Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination 157T Series – Standard Nano2® Fuse and Clip Assembly RoHS PS E Description The 157T Series Fuse/Clip assembly is a small, square, Time-Lag, surface mount fuse that is assembled in surface mountable fuse clips. The unique time delay feature of this fuse design helps solve the problem of nuisance “opening” by accommodating inrush currents that normally cause a fast acting fuse to open. The fuse clip and pre-installed fuse combination can be automatically placed in PC Board in one efficient manufacturing operation. It permits quick and easy replacement of fuses without performing desoldering process, even in the field and without exposing the PC Board to detrimental effects of rework solder heat. Agency Approvals Features AGENCY AGENCY FILE NUMBER AMPERE RANGE • Surface Mountable, • Easily replaceable on PC Time-Lag Fuse. Board (Field Replaceable) E14721 0.375A ~ 5A • Fully compatible with • RoHS Compliant and RoHS/Pb-Free solder Halogen-free PS NBK030205-E10480B 1A - 5A E alloys and higher • Available in ratings of temperature profiles 0.375 ~ 5 Amperes. associated with leadfree Electrical Characteristics for Series assembly. % of Ampere % of Ampere Opening Time at 25ºC Applications Rating Rating 100% 0.375A ~ 5A 4 hours, Minimum • Instrumentations • Telecommunications 1 sec. Minimum, • Base Stations 200% 0.375A ~ 5A 60 secs. Maximum 0.20 secs. Minimum, Additional Information 300% 0.375A ~ 5A 3.00 secs. Maximum 0.02 secs. Minimum, 800% 0.375A ~ 5A 0.10 secs. Maximum Datasheet Resources Samples Electrical Specifications by Item Interrupting Nominal Cold Nominal Agency Approvals Ampere Amp Max Voltage Fuse Rating Resistance Melting Rating (A) Code Rating (V) (A) Furnished (Ohms) I2t (A2sec) PES 0.375 .375 125 0454.375 1.2214 0.101 X 0.500 .500 125 0454.500 0.7047 0.240 X 0.750 .750 125 0454.750 0.3602 0.904 X 1.00 001 125 0454001. 0.2245 1.98 X X 1.50 01.5 125 045401.5 0.0934 3.65 X X 2.00 002 125 50A @ 125VAC/VDC 0454002. 0.0629 8.20 X X 2.50 02.5 125 045402.5 0.0452 15.0 X X 3.00 003 125 0454003. 0.0342 20.16 X X 3.50 03.5 125 045403.5 0.0226 26.53 X X 4.00 004 125 0454004. 0.0188 34.40 X X 5.00 005 125 0454005. 0.0138 53.72 X X 1. Cold resistance measured at less than 10% of rated current at 23ºC. 2. I2t values stated for 8ms opening time. 3. Agency Approval Table Key: X=Approved or Certified, P=Pending and Blank=Not Approved 4. Have special electrical characteristic needs? Contact Littelfuse to learn more about application specific options © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Application testing is strongly recommended. Revised: 05/20/15

Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination Temperature Re-rating Curve Average Time Current Curves 100 .375A .50A .75A1.0A1.5A 2.0A2.5A3.0A3.5A4A5A 10 S D N O C E S N 1 E I M TI 0.1 Note: 0.01 1. Rerating depicted in this curve is in addition to the standard derating of 25% for continuous operation. 0.001 0.1 1 10 100 CURRENT IN AMPS Soldering Parameters Reflow Condition Pb – Free assembly t P T - Temperature Min (Ts(min)) 150°C P Ramp-up CriTtiLc taol ZToPne Pre Heat - Temperature Max (Ts(max)) 200°C TL t - Time (Min to Max) (t) 60 – 120 secs eT L s ru S(max) Average ramp up rate (Liquidus Temp ta 5°C/second max r Ramp-down (TL) to peak ep Preheat mT TS(max) to TL - Ramp-up Rate 5°C/second max eT S(min) tS - Temperature (T) (Liquidus) 217°C Reflow L - Temperature (t) 60 – 90 seconds 25 L time to peak temperature Time Peak Temperature (T ) 250+0/-5 °C (t 25ºC to peak) P Time within 5°C of actual peak 20 – 40 seconds Temperature (t ) p Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T ) 8 minutes Max. P Do not exceed 260°C © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/15

Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination Product Characteristics Operating Body: Ceramic -55ºC to 125ºC with proper derating Temperature Materials Cap: For 0.375A ~ 5A – Silver plated Brass Clip Plating: Matte Tin MIL-STD-202, Method 107, Thermal Shock Test Condition B Product Body: Brand Logo, Current Rating, “T” for (5 cycles -65ºC to +125ºC) Marking Time-Lag MIL-STD-202, Method 201 Vibration (10-55 Hz) Force applied at fuse center, perpendicular to Clip Retention the long axis (@0.75 lbs. MIN) MIL-STD-202, Method 106, Moisture Resistance 10 cycles MIL-STD-202, Method 208 / IPC/ EIA / Solderability JEDEC J-STD-002, Test Condition A Salt Spray/ MIL-STD-202, Method 101, Test Condition B (48 hrs.), 5% NaCl in Humidity Test MIL –STD-202, Method 103 @ 85ºC / 85%RH, Atmosphere De-ionized Water 1000 hours MIL-STD-202, Method 213, Resistance to Shock Test Condition I (100 G’s peak for 6 MIL-STD-202, Method 215 (3 solvent types) Solvents milliseconds) Dimensions Part Numbering System 6.50 ± 0.20 [0.256] 6.10 0157 005. D R T [0.240] [02..16096] SERIES TIME-LAG FUSE LF T 3 .[70 .±1 406.1]3 [02..16096] 1 A PACKING OPTION AMP CODE R = Tape and Reel [01..04557] [03..17406] QUANTITY CODE D = 1500 pcs 3.9[00. 1±5 04.]13 [03..14304] Packaging 2.[500.0 ±9 80].2 Packaging Packaging Quantity Quantity & Option Specification Packaging Code "A" "B" 0.10 Tape and Reel Surface Mount 1500 DRT 7.26 [0.29] 2.46 [03..1020] [0.10] 2.40 [0.09] PCB Recommendation for Thermal Management 1. Minimum Copper Layer Thickness = 100um 2. Minimum Copper Trace Width = 10mm Note: Alternate methods of thermal management may be used. In such cases, under normal operations, the maximum temperature of the fuse body should not exceed 80ºC in a 25ºC ambient environment. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/15