20.5 19.3 15.65 14.5 54132-3062 30 EMBOSSED TAPE ORDER No. オーダー番号 2.27 CONNECTOR SERIES NO. : 54132-**68 THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE CURRENT REV DESC: GENERAL TOLERANCES mm 5:1 (UNLESS SPECIFIED) GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ± 0.2 EC NO: 600082 0.5 FPC CONN. ZIF SMT ANGULAR TOL ± 3.0 ° DRWN: YCHEN128 2018/03/02 R/A BOTTOM CONTACT NI-BARRIER GOLD PLATING 10 OVER 30 UNDER ± 0.25 4 PLACES ± 0.2 CHK'D: KTAKAHASHI 2018/03/14 A 3A0N G OUVLEARR ± 3 ° ± 0.3 32 PPLLAACCEESS ±± 00.2.35 AINPITPIRA:L RNEUVKIISTIAON: 2018/03/14 DOCUMENT NUM PBERRODUCT CUSTOMER DDORC ATYWPEIDNOGC PARTREVISION A 1 PLACE ± DRWN: MUMEDA 2004/10/08 DRAFT WHERE APPLICABLE SD-54132-064 PSD 001 G 0 PLACES ± APPR: NUKITA 2004/10/14 MUST REMAIN DRAFT WHERE APPLICABLE THIRD ANGLE PROJECTION DRAWING SERIES MATERIAL NUMBER CUSTOMER SHEET NUMBER DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:51 WITHIN DIMENSIONS WITMHUINS TD IRMEEMNASIINONS A3-SIZE 54132 SEE TABLE GENERAL MARKET 1 OF 3 FROERVIMSAIOTN: m: Has1ter-tb0-prod-A3 9 8 7 6 5 4 3 2 1 DATE: 2018/01/18
10 9 8 7 6 5 4 3 2 1 F F 注記NOTES 3.3 0.5(N-1)±0.05 3.3 1.使用材料 MATERIAL ハウジング : 46ナイロン、ガラス充填、UL94V-0、白 0.9 2.4 HOUSING:PA46,GLASS FILLED,UL94V-0,WHITE アクチュエータ:ポリフェニレンサルファイド(PPS)、ガラス充填、UL94V-0、黒 2.4 0.9 0.8 ACTUATOR:POLYPHENYLENE SULFIDE,GLASS FILLED,UL94V-0,BLACK (0.3) ターミナル : リン青銅(t=0.2) 金メッキ コンタクト部 0.1 MICROMETER MINIMUM (公差非累積) 0.5±0.05 (NON-ACCUMULATIVE) テール部 0.05 MICROMETER MINIMUM (ピッチ) (0.3) (0.17) ニッケル下地 1.0 MICROMETER MINIMUM (PITCH) 0.8 ) E 3 TERMINAL PHOS-BRONZE GOLD-PLATING E . P 0 ( CONTACT PORTION : 0.1 MICROMETER MINIMUM TAIL PORTION : 0.05 MICROMETER MINIMUM 2 . NICKEL PLATING : 1.0 MICROMETER MINIMUM 1 金具 : リン青銅(t=0.2) 錫メッキ 1.0~3.0 MICROMETER MINIMUM 9 ) 0. 13 ニッケル下地 1.0~3.0 MICROMETER MINIMUM . 2 FITTING NAIL : PHOS-BRONZE TIN-PLATING 1.0~3.0 MICROMETER MINIMUM ( 4 OVER NICKEL 1.0~3.0 MICROMETER MINIMUM . 2 2.エンボステープ梱包時はアクチュエータがロックした状態とする。 8 . 0 IN THE PACKAGE, ACTUATOR OF PART NO.54132-**68 SHOULD BE LOCKED. 4) 3 ソルダーテール半田付け面のズレ量、および金具半田付け面のズレ量は D 9 基準面 H に対し上方向 0.1MAXIMUM、下方向 0.15MAXIMUMとする。 D . 0 コネクタ位置 ( MISALIGNMENT OF SOLDER TAILS AND FITTING NAILS FROM DATUM-H CONNECTOR POSITION 参考基板レイアウト UPPER DIRECTION : 0.1MAXIMUM, LOWER DIRECTION : 0.15 MAXIMUM. RECOMMENDED P.W.BOARD PATTERN DIMENSION(REF.) 4 偶数極に適用。 APPLY FOR EVEN CIRCUIT. (マウント面) パターンはく離止め金具。 5 (MOUNTING SIDE) FITTING NAIL FOR PREVENTION OF PEELING OF P.W.BOARD PATTERN. 6.本製品は54132-**61に対するニッケルバリア品になります。 THIS PRODUCT IS NICKEL-BARRIER OF 54132-**61. 0.35MAX. 7.ELV & RoHS適合品。 . C パターンおよび AX ELV AND RoHS COMPLIANT. C 半田禁止エリア M PATTERN 5 KEEPING OUT AREA 4 OF PATTERN AND 1. 3) SOLDERING . 0 ( . N I ) M 3 5 0. 