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0157.750DRT产品简介:
ICGOO电子元器件商城为您提供0157.750DRT由Littelfuse设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供0157.750DRT价格参考以及Littelfuse0157.750DRT封装/规格参数等产品信息。 你可以下载0157.750DRT参考资料、Datasheet数据手册功能说明书, 资料中有0157.750DRT详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
品牌 | Littelfuse |
产品目录 | |
描述 | 表面贴装式保险丝 260V .750A SMF NANO CLIP SB |
产品分类 | |
产品手册 | |
产品图片 | |
rohs | 符合RoHS |
产品系列 | 表面贴装式保险丝,Littelfuse 0157.750DRT |
mouser_ship_limit | 该产品可能需要其他文件才能进口到中国。 |
产品型号 | 0157.750DRT |
中断额定值 | 50 Amps |
产品 | Surface Mount Fuses |
产品种类 | 表面贴装式保险丝 |
产品类型 | Surface Mount Fuse with Fuse Holder |
保险丝大小/组 | NANO |
保险丝类型 | Time Delay / Slow Blow |
商标 | Littelfuse |
外壳宽度 | 2.69 mm |
外壳长度 | 6.1 mm |
外壳高度 | 2.69 mm |
封装 | Reel |
尺寸 | 6.1 mm L x 2.69 mm W |
工作温度范围 | - 55 C to + 125 C |
工厂包装数量 | 1500 |
电压额定值AC | 125 V |
电压额定值DC | 125 V |
电流额定值 | 750 mA |
电阻 | 360.2 mOhms |
类型 | Nano Standard Fuse and Clip Assembly |
系列 | 157T |
Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination 157T Series – Standard Nano2® Fuse and Clip Assembly RoHS PS E Description The 157T Series Fuse/Clip assembly is a small, square, Time-Lag, surface mount fuse that is assembled in surface mountable fuse clips. The unique time delay feature of this fuse design helps solve the problem of nuisance “opening” by accommodating inrush currents that normally cause a fast-acting fuse to open. The fuse clip and pre-installed fuse combination can be automatically placed in PC Board in one efficient manufacturing operation. It permits quick and easy replacement of fuses without performing desoldering process, even in the field and without exposing the PC Board to detrimental effects of rework solder heat. Agency Approvals Features Agency Agency File Number Ampere Range • Surface Mountable, • Easily replaceable on PC Time-Lag Fuse. Board (Field Replaceable) E14721 0.375A ~ 5A • Fully compatible with • RoHS Compliant and PS NBK030205-E10480B 1A - 5A E RoHS/Pb-Free solder Halogen-free alloys and higher • Available in ratings of temperature profiles 0.375 ~ 5 Amperes. associated with leadfree Electrical Characteristics for Series assembly. % of Ampere Rating % of Ampere Rating Opening Time at 25ºC Applications 100% 0.375A ~ 5A 4 hours, Minimum • Instrumentations • Telecommunications 1 sec. Minimum, 200% 0.375A ~ 5A 60 secs. Maximum • Base Stations 0.20 secs. Minimum, 300% 0.375A ~ 5A 3.00 secs. Maximum Additional Information 0.02 secs. Minimum, 800% 0.375A ~ 5A 0.10 secs. Maximum Datasheet Resources Samples Electrical Specifications by Item Interrupting Nominal Agency Approvals Ampere Max Voltage Fuse Nominal Cold Amp Code Rating Melting Rating (A) Rating (V) (A) Furnished Resistance (Ohms) I2t (A2sec) PES 0.375 0.375 125 454.375 1.2214 0.101 X - 0.50 0.500 125 454.5 0.7047 0.240 X - 0.75 0.750 125 454.75 0.3602 0.904 X - 1.00 1.0 125 454001.0 0.2245 1.98 X X 1.50 1.5 125 45401.5 0.0934 3.65 X X 2.00 2.0 125 50A @ 125VAC/VDC 454002.0 0.0629 8.20 X X 2.50 2.5 125 45402.5 0.0452 15.0 X X 3.00 3.0 125 454003.0 0.0342 20.16 X X 3.50 3.5 125 45403.5 0.0226 26.53 X X 4.00 4.0 125 454004.0 0.0188 34.40 X X 5.00 5.0 125 454005.0 0.0138 53.72 X X 1. Cold resistance measured at less than 10% of rated current at 23ºC. 2. I2t values stated for 8ms opening time. 3. Agency Approval Table Key: X=Approved or Certified, P=Pending and Blank=Not Approved 4. Have special electrical characteristic needs? Contact Littelfuse to learn more about application specific options © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/20
Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination Temperature Re-rating Curve Average Time Current Curves 100 .375A .50A .75A1.0A1.5A 2.0A2.5A3.0A3.5A4A5A 10 S D N O C E S N 1 E I M TI 0.1 Note: 1. Rerating depicted in this curve is in addition to the standard derating of 25% for continuous operation. 0.01 0.001 0.1 1 10 100 CURRENT IN AMPS Soldering Parameters Reflow Condition Pb – Free assembly t P - Temperature Min (T ) 150°C T s(min) P Critical Zone Pre Heat - Temperature Max (T ) 200°C Ramp-up TL to TP s(max) - Time (Min to Max) (ts) 60 – 180 secs TL t Average ramp up rate (Liquidus Temp (TL) to peak 5°C/second max eruTS(max) L T to T - Ramp-up Rate 5°C/second max ta S(max) L r Ramp-down e - Temperature (T) (Liquidus) 217°C p Preheat Reflow L mTS(min) - Temperature (tL) 60 – 150 seconds eT tS Peak Temperature (T) 250+0/-5 °C P Time within 5°C of actual peak Temperature (t) 20 – 40 seconds 25 p time to peak temperature Ramp-down Rate 5°C/second max (t 25ºC to peak) Time Time 25°C to peak Temperature (T) 8 minutes Max. P Do not exceed 260°C © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/20
Surface Mount Fuses NANO2® > 157T Fuse and Holder Combination Product Characteristics Body: Ceramic Operating Temperature -55ºC to 125ºC with proper derating Materials Cap: For 0.375A ~ 5A – Silver plated Brass MIL-STD-202, Method 107, Test Condition B Thermal Shock Clip Plating: Matte Tin (5 cycles -65ºC to +125ºC) Product Marking Body: Brand Logo, Current Rating, “T” for Time-Lag Vibration MIL-STD-202, Method 201 (10-55 Hz) Force applied at fuse center, perpendicular to the long Moisture Resistance MIL-STD-202, Method 106, 10 cycles Clip Retention axis (@0.75 lbs. MIN) MIL-STD-202, Method 101, Test Condition B (48 Salt Spray/ Atmosphere MIL-STD-202, Method 208 / IPC/ EIA / JEDEC hrs.), 5% NaCl in De-ionized Water Solderability J-STD-002, Test Condition A MIL-STD-202, Method 213, Test Condition I (100 Shock MIL –STD-202, Method 103 @ 85ºC / 85%RH, 1000 G’s peak for 6 milliseconds) Humidity Test hours Resistance to MIL-STD-202, Method 215 (3 solvent types) Solvents Dimensions Part Numbering System 6.50 ± 0.20 [0.256] 6.10 0157 005. D R T [0.240] [02..16096] Series Time-Lag Fuse LF T 3 .[70 ±.1 406.1]3 [02.1.6096] 1 A Packing Option Amp code R = Tape and Reel [01.0.4557] [03.1.7406] Quantity Code D = 1500 pcs 3.9[00 .±1 504.1]3 [03.1.4304] Packaging Packaging Packaging Quantity & 2.[500. 0±9 80].2 Option Specification Quantity Packaging Code Tape and Reel Surface Mount 1500 DRT "A" "B" 0.10 7.26 [0.29] 2.46 3.00 [0.10] [0.12] 2.40 [0.09] PCB Recommendation for Thermal Management 1. Minimum Copper Layer Thickness = 100um 2. Minimum Copper Trace Width = 10mm Note: Alternate methods of thermal management may be used. In such cases, under normal operations, the maximum temperature of the fuse body should not exceed 80ºC in a 25ºC ambient environment. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/20/20