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0402ESDA-MLP7产品简介:
ICGOO电子元器件商城为您提供0402ESDA-MLP7由Bussmann/Cooper设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 0402ESDA-MLP7价格参考。Bussmann/Cooper0402ESDA-MLP7封装/规格:TVS - 混合技术, 。您可以下载0402ESDA-MLP7参考资料、Datasheet数据手册功能说明书,资料中有0402ESDA-MLP7 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | SUPPRESSOR ESD 30VDC 0402 SMDESD 抑制器 ESD 30VDC 0402 SMD SUPPRESSOR |
产品分类 | |
品牌 | Eaton Bussmann |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | Bussmann / Eaton 0402ESDA-MLP7PolySurg |
数据手册 | |
产品型号 | 0402ESDA-MLP7 |
PCN设计/规格 | |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=25389 |
产品目录绘图 | |
产品目录页面 | |
产品种类 | ESD 抑制器 |
供应商器件封装 | 0402 |
其它名称 | 283-2792-6 |
功率(W) | - |
包装 | Digi-Reel® |
单位重量 | 453.592 mg |
商标 | Bussmann / Eaton |
封装 | Reel |
封装/外壳 | 0402(1005 公制) |
封装/箱体 | 0402 (1005 metric) |
工作温度范围 | - 55 C to + 125 C |
工作电压 | 30 VDC |
工厂包装数量 | 10000 |
应用 | 通用 |
技术 | - |
标准包装 | 1 |
特色产品 | http://www.digikey.com/cn/zh/ph/cooperbussmann/mlp.html |
电压-工作 | 30V |
电压-箝位 | 35V |
电容 | 0.05 pF |
电路数 | 1 |
端接类型 | Solder Pad |
钳位电压 | 35 V |
零件号别名 | 0402ESDA-MLP7 |
Effective August 2017 Technical Data 0402-MLP Supersedes March 2007 0402ESDA-MLP ESD suppressor 0 1 Applications 0 • ESD port protection fo2r mobile/smart phones • Game console ESD port protection • High speed ESD, data port protection • Set-top-boxes1 • Tablets, no tebooks, netboo ks, laptops • High defeinition television (HDTV) . • Mednia players d 7 • Duigital cameras e 6 • Medical equipment s Surface Mount Device J• Computers eantd peripherals ESiD port protection 3 4 e • Consumler electronics t e n # Product features v Ordpering Informatioen i t • Ultra-low capacitance (0.05 pF typ.) ideal fcort high e Catalog Numbm er e Packaging speed data applications e d e10,000 pieces in paper tape on • Provides ESD protection with fast response time 0402ESeDA-MLP7 (<1 ns) allowing equipment to passf IEC 61000-4-2 h 7" (178mm) reel f s c level 4 test e i a0402ESDA-MLP8 s 2,500 pieces in paper tape on • Sfleinxgibleil-iltiyne, bi-directionald d evice for placemeyn t pl a 7" (178mm) reel • Low profile 0402/1005 design for boardr space t e o e a savings • Low leakage cururent (<0.1 nA typt.) reduces powerr d n consumptionn d e 1 i e t Electrnical Charactevristics d P n o L n i Notes: cCharacteristi c e ValueM 1.Per IEC61000-4-2, Level 4 waveform (8 kV direct, 30 A) l s i measured 30ns after initiation of pulse. Di Rated Vnotltage m A3-0 VDC maximum 2.(TTrLigPg)e mr metehaosdu.rement made using Transmission Line Pulse Clamping Voltage1 35 V typical u m D 3.Minor shifting in characteristics may be observed over Trigger Voltage2 300 V typical multiple ESD pulses at very rapid rate. rCapacitance (@o1 MHz) S 0.05 pF typ., 0.15 pF max. o c Attenuation Change (0-6 EGHz) -0.2 dB typical e LeaRkage Current (@212 VDC) <0.1 nA typical ESD Capability 0 IEC610004-4-2 Direct Discharge 8 kV typical IEC610000-4-2 Air Discharge 15 kV typical ESD Pulse Withstand1 >1000 typical
Technical Data 0402-MLP 0402ESDA-MLP Effective August 2017 ESD suppressor Product Dimensions: mm [inches] Solder Pad Recommendation: mm [inches] 2.20 0.70 0 1 0 0.40 2 Design Considerations , 1 The location in the circuit for the MLP family has to be carefully determined. For bette r performance, th e device should be placed e as close to the signal input as possible and ahead of any other component. Due to the high curren.t associated with an ESD n d 7 event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad dire ctly on common u e 6 ground). s J t 3 e i 4 Environmental Specifications: e l t e n # •Load Humidity: 12VDC per EIA/IS-772 Para. 4.4.2, +85°C, 85v% RH for 1000p hours e •Thermal Shock: EIA/IS-722 Para 4.6, Air to Air -55°C to +1i25°C, 5 cycles t •Moisture Resistance Test: MIL-STD-202G Method 106Gc,t 10 cycles e m e •Mechanical Shock: EIA/IS-722 Para. 4.9 e d e e •Vibration: EIA/IS-722 Para. 4.10 f h •Resistance to Solvent: EIA/IS-722 Para. 4.11f s c s e i a •Operating & Storage Temperature Range: -55°C to +125° C y l a d p Soldering Recommendations r t e o e a •Compatible with lead and lead-ufree solder reflotw processes r d •Peak reflow temperatures annd durations: n d •IR Reflow = 260°C max for 10 seec. max. 1 i e •Wave Soldnert = 260°C max. vfor 10 sec. max. P d •Recommended IR Reflow Profile:n o L n i c e M l s i t m - Di n A u m D r o S o c E e R 2 0 4 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written 0 approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 0402-MLP BU- All other trademarks are property SB09615 of their respective owners. August 2017