1 ( 3. BOARD R0.3 (0.17) B (FROM PATTERN EDGE) B 金具パターンエリア VIEW R R SOLDERING AREA (DETAIL OF FITTING NAIL OF FITTING NAIL ON PATTERN) DETAIL P THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE CURRENT REV DESC: GENERAL TOLERANCES mm 8:1 (UNLESS SPECIFIED) GENERAL TOLERANCES (UNLESS SPECIFIED) 10 UNDER ± 0.2 EC NO: 600082 0.5 FPC CONN. ZIF SMT ANGULAR TOL ± 3.0 ° DRWN: YCHEN128 2018/03/02 R/A BOTTOM CONTACT NI-BARRIER GOLD PLATING 10 OVER 30 UNDER ± 0.25 4 PLACES ± 0.2 CHK'D: KTAKAHASHI 2018/03/14 A 3A0N G OUVLEARR ± 3 ° ± 0.3 32 PPLLAACCEESS ±± 00.2.35 AINPITPIRA:L RNEUVKIISTIAON: 2018/03/14 DOCUMENT NUM PBERRODUCT CUSTOMER DDORC ATYWPEIDNOGC PARTREVISION A 1 PLACE ± DRWN: MUMEDA 2004/10/08 DRAFT WHERE APPLICABLE SD-54132-064 PSD 001 G 0 PLACES ± APPR: NUKITA 2004/10/14 MUST REMAIN DRAFT WHERE APPLICABLE THIRD ANGLE PROJECTION DRAWING SERIES MATERIAL NUMBER CUSTOMER SHEET NUMBER DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:51 WITHIN DIMENSIONS WITMHUINS TD IRMEEMNASIINONS A3-SIZE 54132 SEE TABLE GENERAL MARKET 2 OF 3 FROERVIMSAIOTN: m: Has1ter-tb0-prod-A3 9 8 7 6 5 4 3 2 1 DATE: 2018/01/18
9 8 7 6 5 4 3 2 1 0.3±0.03 0.3±0.03 E E 仕上がり厚さ 仕上がり厚さ THICKNESS THICKNESS 0.5±0.05 (ピッチ) (PITCH) MIN. N.強板BOARD) m) -5μm) -5μm) 2μm) ル(1-5μm) R(1-5μm) D 3.5 5.5MI補(STIFFENER き:金めっき(0.2μ 下地ニッケル(1GOLD(0.2μm) NICKEL UNDER(1 っき:金めっき(0. 下地ニッケG: GOLD(0.2μm)NICKEL UNDE D っ G: め TIN め N A 適合金めっきFPC推奨寸法 適合金めっきFFC推奨寸法 TI L A P APPLICABLE FPC OF GOLD PLATING APPLICABLE FFC OF GOLD PLATING L P RECOMMENDED DIMENSION RECOMMENDED DIMENSION (仕上がり厚さ : 0.3±0.03 ) (仕上がり厚さ : 0.3±0.03 ) CB (THICKNESS : 0.3±0F . 0打RP3CE ち C /)F抜OFMCきにM方Eつ向NいDはてE導D :体 P側UNかCらHE補R強 D板IR側ECをT推IO(奨TNHいICたKしNEまSSす :。 0.3±0.03 ) 補強板:ポリイミドREINFORCE BOARD: POLYMIDE熱硬化接着剤THERMOSETTING ADHESIVE ベースフィルム:ポリイミド(25μm)BASE FILM: POLYIMIDE(25μm)熱硬化接着剤THERMOSETTING ADHESIVE導体部: 銅箔(35か50μm)COPPER FOIL (35 or 50μm)熱硬化接着剤THERMOSETTING ADHESIVE カバーレイ : ポリイミド(25μm)COVER FILM: POLYIMIDE(25μm) 補強板:ポリエステル系REINFORCE BOARD: PET 接着剤(難燃ポリエステル系)ADHESIVE(FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ:ポリエステル系(25μm)INSULATING FILM: PET(25μm) 接着剤(難燃ポリエステル系)ADHESIVE(FLAME-RETARDANT POLYESTER ADHESIVE) 導体部: 銅箔(35μmか50μm)COPPER FOIL (35μm or 50μm) 接着剤(難燃ポリエステル系)ADHESIVE(FLAME-RETARDANT POLYESTER ADHESIVE) 絶縁テープ:ポリエステル系(25μm)INSULATING FILM: PET(25μm) CB FROM CONDUCTOR SIDE TO STIFFENER BOARD SIDE. FPC構成推奨仕様 FFC構成推奨仕様 STRUCTURE OF FPC STRUCTURE OF FFC THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION DIMENSION UNITS SCALE CURRENT REV DESC: GENERAL TOLERANCES mm 8:1 (UNLESS SPECIFIED) GENERAL TOLERANCES (UNLESS SPECIFIED) A 10 UNDER ± 0.2 EC NO: 600082 0.5 FPC CONN. ZIF SMT A ANGULAR TOL ± 3.0 ° DRWN: YCHEN128 2018/03/02 R/A BOTTOM CONTACT NI-BARRIER GOLD PLATING 10 OVER 30 UNDER ± 0.25 4 PLACES ± 0.2 CHK'D: KTAKAHASHI 2018/03/14 30 OVER ± 0.3 3 PLACES ± 0.25 APPR: NUKITA 2018/03/14 PRODUCT CUSTOMER DRAWING ANGULAR ± 3 ° 2 PLACES ± 0.3 INITIAL REVISION: DOCUMENT NUMBER DOC TYPEDOC PARTREVISION 1 PLACE ± DRWN: MUMEDA 2004/10/08 DRAFT WHERE APPLICABLE SD-54132-064 PSD 001 G 0 PLACES ± APPR: NUKITA 2004/10/14 MUST REMAIN DRAFT WHERE APPLICABLE THIRD ANGLE PROJECTION DRAWING SERIES MATERIAL NUMBER CUSTOMER SHEET NUMBER DOCUMENT STATUS P1 RELEASE DATE 2018/03/14 07:58:51 WITHIN DIMENSIONS WITMHUINS TD IRMEEMNASIINONS A3-SIZE 54132 SEE TABLE GENERAL MARKET 3 OF 3 FROERVIMSAIOTN: m: Haster-tb-prod-A3 9 8 7 6 5 4 3 2 1 DATE: 2018/01/18
None
None